Proposed are a CMP slurry composition and a polishing method using the same. The CMP slurry composition in which the zeta potential of colloidal silica serving as an abrasive is properly controlled and metal impurities are removed from the colloidal silica and to a polishing method using the same. The CMP slurry composition is configured to improve a polishing performance for a silicon oxide film, minimize scratches on a finished surface, and to enable adjustment of a content ratio of an abrasive and an additive in the composition, thereby enabling adjustment of a polishing selectivity among a silicon oxide film, a silicon nitride film, and a polysilicon film.

This invention provides core shell silica particles, wherein each core shell silica particle comprises a silica core, and a surface of the silica core etched with group I metal silicate. These core shell silica particles have high surface charge density and anti-bacterial activity. Also provided are compositions comprising core shell silica particles, process of making the core shell silica particles and methods of reducing or inhibiting bacterial activity by administering the core shell silica particles or compositions thereof.

An abrasive structure for abrading work pieces, comprising: a composite cluster formed of abrasives of two or more sizes, wherein a larger size abrasive forms a core of the abrasive structure with a smaller size abrasive attached on an exterior of the core.

A polishing agent for a synthetic quartz glass substrate, containing polishing particles and water includes ceria particles as base particles, and composite oxide particles of cerium and at least one rare earth element selected from trivalent rare earth elements other than cerium are supported on surfaces of the base particles. This provides a polishing agent for a synthetic quartz glass substrate, the polishing agent having high polishing rate and being capable of sufficiently reducing generation of defects due to polishing.

Present invention provides Chemical Mechanical Planarization Polishing (CMP) compositions for Shallow Trench Isolation (STI) applications. The CMP compositions contain ceria coated inorganic oxide particles as abrasives, such as ceria-coated silica particles; chemical additive selected from the group consisting of an organic acetylene molecule containing an acetylene bond and at least two or multi ethoxylate functional groups with terminal hydroxyl groups, an organic molecule with at least two or multi hydroxyl functional groups in the same molecule, and combinations thereof; water soluble solvent; and optionally biocide and pH adjuster; wherein the composition has a pH of 2 to 12, preferably 3 to 10, and more preferably 4 to 9.

A method of forming a ceramic-coated proppant, including receiving a proppant or particle and coating the proppant or particle with ceramic to give a ceramic coating on the proppant or particle. A method of hydraulic fracturing a geological formation with the ceramic-coated proppant.

An abrasive particle having a body and a coating overlying the body, the coating including an amorphous material and at least one filler contained within the amorphous material. The abrasive particle may be included in a fixed abrasive article.

Provided are a composite abrasive, a method of preparing same, polishing slurry including same, and a method of manufacturing a semiconductor device using the polishing slurry, the composite abrasive including a host material and abrasive particles protruding from the surface of the host material. The host material may have a Mohs hardness smaller than a Mohs hardness of the abrasive particles. The host material may have a two-dimensional planar structure and/or a layered structure. A binding force between the host material and the abrasive particles may be greater than or equal to about 200 nN.

A super-abrasive grain comprises a body composed of cubic boron nitride or diamond, and a coating film including aluminum and oxygen and coating at least a portion of a surface of the body of the abrasive grain.

According to one embodiment, a method of making an abrasive article is disclosed. The method can comprise: providing a surface; disposing magnetizable abrasive particles on the surface; and varying a magnetic field relative to the magnetizable abrasive particles to impart a non-random orientation and/or alignment to the magnetizable abrasive particles relative to the surface.