Patent classifications
C09K3/1427
ABRASIVE ARTICLES AND METHODS FOR FORMING SAME
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form a compacted layer, binding at least a portion of the compacted layer, and repeating the steps of forming, compacting, and binding to form a green body abrasive article.
Magnetic Slurry for Highly Efficiency CMP
A chemical-mechanical polishing (CMP) system includes a head, a polishing pad, and a magnetic system. The slurry used in the CMP process contains magnetizable abrasives. Application and control of a magnetic field, by the magnetic system, allows precise control over how the magnetizable abrasives in the slurry may be drawn toward the wafer or toward the polishing pad.
Abrasive particles having complex shapes and methods of forming same
An abrasive grain is disclosed and may include a body. The body may define a length (l), a height (h), and a width (w). In a particular aspect, the length is greater than or equal to the height and the height is greater than or equal to the width. Further, in a particular aspect, the body may include a primary aspect ratio defined by the ratio of length:height of at least about 2:1. The body may also include an upright orientation probability of at least about 50%.
BONDED ABRASIVE ARTICLE INCLUDING ELONGATE SHAPED ABRASIVE PARTICLES
A bonded abrasive article includes elongate shaped abrasive particles. The elongate shaped abrasive particles comprise an elongate shaped ceramic body having opposed first and second ends joined to each other by at least two longitudinal sidewalls. At least one of the at least two longitudinal sidewalls is concave along its length. At least one of the first and second ends is a fractured surface.
Molten alumina-zirconia grains
A fused grain having the following chemical composition in percent by weight in relation to the oxides: ZrO.sub.2: 16% to 30%, provided that HfO.sub.2<2%, Al.sub.2O.sub.3: percentage needed to bring the total to 100%, Cr.sub.2O.sub.3: ≥0.2%, TiO.sub.2: ≥0.5%, Cr.sub.2O.sub.3+TiO.sub.2: <7%, other elements: <3%, provided that SiO.sub.2+CaO+MgO<1.5%.
ABRASIVE ARTICLES AND METHODS OF FORMING SAME
A coated abrasive article comprising a substrate and a plurality of abrasive particles having an average solidity of at least 0.87 and less than 0.97, wherein each of the abrasive particles of the plurality of abrasive particles comprises a body and striations extending along an exterior surface of the body in a direction of a length of the body. Further directed to a plurality of extruded shaped abrasive particles comprising an average solidity of at least 0.87.
ABRASIVE ARTICLES AND METHODS OF FORMING SAME
A coated abrasive article includes a substrate and a plurality of abrasive particles overlying the substrate, and the plurality of abrasive particles including tapered abrasive particles having a taper fraction standard deviation of at least 0.025 and not greater than 0.090.
ABRASIVE ARTICLES AND METHODS OF FORMING SAME
A coated abrasive article includes a substrate and a plurality of abrasive particles overlying the substrate, wherein at least 5% of the plurality of abrasive particles is tooth-shaped abrasive particles.
ABRASIVE PARTICLES HAVING COMPLEX SHAPES AND METHODS OF FORMING SAME
An abrasive grain is disclosed and may include a body. The body may define a length (l), a height (h), and a width (w). In a particular aspect, the length is greater than or equal to the height and the height is greater than or equal to the width. Further, in a particular aspect, the body may include a primary aspect ratio defined by the ratio of length:height of at least about 2:1. The body may also include an upright orientation probability of at least about 50%.
Magnetic slurry for highly efficiency CMP
A chemical-mechanical polishing (CMP) system includes a head, a polishing pad, and a magnetic system. The slurry used in the CMP process contains magnetizable abrasives. Application and control of a magnetic field, by the magnetic system, allows precise control over how the magnetizable abrasives in the slurry may be drawn toward the wafer or toward the polishing pad.