A composition for solubilizing polystyrene and/or styrene copolymers, including a first component and a second component, in which the first component is selected from solvents having a flashpoint of at least 25? C., and the second component is soluble in the first component. The use of the composition as a cleaning composition for the removal of polystyrene and/or styrene copolymers from a surface and a method for the removal of polystyrene and/or styrene copolymers from a surface.

A composition includes methyl acetate, dimethyl carbonate, acetone, or a combination thereof, dimethyl sulfoxide, methyl glyoxal, propylene carbonate, gamma butyrolactone, ethylene carbonate, 2-chloro-1-propanol, or a combination thereof, and optionally thiophene, 1,3-dioxolane, thioacetic acid, or a combination thereof. The respective amounts of each solvent are further described herein, and the total amounts of methyl acetate, dimethyl carbonate, acetone, dimethyl sulfoxide, methyl glyoxal, propylene carbonate, thiophene, 1,3-dioxolane, and thioacetic acid sum to at least 90 volume percent of the total volume of the composition. The composition can be particularly useful for removal of a coating from a surface. Accordingly, a method of removing a coating from a surface is also disclosed.

Disclosed is an exterior chemical cleaning composition for a vehicle. The chemical cleaning composition may be capable of functioning as a universal cleaning solvent includes 2% hydrogen peroxide by volume, predetermined quantities of acetone water, propylene carbonate, dimethyl glutamate, dimethyl adipate, glycerin, panthenol, tocopheryl acetate, desired amount of distilled water, 1% by volume of acetate fragrance, 5 benzophenone-1, benzoate, yellow 11 and remaining water content. The chemical cleaning composition may be utilized for forming an effective solvent for cleaning a variety of surfaces including car body, kitchen hood, and other surfaces subjected to deposition of all kinds of stain, dirt, oil, marks, droppings and other coatings. The chemical cleaning composition may be used as an effective, simple and quick means for cleaning a vehicle body without affecting the underlying paint coating on the vehicle body.

Embodiments of the inventive concepts provide a method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer. The method includes preparing a semiconductor substrate to which an adhesive layer adheres, removing the adhesive layer from the semiconductor substrate, and applying a cleaning composition to the semiconductor substrate to remove a residue of the adhesive layer. The cleaning composition includes a solvent including a ketone compound and having a content that is equal to or greater than 40 wt % and less thaadminn 90 wt %, quaternary ammonium salt, and primary amine.

Embodiments of the inventive concepts provide a method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer. The method includes preparing a semiconductor substrate to which an adhesive layer adheres, removing the adhesive layer from the semiconductor substrate, and applying a cleaning composition to the semiconductor substrate to remove a residue of the adhesive layer. The cleaning composition includes a solvent including a ketone compound and having a content that is equal to or greater than 40 wt % and less than 90 wt %, quaternary ammonium salt, and primary amine.

Suggested are new flavour and fragrance compositions comprising selected acetophenone derivatives for dissolving flavours and fragrances, and further especially for dissolving lipophilic compounds, which are implemented in these products.

This disclosure relates to methods and compositions for treating a semiconductor substrate having a pattern disposed on a surface of the substrate.

An object of the present invention is to provide a composition including hydrogen peroxide, which can be used for semiconductor device manufacturing and which exhibits an excellent storage stability and has a reduced effect of defects on a semiconductor substrate. Further, another object of the present invention is to provide a method for producing the composition including hydrogen peroxide, and a composition reservoir for storing the composition.

The composition of the present invention includes hydrogen peroxide, an acid, and a Fe component, in which a content of the Fe component is 10.sup.5 to 10.sup.2 in terms of mass ratio with respect to the content of the acid.

A polyimide-based resin film cleaning liquid includes at least one solvent selected from the group consisting of a hydroxy aliphatic carboxylic acid ester, an aliphatic carboxylic acid ester, a chain or cyclic ketone, an alkylene glycol monoalkyl ether, an alkylene glycol monoalkyl ether acetate, and an aprotic polar solvent other than these solvents.

The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains a bulky protecting ligand, an organic amine, an organic inhibitor, and water. The invention also provides methods for using the cleaning composition.