C11D7/265

Cleaning composition, cleaning process, and process for producing semiconductor device

A cleaning composition for removing plasma etching residue and/or ashing residue formed above a semiconductor substrate is provided that includes (component a) water, (component b) a hydroxylamine and/or a salt thereof, (component c) a basic organic compound, and (component d) an organic acid and has a pH of 7 to 9. There are also provided a cleaning process and a process for producing semiconductor device employing the cleaning composition.

COMPOSITION FOR AN ORGANIC CLEANING PRODUCT
20220033742 · 2022-02-03 ·

A natural cleaning product which does not contain any harsh chemicals or toxins. Specifically, the cleaning product is based on borax and yucca plant products. A composition for an organic cleaning product comprises distilled water; borax; distilled white vinegar; yucca root soap; and optionally, lavender essential oil, peppermint essential oil; and eucalyptus. Also disclosed is a process for the production of yucca root soap which is used in producing the organic cleaning product of the invention.

Suspension cleaning

A method of cleaning a contaminated surface, such as cleaning the elongate interior lumen of an endoscope contaminated with flesh, bone, blood, mucous, faeces or biofilm, said method comprising the steps of: providing a suspension of solid particles in a liquid to said contaminated surface, and flowing said suspension along said surface thereby to remove contaminant from the surface. The suspension is preferably a paste, where the solid material may be e.g. crystals of a salt, silicon oxide or organic material. The paste preferably has a solid fraction between 5 and 55%. A rheology modifier may be present.

DETERGENTS AND CLEANING PRODUCTS INCLUDING A POLYMER ACTIVE INGREDIENT

The aim of the invention is to improve the primary detergent power of detergents and cleaning products, in particular with respect to soiling containing oil and/or grease. For this purpose, polymers comprising N-vinyl imidazole-derived betaine units are incorporated into the products.

Compositions for cleaning III-V semiconductor materials and methods of using same

Liquid compositions useful for the cleaning of residue and contaminants from a III-V microelectronic device material, such as InGaAs, without substantially removing the III-V material. The liquid compositions are improvements of the SC1 and SC2 formulations.

Wash Oil for Use as an Antifouling Agent in Gas Compressors

The present invention relates to wash oil for use as an antifouling agent in gas compressors, in particular in cracked gas compressors, including at least one compound according to formulae (II)

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with the moieties R.sup.2 and R.sup.3 are selected from a group of linear or branched C.sub.1-C.sub.20-alkyl, C.sub.3-C.sub.10-cycloalkyl and linear or branched C.sub.1-C.sub.10-alkyl substituted C.sub.3-C.sub.10-cycloalkyl and C.sub.6-C.sub.12 aryl and C.sub.1-C.sub.10-alkyl substituted C.sub.6-C.sub.12 aryl. The moieties can be interrupted by oxygen or nitrogen. The moieties can be functionalised with hydroxyl groups or amino groups. The moieties can be the same or different. The invention relates also to the use of such wash oil as anti-fouling agent.

Cleaning Method and Laminate of Aluminum Nitride Single-Crystal Substrate
20170260650 · 2017-09-14 · ·

A method for effectively removing minute impurities of 1 μm or less in size that are present on a surface of an aluminum nitride single-crystal substrate without etching the surface includes scrubbing a surface of an aluminum nitride single-crystal substrate using a polymer compound material having lower hardness than an aluminum nitride single crystal, and an alkali aqueous solution having 0.01-1 mass % concentration of potassium hydroxide or sodium hydroxide, the alkali aqueous solution being absorbed in the polymer compound material.

PURGING AGENT

A purging agent that has excellent purging performance without generation of aggregate is disclosed as a purging agent used in a purging operation where a resin to be processed contains a polar group-containing thermoplastic resin. This purging agent contain a hydrocarbon-based resin, and at least one metal salt among an alkaline metal salt and alkaline earth metal salt, has a water content of 0.15% by weight or less, and includes 0.1 to 20% by weight of the metal salt expressed as the metal relative to the hydrocarbon-based resin.

STABLE PERCARBOXYLIC ACID COMPOSITIONS AND USES THEREOF

The present invention relates generally to stable percarboxylic acid compositions comprising, inter alia, at least two stabilizing agents, and various uses for water treatments, including water treatments in connection with oil- and gas-field operations. The present invention also relates to slick water compositions and gel based compositions that comprise stable percarboxylic acid compositions and the use thereof in oil- and gas-field operations.

Stripping compositions for removing photoresists from semiconductor substrates

This disclosure relates to compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one quaternary ammonium hydroxide; 3) at least one carboxylic acid; 4) at least one Group II metal cation; 5) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines; and 6) water, in which the composition is free of a compound comprising at least three hydroxyl groups. The compositions can effectively strip positive or negative-tone resists or resist residues, and be non-corrosive to bumps and underlying metallization materials (such as SnAg, CuNiSn, CuCoCu, CoSn, Ni, Cu, Al, W, Sn, Co, and the like) on a semiconductor substrate.