The present invention is a contact lens treatment solution containing the following copolymer A and copolymer B in a ratio of A/B=40/1 to 5/1 (by weight). According to the present invention, there can be provided a contact lens treatment solution capable of removing dirt having adhered to contact lens surfaces, capable of improving lubricity of contact lens surfaces and capable of imparting persisting hydrophilicity to contact lens surfaces, by simple immersion treatment. Copolymer A: a copolymer obtained by copolymerization of a monomer (a) represented by formula (1) and a monomer (b) represented by formula (2), in which the copolymerization ratio of the monomer (a) to the monomer (b), a/b=7/3 to 9/1 (by mol), and having a weight-average molecular weight of 400,000 to 800,000.
Copolymer B: a copolymer obtained by copolymerization of a monomer (a) represented by the formula (1) and a monomer (b) represented by the formula (2), in which the copolymerization ratio of the monomer (a) to the monomer (b), a/b=2/1 to 8/1 (by mol), and having a weight-average molecular weight of 1,000,000 to 1,500,000.

Provided are compositions and methods for selectively etching hard mask layers and/or photoresist etch residues relative to low-k dielectric layers that are present. More specifically, the present invention relates to a composition and process for selectively etching titanium nitride and/or photoresist etch residues relative to low-k dielectric layers. Other materials that may be present on the microelectronic device should not be substantially removed or corroded by said compositions.

The invention relates to a compound of following formula (I), and also to the addition salts thereof with an organic or mineral base, the solvates such as hydrates and the mixtures thereof; to the use thereof as a surfactant, wetting agent, detergent, emulsifier, dispersant, corrosion inhibitor, plasticizer, sequestering agent, ionic liquid, stabilizer, lubricant, bitumen additive, gelling agent in oils, flotation collector for ores, adjuvant in the manufacture of plastic objects, anti-static agent, additive for fertiliser coverings and for enhanced oil recovery, and also to the compositions comprising at least one compound of formula (I) and/or a salt thereof, alone or as a mixture.

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Cleaning compositions include (a) a carrier liquid; (b) a metal citrate and/or a plurality of reagents configured to generate the metal citrate in situ; (c) one or a plurality of non-ionic surfactants; and (d) an organophosphate hydrotrope configured to increase solubility of the one or the plurality of non-ionic surfactants in the carrier liquid. Methods for cleaning engine cooling systems are described.

The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.

A composition for use in recycled food and beverage containers is disclosed. A mixture of a strong sequestrant, a weak sequestrant, a polymer, an antiscalant and a surfactant is disclosed. Methods directed to using the composition are also disclosed. A composition that cleans and also reduces the defects present on the external surface of containers during a wash cycle is disclosed. The composition may or may not have metallic salts.

Aqueous formulations comprising (A) at least one organic complexing agent selected from (A1) alkali metal salts of aminopolycarboxylic acids and (A2) polymers bearing at least two CH.sub.2N(CH.sub.2COOH)-units per molecule, partially or fully neutralized with alkali, (B) at least one salt of at least one of the following acids: nitric acid, sulphuric acid, sulphamic acid, methanesulfonic acid, C.sub.1-C.sub.2-carboxylic acids, C.sub.2-C.sub.4-hydroxymonocarboxylic acids, C.sub.2-C.sub.7-dicarboxylic acids, unsubstituted or substituted with hydroxyl, and C.sub.4-C.sub.6-tricarboxylic acids, each unsubstituted or substituted with hydroxyl, (C) at least one compound selected from (C1) phosphoric acid C.sub.2-C.sub.10-monoalkyl esters, (C2) a C.sub.3-C.sub.10-alkynol, optionally alkoxylated with one to 10 alkoxide groups per hydroxyl group, and (C3) a C.sub.4-C.sub.10-alkynediol, optionally alkoxylated with one to 10 alkoxide groups per hydroxyl group, said aqueous formulations having pH values in the range of from 7.5 to 10.

The present invention relates to methods for inactivating a lipid-enveloped virus using environmentally compatible detergents, and to methods for preparing a biopharmaceutical drug using environmentally compatible detergents. The invention also provides environmentally compatible detergents.

A first aspect relates to a particle including: (a) at least one bleaching agent including an organic peroxyacid; (b) at least one component selected from: (i) saccharides and polysaccharides, and derivatives thereof; (ii) inorganic fillers selected from the group consisting of talcs, micas, zeolites, silicates, metal oxides and clays; and (iii) linear, branched and cross-linked polymers and copolymers; (c) at least one pH reducing agent; and (d) at least one chelating agent. Further aspects relate to a process for preparing the particle, a composition or a dough including the particle, and use of the particle in a cleaning composition, a dental care composition, a hair dyeing composition or decolouriser, an antimicrobial composition or a bleach composition.

The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.