Water-soluble refill dose articles have a water-soluble film defining a first compartment enclosing a concentrated cleanser composition. The concentrated liquid cleanser composition comprises an anionic surfactant, 0.1% by weight to 10% by weight water, and 20% or less by weight glycol. The anionic surfactant contributes to the % by weight water, and adding the article to water at a 1:1 to 1:20 ratio defines a cleanser volume and produces a liquid cleanser that is dispensable through a pump that forms foamed cleanser and has a viscosity within a range of 1 cps to 1000 cps. Kits having a dispenser and the water soluble refill dose article are disclosed that have a pump that can foam the liquid cleanser.

Water-soluble refill dose articles for forming a cleanser have a water-soluble film defining a first compartment enclosing a first composition and a second compartment enclosing a second composition, which are individual separate articles or are part of an integral article. The first composition has a rheology modifier, a first surfactant, 10% or less by weight water, 20% or less by weight glycol, and the first surfactant does not activate the rheology modifier. The second compartment has an alkaline substance that when mixed with the first composition and water activates the rheology modifier to increase the viscosity of a resulting cleanser and 10% or less by weight water. When the article is diluted in water at a 1:1 to 1:20 ratio, it produces a cleanser having a viscosity within a range of 2000 cps to 50,000 cps.

Water-soluble refill dose articles have a water-soluble film defining a first compartment enclosing a concentrated cleanser composition. The concentrated liquid cleanser composition comprises an anionic surfactant, 0.1% by weight to 10% by weight water, and 20% or less by weight glycol. The anionic surfactant contributes to the % by weight water, and adding the article to water at a 1:1 to 1:20 ratio defines a cleanser volume and produces a liquid cleanser that is dispensable through a pump that forms foamed cleanser and has a viscosity within a range of 1 cps to 1000 cps. Kits having a dispenser and the water soluble refill dose article are disclosed that have a pump that can foam the liquid cleanser.

Water-soluble refill dose articles for forming a cleanser have a water-soluble film defining a first compartment enclosing a first composition and a second compartment enclosing a second composition, which are individual separate articles or are part of an integral article. The first composition has a rheology modifier, a first surfactant, 10% or less by weight water, 20% or less by weight glycol, and the first surfactant does not activate the rheology modifier. The second compartment has an alkaline substance that when mixed with the first composition and water activates the rheology modifier to increase the viscosity of a resulting cleanser and 10% or less by weight water. When the article is diluted in water at a 1:1 to 1:20 ratio, it produces a cleanser having a viscosity within a range of 2000 cps to 50,000 cps.

A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and particles from a microelectronic device having said particles and contaminants thereon. The removal compositions include at least one at least one organic additive; at least one metal chelating agent; and at least one polyelectrolyte. The composition achieves highly efficacious removal of the particles and CMP contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, and metal containing layers such as tungsten-containing layers.

A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and particles from a microelectronic device having said particles and contaminants thereon. The removal compositions include at least one at least one organic additive; at least one metal chelating agent; and at least one polyelectrolyte. The composition achieves highly efficacious removal of the particles and CMP contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, and metal containing layers such as tungsten-containing layers.

Disclosed are compounds of formula (I)

(R.sup.1OOC).sub.aR.sup.2(OH).sub.cCOO(C.sub.nH.sub.2nO).sub.mOCR.sup.3(OH).sub.d(COOR.sup.4).sub.b(I)

wherein R.sup.1 and R.sup.4 independently of one another are hydrogen, a metal cation, an ammonium cation, C.sub.1-C.sub.6-alkyl, cycloalkyl with three to nine ring carbon atoms, aryl with five to ten ring carbon atoms, aryl that is substituted with one or two alkyl groups, aryl that is connected via an alkylene group with the carboxyl group, (C.sub.nH.sub.2nO).sub.mH or OR.sup.2(COOR1).sub.a+1,
R.sup.2 and R.sup.3 independently of one another are aliphatic hydrocarbon residues with one to eight carbon atoms,
a and b independently of one another are integers from 1 to 4,
c is an integer from 0 to 4,
d is an integer from 1 to 4,
n is 2, 3 or 4, and
m is 1, 2, 3 or 4, with the proviso that
R.sup.1 and R.sup.4 may be different within a molecule within the given definitions.

These compounds are characterized by a very good complexation power for metal cations and can be used in detergents and cleaning agents, in oil extraction and for water softening.

Disclosed are compounds of formula (I)

(R.sup.1OOC).sub.aR.sup.2(OH).sub.cCOO(C.sub.nH.sub.2nO).sub.mOCR.sup.3(OH).sub.d(COOR.sup.4).sub.b(I)

wherein R.sup.1 and R.sup.4 independently of one another are hydrogen, a metal cation, an ammonium cation, C.sub.1-C.sub.6-alkyl, cycloalkyl with three to nine ring carbon atoms, aryl with five to ten ring carbon atoms, aryl that is substituted with one or two alkyl groups, aryl that is connected via an alkylene group with the carboxyl group, (C.sub.nH.sub.2nO).sub.mH or OR.sup.2(COOR1).sub.a+1,
R.sup.2 and R.sup.3 independently of one another are aliphatic hydrocarbon residues with one to eight carbon atoms,
a and b independently of one another are integers from 1 to 4,
c is an integer from 0 to 4,
d is an integer from 1 to 4,
n is 2, 3 or 4, and
m is 1, 2, 3 or 4, with the proviso that
R.sup.1 and R.sup.4 may be different within a molecule within the given definitions.

These compounds are characterized by a very good complexation power for metal cations and can be used in detergents and cleaning agents, in oil extraction and for water softening.

A system and method for a metal sequestration composition comprising combining a galactaric salt or galactaric acid with a metalloid oxyanion, and an alkali compound. The system and method enable the production of a metal sequestration composition that either alone or in combination with other functional components (e.g. surfactants, solvents, pH modifiers) provide water treatment or cleaning compositions.

A system and method for a metal sequestration composition comprising combining a galactaric salt or galactaric acid with a metalloid oxyanion, and an alkali compound. The system and method enable the production of a metal sequestration composition that either alone or in combination with other functional components (e.g. surfactants, solvents, pH modifiers) provide water treatment or cleaning compositions.