A dissolvable sheet having a water-soluble substrate, and one or more cleaning actives disposed uniformly throughout the water-soluble substrate. The water-soluble substrate is formed from a first substrate builder comprising polyvinyl alcohol, a second substrate builder, such as starch, and sodium laurylglucosides hydroxypropylsulfonate, and is sized and shaped to form a sheet, and hold a premeasured amount of the cleaning active. The substrate dissolves when contacted with a sufficient amount of water, thereby releasing the cleaning active into the water, which also dissolves in the water. A method of making the dissolvable sheet is also disclosed.

Aqueous surfactant compositions containing an alpha-sulfo fatty acid disalt, a sulfoketone, a betaine, a soap, an inorganic salt of sulfuric acid, and water. The compositions have good foaming ability, a pleasant sensory feel to the foam, good skin compatibility, and are suitable for cosmetic products, detergents, and cleaners.

An aqueous cleaning composition for removing paraffin, asphaltene, and scale deposits or plugs from a hydrocarbon system. The aqueous cleaning composition is formed of a cleaning composition and an aqueous liquid. The cleaning composition contains about 21-33% of a silicate, about 20-35% of a peroxygen, about 3-15% of a phosphate, about 15-40% of a carbonate or bicarbonate, about 1-10% of a chelating agent, about 1-5.5% of a surfactant combination. In one embodiment, the surfactant combination includes a surfactant polymer mixture containing a block polymer and a reverse polymer, and a wetting agent containing a sulfonated material or an ethoxylated alcohol.

An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present. The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.

An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present. The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.

Detergent compositions are disclosed which provide superior cleaning and removal of proteinaceous and starchy soils. Applicants have discovered a surfactant package which acts to enhance and improve the performance of enzymes such as proteases and/or amylases. Compositions for pot and pan warewash detergents and soaks are disclosed, as well as their use in manual or dish machine cleaning.

An aqueous cleaning composition for removing paraffin, asphaltene, and scale deposits or plugs from a hydrocarbon system. The aqueous cleaning composition is formed of a cleaning composition and an aqueous liquid. The cleaning composition contains about 21-33% of a silicate, about 20-35% of a peroxygen, about 3-15% of a phosphate, about 15-40% of a carbonate or bicarbonate, about 1-10% of a chelating agent, about 1-5.5% of a surfactant combination. In one embodiment, the surfactant combination includes a surfactant polymer mixture containing a block polymer and a reverse polymer, and a wetting agent containing a sulfonated material or an ethoxylated alcohol.

The rinsing composition for a silicon wafer of the present invention is a rinsing composition for a silicon wafer containing a water-soluble polymer and water. The water-soluble polymer exhibits a difference (ZZ.sub.0) between a zeta-potential Z of a water-soluble polymer-containing silica aqueous dispersion (aqueous dispersion S) and a zeta-potential Z.sub.0 of a silica aqueous dispersion (aqueous dispersion S.sub.0) of 25 mV or less. The aqueous dispersion S consists of the water-soluble polymer, silica particles, water, and as needed, hydrochloric acid or ammonia, and has a concentration of the water-soluble polymer of 0.1 mass %, a concentration of the silica particles of 0.1 mass %, and a pH of 7.0 at 25 C. The aqueous dispersion S.sub.0 consists of silica particles, water, and as needed, hydrochloric acid or ammonia, and has a concentration of the silica particles of 0.1 mass %, and a pH of 7.0 at 25 C.

The rinsing composition for a silicon wafer of the present invention is a rinsing composition for a silicon wafer containing a water-soluble polymer and water. The water-soluble polymer exhibits a difference (ZZ.sub.0) between a zeta-potential Z of a water-soluble polymer-containing silica aqueous dispersion (aqueous dispersion S) and a zeta-potential Z.sub.0 of a silica aqueous dispersion (aqueous dispersion S.sub.0) of 25 mV or less. The aqueous dispersion S consists of the water-soluble polymer, silica particles, water, and as needed, hydrochloric acid or ammonia, and has a concentration of the water-soluble polymer of 0.1 mass %, a concentration of the silica particles of 0.1 mass %, and a pH of 7.0 at 25 C. The aqueous dispersion S.sub.0 consists of silica particles, water, and as needed, hydrochloric acid or ammonia, and has a concentration of the silica particles of 0.1 mass %, and a pH of 7.0 at 25 C.

Aqueous surfactant compositions containing an alpha-sulfo fatty acid disalt, a sulfoketone, a betaine, a soap, an inorganic salt of sulfuric acid, and water. The compositions have good foaming ability, a pleasant sensory feel to the foam, good skin compatibility, and are suitable for cosmetic products, detergents, and cleaners.