The present invention relates to a liquid composition comprising: a) at least one alcohol; b) at least one hydrocarbon or hydrocarbon mixture; c) at least one peroxide agent; d) water. The compositions of the invention possess antimicrobial and enhanced sporicidal properties.

A nonflammable solvent composition, a method of cleaning an article, and a method of depositing a material on a substrate are disclosed. The nonflammable solvent composition includes a fluorocyclopentane in which 3 to 9 hydrogen atoms have each been replaced by a fluorine atom; trans-1,2-dichloroethylene (t-DCE); and at least one organic compound, such as a C.sub.2-C.sub.6 alcohol, a C.sub.1-C.sub.6 alkane, and a C.sub.3-C.sub.6 cycloalkane. Amounts of the fluorocyclopentane, t-DCE, and the organic compound in the nonflammable composition are selected so that the composition is an azeotrope or is azeotrope-like. The method of cleaning an article includes contacting the article with the nonflammable composition via vapor degreasing or wet cleaning. The method of depositing a material on a substrate includes dissolving the material in the nonflammable solvent composition, applying the composition containing the material to the substrate, and evaporating the composition from the substrate.

This disclosure relates to a cleaning composition that contains 1) hydroxylamine, 2) an amino alcohol, 3) hexylene glycol, and 4) water.

An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present.

The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.

There is provided a method of producing silica capsules, the method comprising: adding a silica precursor to emulsified droplets in the presence of salt and alcohol to enhance silica growth around the emulsified droplets by an ion association effect, thereby forming silica capsules. Also provided are silica capsules producible by such a method.

A method is used for cleaning heat exchanger systems. The method is performed at a computer system having one or more processors and memory storing one or more programs configured for execution by the one or more processors. The method determines component percentages of a cleaning solution based, at least in part, on operational parameters of a heat exchanger system. The operational parameters include chemical composition of fluids passing through the heat exchanger system and operating temperatures of the fluids passing through the heat exchanger system. The component percentages of the cleaning solution include: (1) hydrogen peroxide, 2-90 wt. %; (2) a complexing agent, 3-30 wt. %; (3) water-soluble calixarene, 0.01-10 wt. %; and (4) water. The complexing agent includes a polybasic organic acid or a sodium salt thereof, or a derivative of phosphorous acid.

An etching solution contains a quaternary ammonium compound as a main component, by which an etching rate for silicon is improved, no adhered substances are formed on an etching surface during etching, and the etching rate does not decrease even after continuous use for a long time. The silicon etching solution contains a phenol compound represented by the following Formula (1), a quaternary ammonium compound, and water, and has a pH of 12.5 or more.

##STR00001## wherein R.sup.1 is a hydrogen atom, a hydroxy group, an alkyl group, an alkoxy group, or an amino group. R.sup.2 is a hydrogen atom, a hydroxy group, an alkoxy group, or an amino group. R.sup.1 and R.sup.2 are not hydrogen atoms at the same time. When R.sup.1 is a hydrogen atom, R.sup.2 is not a hydroxy group. When R.sup.1 is an alkyl group or a hydroxy group, R.sup.2 is not a hydrogen atom.

A treatment liquid for a semiconductor device contains an organic alkali compound, a corrosion inhibitor, an organic solvent, Ca, Fe, and Na, in which each of the mass ratio of the Ca, the mass ratio of the Fe, and the mass ratio of the Na to the organic alkali compound in the treatment liquid is 10.sup.—12 to 10.sup.−4. A method for washing a substrate and a method for removing a resist use the treatment liquid.

Provided is an antibacterial and antifungal composition, including: (A) at least one kind of 1,2-alkanediol having a linear alkyl group containing 6 to 8 carbon atoms; (B) at least one kind of monoalkyl glyceryl ether having a linear alkyl group containing 6 to 8 carbon atoms, a branched alkyl group containing 6 to 8 carbon atoms, or a cycloalkyl group containing 6 to 8 carbon atoms; and (C) at least one kind of aromatic alcohol represented by the following general formula (1): ##STR00001##
wherein n represents a natural number of from 1 to 4.

The invention provides a process for removing organic constituents from a gas stream in a two-stage scrubbing operation, in which scrubbing is performed firstly with an alcoholic scrubbing medium and then with an aqueous scrubbing medium. The laden scrubbing media obtained can be used in certain (chemical) processes.