The present invention relates to a composition and a method for treating substrates, such as fabrics; in particular a composition that can deliver cleaning and anti-microbial benefits to the fabric thereby delaying laundry. There is a long left need for a composition, which can clean the fabric and deliver anti-microbial benefits without the use of water and detergents. It is therefore an object of the present invention to provide a composition with no surfactants in it which can deliver cleaning and anti-microbial benefits through a single product. It has been found that cleaning and anti-microbial benefits on fabric can be achieved by a solvent mix of a glycol ether, a fatty acid ester and a diol in combination with a bipolar antimicrobial particle in an aqueous solution.

Aqueous formulations comprising (A) at least one organic complexing agent selected from (A1) alkali metal salts of aminopolycarboxylic acids and (A2) polymers bearing at least two CH.sub.2N(CH.sub.2COOH)-units per molecule, partially or fully neutralized with alkali, (B) at least one salt of at least one of the following acids: nitric acid, sulphuric acid, sulphamic acid, methanesulfonic acid, C.sub.1-C.sub.2-carboxylic acids, C.sub.2-C.sub.4-hydroxymonocarboxylic acids, C.sub.2-C.sub.7-dicarboxylic acids, unsubstituted or substituted with hydroxyl, and C.sub.4-C.sub.6-tricarboxylic acids, each unsubstituted or substituted with hydroxyl, (C) at least one compound selected from (C1) phosphoric acid C.sub.2-C.sub.10-monoalkyl esters, (C2) a C.sub.3-C.sub.10-alkynol, optionally alkoxylated with one to 10 alkoxide groups per hydroxyl group, and (C3) a C.sub.4-C.sub.10-alkynediol, optionally alkoxylated with one to 10 alkoxide groups per hydroxyl group, said aqueous formulations having pH values in the range of from 7.5 to 10.

Improved stripper solutions for removing photoresists from substrates are provided that typically have flash points above about 95 C. and high loading capacities. The stripper solutions comprise diethylene glycol butyl ether, quaternary ammonium hydroxide, and an alkanolamine having at least two carbon atoms, at least one amino substituent and at least one hydroxyl substituent, the amino and hydroxyl substituents attached to two different carbon atoms. Some formulations can additionally contain a secondary solvent. The formulations do not contain DMSO. Methods for use of the stripping solutions are additionally provided.

Compositions and methods for cleaning surfaces, such as for removing residues or other coatings from molds and other industrial parts, such compositions comprising, for example, a first solvent comprising a pyrrolidone such as 2-pyrrolidone, 1-(2-hydroxyethyl)-2-pyrrolidone, or mixture thereof; and a second solvent selected from the group consisting of an imidazole (such as 1,2-dimethylimidizole), an alkylene glycol ether (such as ethylene glycol monobutyl ether or diethylene glycol monobutyl ether, a terpene (such as d-limonene), and mixtures thereof. In various embodiments, such methods are for removing residues from molds used in forming polyurethane parts, wherein residues comprise polyurethane, urethane reactants, and mold release agents. The compositions may be substantially free of 1-methyl-2-pyrrolidone and of 1-ethyl-2-pyrrolidone.

An antimicrobial composition of coniferous resin acids and solvent, such as alcohol, water, and an auxiliary solvent selected from E and P series glycol ethers is disclosed. The method for manufacturing of the antimicrobial composition is also disclosed, where in the first step coniferous resin acids, alcohol, auxiliary solvent and water are provided; in the second step alcohol is mixed with water; in the third step coniferous resin acids, auxiliary solvent, as well as optionally a wetting agent, water and/or a pH regulator are added into the alcohol-water solution from second step, and mixed until clear; in the fourth step the antimicrobial composition is optionally packaged and/or diluted to obtain an alcoholic antimicrobial composition with coniferous resin acid concentrations more than 0.01 weight-%. The disclosure relates further to the use of the antimicrobial composition as disinfectant for inanimate and/or living surfaces.

A surface treatment composition according to the present invention is used for treating a surface of a polished object to be polished which is obtained after polishing with a polishing composition including ceria, using the surface treatment composition including a (co)polymer having a monomer-derived structural unit having a carboxyl group or a salt group thereof, a residue removing accelerator composed of a specific compound having a hydroxyl group, and a dispersing medium, wherein pH is less than 7.

A solvent composition has an oxygenated solvent and a siloxane solvent. In one embodiment, the oxygenated solvent is propylene glycol methyl ether and the siloxane solvent is hexamethyldisiloxane or octamethyltrisiloxane. In another embodiment, the solvent composition is an azeotrope of propylene glycol n-butyl ether and decamethyltetrasiloxane. The siloxane solvent can be used in any situation where one desires to remove a silicone deposit, e.g., conformal coatings, adhesives, sealants, greases, heat transfer fluids, paints, oils, etc.

Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more nonionic polymers selected from the group consisting of poly-acrylamides, polyhydroxyethyl(meth)acrylates (PHE(M)A), polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), polymers of formula (I), and mixtures thereof, wherein R1 is hydrogen, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, or sec-butyl, R2 is hydrogen or methyl, and n is an integer, (B) poly(acrylic acid) (PAA) or acrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/mol, and (C) water, wherein the pH of the composition is in the range of from 7.0 to 10.5. ##STR00001##

Disclosed is a post-chemical-mechanical-polishing cleaning composition, which is capable of effectively removing impurities from the surface of a wafer substrate after chemical mechanical polishing and also of preventing the corrosion of metal line materials, and which includes choline hydroxide, tetrabutylammonium hydroxide, 1,2,4-triazole, 2-hydroxypyridine, and the remainder of ultrapure water.

Problem to be Solved To provide a composition that can efficiently remove a photoresist adhering to an edge portion and a back surface of a substrate, in a process of producing a mask which is used when the substrate is subjected to etching treatment to have an element, a circuit etc., formed thereon using the photoresist. Solution The composition for removing a resist of the present invention is a composition comprising a surfactant and a solvent, wherein the composition contains, as the surfactant, at least the following component (A). Component (A): a polyglycerol derivative represented by the following formula (a):
R.sup.aO(C.sub.3H.sub.5O.sub.2R.sup.a).sub.nR.sup.a(a)
wherein n represents the number of the repeating units, and is an integer of 2 to 60; and R.sup.a identically or differently represents a hydrogen atom, a C.sub.1-18 hydrocarbon group or a C.sub.2-24 acyl group, provided that at least two of the (n+2) number of R.sup.a are C.sub.1-18 hydrocarbon groups and/or C.sub.2-24 acyl groups.