The present invention relates to novel sulfoperoxycarboxylic acid compounds, and methods for making and using them. The sulfoperoxycarboxylic compounds of the invention are storage stable, water soluble and have low to no odor. Further, the compounds of the present invention can be formed from non-petroleum based renewable materials. The compounds of the present invention can be used as antimicrobials, and bleaching agents. The compounds of the present invention are also suitable for use as coupling agents.

A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of alkali hydroxides, alkaline earth metal hydroxides, and tetramethylammonium hydroxide. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

The present invention relates to novel sulfoperoxycarboxylic acid compounds, and methods for making and using them. The sulfoperoxycarboxylic compounds of the invention are storage stable, water soluble and have low to no odor. Further, the compounds of the present invention can be formed from non-petroleum based renewable materials. The compounds of the present invention can be used as antimicrobials, and bleaching agents. The compounds of the present invention are also suitable for use as coupling agents.

A disinfecting solution includes hydrogen peroxide at a concentration of from about 1.5% w/w to 8% w/w; at least one readily biodegradable anionic surfactant in a concentration of from about 10% w/w to about 25% w/w; at least one of salicylic acid and salts thereof, in a concentration of from about 1% w/w to about 8% w/w; at least one chelating agent in a concentration of from about 0.005% w/w to about 10% w/w; and at least one low-corrosive non-surfactant sulfonic acid selected from benzenesulfonic acid, benzene disulfonic acid, xylene sulfonic acid, toluene sulfonic acid, cumene sulfonic acid, sulfosalicylic acid, naphthalene mono- or di-sulfonic acid, methane sulfonic acid, and isethionic acid in a concentration of from about 1% w/w to about 15% w/w. The solution is free of acetic acid, furoic acid, phenylacetic acid, cationic surfactants, amphoteric surfactants, aromatic alcohols, halogen acids, phenols, peracid activators, bleaches, and (optionally) benzoic acid.

A softening agent includes: a component (A) which is a compound represented by formula (1); and a component (B) which is an alcohol with 6 or more carbons. R.sup.1 and R.sup.2 each independently represent a hydrocarbon group with 6 or more and 24 or less carbons, with the proviso that at least one of R.sup.1 and R.sup.2 is a hydrocarbon group having a branch chain; A.sup.1O and A.sup.2O each independently represent an alkyleneoxy group with 2 or more and 4 or less carbons; x1 and x2 each independently represent an average number of added moles, which is a number of 0 or more and 10 or less; and M is a cation.

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The present invention relates to novel sulfoperoxycarboxylic acid compounds, and methods for making and using them. The sulfoperoxycarboxylic compounds of the invention are storage stable, water soluble and have low to no odor. Further, the compounds of the present invention can be formed from non-petroleum based renewable materials. The compounds of the present invention can be used as antimicrobials, and bleaching agents. The compounds of the present invention are also suitable for use as coupling agents.

Solid rinsing, cleaning and/or sanitizing compositions for various applications are provided. In particular, solid compositions include a complex of urea and an acid having desirable storage stability previously unavailable in solid urea/acid compositions. Stable solid compositions are disclosed and methods of making the same to overcome conventional limitations associated with forming kinetically and thermodynamically stable solids that utilize urea/acid compositions.

Solid rinsing, cleaning and/or sanitizing compositions for various applications are provided. In particular, solid compositions include a complex of urea and an acid having desireable storage stability previously unavailable in solid urea/acid compositions. Stable solid compositions are disclosed and methods of making the same to overcome conventional limitations associated with with forming kinetically and thermodynamically stable solids that utilize urea/acid compositions.

The present invention relates to novel sulfoperoxycarboxylic acid compounds, and methods for making and using them. The sulfoperoxycarboxylic compounds of the invention are storage stable, water soluble and have low to no odor. Further, the compounds of the present invention can be formed from non-petroleum based renewable materials. The compounds of the present invention can be used as antimicrobials, and bleaching agents. The compounds of the present invention are also suitable for use as coupling agents.

A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of alkali hydroxides, alkaline earth metal hydroxides, and tetramethylammonium hydroxide. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.