The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains one or more quaternary ammonium hydroxides, one or more organic amines, one or more metal inhibitors, and water. The invention also provides methods for using the cleaning composition.

The present disclosure relates to cleaning compositions that can be used to clean semiconductor substrates. These cleaning compositions can be used to remove defects arising from previous processing steps on these semiconductor substrates. These cleaning compositions can remove the defects/contaminants from the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one organic acid and at least one anionic polymer.

An aqueous cleaning solution for removing rouging deposits on media-contacted surfaces of stainless steels comprises a first component and a second component. The first component is an alkali sulfite and the second component is an alkali formate, wherein the concentrations thereof are adjusted in such manner that formate is present in a molar ratio of 1.5 to 4.2 relative to sulfite, and that the pH value of the cleaning solution is 4.0 to 4.8. For preparing the aqueous cleaning solution, an aqueous solution of an alkali hydroxide is provided initially, thereafter a first amount of concentrated aqueous formic acid is admixed in an excess in such manner that a pH value of 3.5 to 4.5 is established, then a second amount of solid alkali sulfite is admixed in accordance with the sulfite concentration to be established, thus resulting in a pH value of 5.5 to 6.5, and finally a third amount of concentrated aqueous formic acid is admixed until a pH value of 4.0 to 4.8 is attained.

Solid rinsing, cleaning and/or sanitizing compositions for various applications are provided. In particular, solid compositions include a complex of urea and an acid having desirable storage stability previously unavailable in solid urea/acid compositions. Stable solid compositions are disclosed and methods of making the same to overcome conventional limitations associated with with forming kinetically and thermodynamically stable solids that utilize urea/acid compositions.

In accordance with one aspect of the present invention, a method for cleaning a cooking chamber is provided. The method comprises applying a cleanser composition and water to the cooking chamber followed by incubating the cooking chamber. The cleanser composition comprises components that aid in loosening soil and debris during the steam cleaning and also provides a pleasant aroma. The cleanser composition aids in loosening soil and debris by effervescence.

An acidic aqueous solution containing a chelating agent and an acid, wherein the chelating agent is glutamic acid N,N-diacetic acid (GLDA) or a salt thereof, and wherein the amount of GLDA or the salt thereof is at least 10 wt %, based on the weight of the aqueous solution, and to the use thereof as an oilfield chemical, in descaling processes, or in processes in which highly concentrated aqueous acids are used, such as cleaning processes or plating processes.

A stabilized antifoaming composition having at least three components. The first component is an antifoaming agent. The second component is an ethylene-(meth)acrylic acid copolymer. The third component is a salt.

This invention relates to isolating and removing mildew, harmful bacterial and pets urine out of handmade wool and silk rugs.

The invention consist of three procedures that describes each step of work, chemicals mixture and timing used to achieve the this process.

It saves handmade rugs from being discarded, it describes a new safe and healthy approach in cleaning handmade rugs.

A cleaning liquid for lithography that is capable of removing residual material which remains after an etching process, as well as suppressing corrosion of at least one of cobalt and alloys thereof, and a method for cleaning a substrate using the cleaning liquid. The cleaning liquid for lithography includes hydroxylamine, at least one basic compound selected from amine compounds other than hydroxylamine, and quaternary ammonium hydroxides, and water, and has a pH value of 8 or higher. The cleaning liquid is used in cleaning a substrate containing at least one of cobalt and alloys thereof.

A multi step cleaning system, for cleaning a cleaning surface using a first cleaning solution containing alkyl dimethyl benzyl ammonium chloride and a second cleaning solution containing acetic acid. The first cleaning solution is impregnated in a first wipe, and the second cleaning solution is impregnated in a second wipe. The wipes are sealed and provided to the user in a double chambered packet, having a first chamber and a second chamber that are isolated from each other. In use, after the packet is opened, the first wipe is used to wipe the cleaning surface, the cleaning surface is fully dried, and the second wipe is used to wipe the cleaning surface. The cleaning surface is left with an extraordinary shine that is long lasting and repels dirt, dust, and grime.