Provided are a maintenance liquid and a maintenance method that can solve an ejection problem of a UV curable inkjet printer. The maintenance liquid includes: a first ingredient in which a water-soluble compound is soluble and a cured matter of a UV curable ink is insoluble. The maintenance method includes: a first cleaning process at which a water-soluble compound that adheres to an inkjet head included in the UV curable inkjet printer is dissolved by a first maintenance liquid including the first ingredient in which the water-soluble compound is soluble and a cured matter of a UV curable ink is insoluble, and a second cleaning process at which the inkjet head is cleaned by a second maintenance liquid including a second ingredient in which the water-soluble compound is insoluble and the cured matter of the UV curable ink is soluble.

The invention relates to a mousse composition comprising: a) a base composition comprising: (i) from 0.0001 to 5 wt. % of a lactam; (ii) from 0.1 to 10 wt. % of an alcohol; and, b) a propellant; and to the use of a combination of a lactam with an alcohol, in a mousse composition to collapse the resulting mousse foam quicker; and to the use of a combination of a lactam with an alcohol, in a mousse composition to make the resulting mousse foam easier to rinse.

A composition and a method for clearing tissue for subsequent three-dimensional analysis. The clearing composition comprises: (1) a homogenizing agent such as N-methylglucamine, urea, or ethylenediamine; (2) a cytoplasmic, water-soluble refractive index adjusting agent such as iohexol, sodium thiosulfate, or polyethylene glycol; and (3) a membrane, lipid-soluble RI adjusting agent such as 2,2′-thiodiethanol (TDE) or propylene glycol. The tissue clearing composition is particularly suitable for use with long-term fixed human tissues.

A roll of cleaning fabric is used for cleaning printing cylinders of a printing system. The cleaning fabric (13) is impregnated with a cleaning composition containing an organic solvent and a cellulose solubilizer. The roll may be wound around a core (14) and inserted in a removable sealing bag (15) configured to seal around the roll (12) of cleaning fabric (13) in order to prevent the cleaning composition from evaporating before use.

A wiping composition and a wiping product containing the composition are disclosed. The wiping composition contains a combination of an antimicrobial agent with a preservative enhancing agent that not only provides antiseptic properties when applied to an adjacent surface, but also is well suited to preserving the substrate that is used to apply the composition. In particular, the composition has been unexpectedly found to inhibit or destroy bacteria, particularly Burkholderia cepacia, even when the active ingredients are used at extremely low levels.

A detergent composition for dry cleaning is disclosed. The detergent composition for dry cleaning includes a) 5 to 10% by weight of a fluorinated (fluoro-based) solvent, b) 1 to 2% by weight of a cleaning booster, c) 5 to 10% by weight of an anti-shrinkage agent, d) 40 to 50% by weight of a water-soluble solvent, and e) 30 to 40% by weight of water.

Described herein is a cleaning composition for post-etch or post-ash residue removal from the surface of a semiconductor substrate and a corresponding use of said cleaning composition. Further described is the use of said cleaning composition in combination with one or more oxidants, e.g. for oxidative etching or partial oxidative etching of a layer or mask, comprising or consisting of TiN, preferably in the presence of a tungsten material, on the surface of a semiconductor substrate, and/or for post-etch or post-ash residue removal from the surface of a semiconductor substrate. Moreover, it is described a wet-etch composition comprising the cleaning composition of the present invention and one or more oxidants, the use of said wet-etch composition for oxidative etching or partial oxidative etching of a layer or mask, comprising or consisting of TiN, preferably in the presence of a tungsten material, on the surface of a semiconductor substrate, and/or for post-etch or post-ash residue removal from the surface of a semiconductor substrate, a process for the manufacture of a semiconductor device from a semiconductor substrate using said wet-etch composition and a kit comprising the cleaning composition of the present invention and one or more oxidants. Furthermore, it is described the use of an imidazolidinethione in a composition for etching or partially etching of a layer or mask on the surface of a semiconductor substrate and/or for cleaning a semiconductor substrate.

Systems and methods for cleaning a hard-coated ophthalmic lens and stripping the hard-coating of the hard coated ophthalmic lens in a single pass process are disclosed. The hard-coated ophthalmic lens is sequentially treated with a cleaning solution, an alkaline solution, and a stripping solution. Ultrasonic power is applied to the solutions and the ophthalmic lens during the process. The resulted ophthalmic lens has substantially no sign of chemical attack or residual hard coating or varnishes thereon.

A hydrofluoroolefin ether represented by the general Formula (I), compositions that include such compounds, and apparatuses and methods for use that include such compositions and compounds, wherein Formula (I) is represented by: R.sub.f—O—CH.sub.2CH═CHCH.sub.2—O—R.sub.f (I) wherein each Rf group is independently a linear, branched, and/or cyclic perfluoroalkyl group having 2 to 9 carbon atoms and optionally further including 1 to 3 nitrogen and/or oxygen catenary heteroatoms.

R.sub.f—O—CH.sub.2CH═CHCH.sub.2—O—R.sub.f   (I)

Pre-moistened wipes that include one or more characteristics correlated to desired properties, such as high durability, mileage, cleaning composition retention, efficacy, or the like are described. Pulp substrates typically include an anionic charge, which can result in binding or retention of a cationic biocide such as a quaternary ammonium compound while the remainder of the composition is released from the wipe (e.g., through squeezing, wiping or other compression). The present wipes are specifically tailored to include a pore size distribution characterized by pores having a size from 300 μm to 400 μm, which is larger than the pore distribution characteristics of existing wipes. Such characteristics increase release of a quaternary ammonium compound to a target surface, providing improved microefficacy, without the need for any cationic biocide release agents such as latex or a cationic salt.