The present invention relates to a hydrosilylation-curable silicone composition comprising: a maleate compound, and a hydrosilylation inhibitor other than the maleate compound, wherein the content of the maleate compound is in an amount of 50 to 6,000 ppm and the content of the hydrosilylation inhibitor is in an amount of 200 to 20,000 ppm, with respect to the present composition in terms of mass units, respectively. The hydrosilylation-curable silicone composition exhibits good storage stability, and can be cured to form a cured product that suffers no surface wrinkling.

The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I)
-A.sub.n-RSiXYZ(I),
wherein A is a divalent bonding group containing at least one heteroatom, R is selected from divalent hydrocarbon residues having 1 to 12 carbon atoms, X, Y, Z are, independently of one another, selected from the group consisting of a hydroxyl group and C.sub.1 to C.sub.8 alkyl, C.sub.1 to C.sub.8 alkoxy, and C.sub.1 to C.sub.8 acyloxy groups, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C.sub.1 to C.sub.8 alkoxy or C.sub.1 to C.sub.8 acyloxy groups, and n is 0 or 1; and b) at least one compound of the general formula (II) ##STR00001##
wherein R is same or different and is, independently from one another, selected from the group consisting of a hydrogen atom and hydrocarbon residues having 1 to 12 carbon atoms, and Ar is selected from aryl groups, and adhesive, sealant, or coating materials comprising the composition and use thereof.

The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1):

##STR00001##

wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2):

##STR00002##

wherein Y is a bond, a C.sub.1-6 alkylene group, etc.;

R.sup.1 is the same or different, and is a C.sub.1-18 alkyl group, etc.,

R.sup.2 is the same or different, and is a C.sub.1-18 alkylene group, etc.,

R.sup.3 is the same or different, and is a C.sub.1-18 alkyl group, etc., and

n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.

A two part curable composition comprising organosiloxane polymer; water; an organosilane such as hexamethyldisilazane (HMDS) or vinyltrimethoxysilane; crosslinker; adhesion promoter and catalyst; and optionally comprising plasticizer; colorant and filler. The first part can comprise organosiloxane polymer and water. The second part can comprise crosslinker; adhesion promoter and catalyst. Either or both parts can optionally further comprise an organosilane such as hexamethyldisilazane (HMDS) or vinyltrimethoxysilane; plasticizer; colorant and filler. The mixed parts have a low viscosity allowing injection under low pressure. Cured reaction products of the two part curable organosiloxane composition has good adhesion to metallic sealing surfaces and good resistance engine oil and other automotive fluids. Cured reaction products of the two part curable organosiloxane composition can surprisingly retain physical properties after long-term exposure to temperatures between 200 C. and 250 C. and can retain physical properties after exposure to temperatures between 250 C. to 300 C. for short periods.

Provided is a thermally conductive silicone composition which need not be stored with cooling or freezing and needs neither a heating nor a cooling step during mounting to bring about a high production efficiency and which gives cured objects that, during heating or cold/heat cycling, can be inhibited from suffering a change in hardness or a deterioration caused by cracking or dislocation. The composition includes a conventional condensation-curable silicone composition, and is cured by a combination of the condensation and curing with an organic peroxide.

There is provided herein a composition comprising (a) a mercapto-functional silicon compound having the general Formula (I): ##STR00001##
and a reactive resin containing at least one epoxy and/or (meth)acrylate group. There is also provided a silylated resin resulting from the reaction product of mercapto-functional silicon compound (a) and reactive resin contain at least one epoxy and/or (meth)acrylate groups.

A photocurable resin composition maintains adhesion to an electrolyte membrane which is a hard-to-bond material even after being immersed in warm water. A photocurable resin composition includes the following ingredients (A) to (C): ingredient (A): a polymer having one or more (meth)acryloyl groups and having a polyisobutylene skeleton containing a [CH.sub.2C(CH.sub.3).sub.2]unit, ingredient (B): a photoradical polymerization initiator, and ingredient (C): a mixture at least containing, as an ingredient (C1), a compound selected from silicone oligomers each having one or more alkoxy groups and one or more (meth)acryloyl groups and silane monomers each having one or more alkoxy groups and one or more isocyanate groups, and as an ingredient (C2), a compound selected from silicone oligomers each having one or more alkoxy groups and one or more epoxy groups and silicone oligomers each having one or more alkoxy groups and one or more phenyl groups.

The invention relates to curable compositions based on polyorganosiloxanes with special silicon-containing terminal groups, a special capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention furthermore relates to the use thereof.

Compositions of curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound, a method for preparing curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound, as well as the use of curable silicone rubber compounds containing at least one metal siloxane-silanol(-ate) compound as a sealant, an adhesive material, a potting compound and/or a coating agent.

A curing reactive silicone gel is provided. The curing reactive silicone gel is obtained by primarily curing a composition containing the following components in a gel form and further having secondarily curing reactivity. (A) an organopolysiloxane having at least two curing reactive groups in one molecule; (B) optionally, an organohydrogenpolysiloxane; and (C) a curing agent.