The invention relates to an aqueous alkaline cleaner solution for glass filler removal comprising: (a) at least one non-ionic surfactant selected from the group consisting of saturated branched or unbranched C5 to C12 carboxylic acid or salt thereof, wherein the concentration of the (a) at least one surfactant is from 0.9 to 1.7 g/L; (b) at least one surfactant selected from the group consisting of saturated branched or unbranched C5 to C12 alkyl having a negatively charged group selected from sulfate, sulfite, sulfonate, phosphate, phosphite and carbonate, and saturated C3-C8 alkyl amino carboxylate; (c) at least one compound having at least one hydroxyl group and at least one COC group selected from the group consisting of alkoxylated C5-C12 alkanol and glycosidic C5-C12 alkanol; and (d) alkali metal hydroxide, wherein the concentration of the (d) alkali metal hydroxide is from 65 to 200 g/L; and a method for use.

The present invention relates to a surface treatment composition including: at least one water-soluble polymer selected from the following Group A; at least one anionic surfactant selected from the following Group B; and water.

Group A: water-soluble polysaccharides, polyvinyl alcohols and derivatives thereof, and polyvinylpyrrolidones and derivatives thereof (with the proviso that compounds included in the following Group B are excluded)

Group B: compounds having a sulfonic acid (salt) group, compounds having a sulfuric acid ester (salt) group, compounds having a phosphonic acid (salt) group, compounds having a phosphoric acid (salt) group, and compounds having a phosphinic acid (salt) group. According to the present invention, a surface treatment composition capable of efficiently removing foreign bodies, such as particles and organic residues, remaining on the surface of an object to be polished after polishing is provided.

Disclosed is a cleaning composition for removing organic deposits. The cleaning composition comprises a salt of the monoconjugate base of an aliphatic phosphate monoester and a salt of the conjugate base of an aliphatic phosphate diester in a hydrocarbon-based solvent system. The cleaning composition has been found to be effective in use together with an aqueous phase in mobilizing or dissolving organic deposits, without forming persistent emulsions, suspensions or the like. Accordingly following its use phase separation between a hydrocarbon-based phase and an aqueous phase occurs following a settling period.

A composition for solubilizing polystyrene and/or styrene copolymers, including a first component and a second component, in which the first component is selected from solvents having a flashpoint of at least 25? C., and the second component is soluble in the first component. The use of the composition as a cleaning composition for the removal of polystyrene and/or styrene copolymers from a surface and a method for the removal of polystyrene and/or styrene copolymers from a surface.

A solution having improved stain removing properties on hard surfaces, carpets and fabrics, that is easier to handle (stored or transported at lower temperatures and less corrosive) and that is environmentally friendly. The stain removing solution includes the following components: a surfactant selected from the group consisting of alcohol ethoxylates, alkyl sulfates, alkyl ether sulfates, alpha olefin sulfonates, alkyl phosphates, alkyl amidopropyl betaines, alkyl betaines, amphoacetates, amphoproprionates, amphosulfonates, amine oxides, alkanolamides, sulfosuccinates, and sultaines, a hydrotrope, and a solvent. The surfactant is preferably an alcohol ethoxylate. The hydrotrope is preferably lauramine oxide. The solvent is preferably a dibasic ester or a glycol ether. The solution may further comprise a diluent, a mild acid, and/or a preservative. A mild acid can be added to lower the pH of the solution.

A treatment liquid is a treatment liquid for a semiconductor device, and contains a fluorine-containing compound and a metal ion.

The present invention is to provide a means with which foreign matters remaining on a surface of a polished object to be polished can be sufficiently removed. The present invention relates to a composition for surface treatment for a polished object to be polished, including: a (co)polymer containing a structural unit A having a phosphonic acid group and a divalent (poly)oxyhydrocarbon group or a salt thereof; and water, wherein a content of the structural units A exceeds 50% by mole relative to the total structural units forming the (co)polymer.

The present invention provides a surfactant composition which includes a surfactant at a high concentration, while having fluidity over a wide concentration range. A surfactant composition according to the present invention contains the components A, B, C and D described below, and is configured such that: the total content of the components A, B and C is from 30% by mass to 80% by mass (inclusive); the mass ratio of the total content of the components A and B to the content of the component C, namely (A+B)/C is from 20/80 to 80/20; and the mass ratio of the content of the component A to the content of the component B, namely A/B is from 98/2 to 45/55. A: an internal olefin sulfonic acid and/or a salt thereof; B: an anionic surfactant other than the component A; C: a nonionic surfactant; D: water

The invention relates to an emulsion containing or consisting of (A) 40.00 to 97.98 wt. % of at least one hydrocarbon, (B) 2.00 to 59.98 wt. % of water or an aqueous solution of a salt which does not fall under the following definition according to (C) and (C) 0.02 to 8.00 wt. % of a salt of an amino amide of a fatty acid, containing at least one primary, secondary or tertiary amino group, and an acid component of general formula (I)

##STR00001## in which R.sup.1 is a linear or branched, saturated or mono-unsaturated or poly-unsaturated hydrocarbon radical with 1 to 40 C atoms, R.sup.2 is an alkylene radical or arylalkylene radical with 2 to 20 C atoms and X is a radical which contains at least one acid group, m=0 or 1, n=1 to 30, wherein the weight proportions of components (A), (B) and (C) relate to the sum of the masses of these components and this is 100 wt. %. The invention also relates to a method for the production of the emulsion, to an oil-based drilling mud and to a method for creating and stabilizing a drill hole.

The invention relates to a composition intended for the cleaning of contaminants and flux residues on electronic assemblies, particularly solder cream residue. Said composition comprises: from 20% to 99.5% by weight of a main solvent consisting of at least a C6-C15 glycol ether, and optionally a secondary solvent, from 0.5% to 20% by weight of a selected acid additive which is a phosphoric acid ester. The invention also relates to a defluxing product incorporating said composition, as well as to the defluxing methods using these products