C11D7/266

Fabric conditioner compositions
12398344 · 2025-08-26 · ·

A fabric conditioner composition comprising: 2 to 40 w.t. % fabric softening active; 0.25 to 3 w.t. % triglyceride; and water; wherein the triglyceride comprises at least 60% C18 chains.

Device for cleaning a surface

An embodiment provides a device for cleaning a sleeve of an ultraviolet light source, including: the ultraviolet light source for the disinfection of a fluid, wherein the sleeve surrounds the ultraviolet light source; a cleaning composition encapsulated in a polymer material to form a compound; a canister around and in contact with the sleeve and encapsulating the compound against the sleeve thereby placing the compound in a location adjacent to the sleeve, wherein the polymer material dissolves at a pH above a target value above the polymer material dissolution point releases the cleaning composition. Other aspects are described and claimed.

Lacquer for treating 3D printing-created printed matter
12486480 · 2025-12-02 · ·

Proposed is a lacquer for treating a 3D printing-created printed matter that is configured to contain a perfluorinated acrylic resin having a relatively high surface hardness and excellent water resistance and contamination resistance, as well as an excellent force of adhesion to a printing resin making up a 3D printed matter. While the 3D printed matter that is printed through a photocuring-type 3D printer is cleaned and rinsed, an uncured resin remaining on the 3D printed matter is removed, and at the same time, a protective film layer is formed on a surface of the 3D printed matter by being coated thereon. As a result, the surface of the 3D printed matter is protected from damage during a post curing process. Furthermore, the 3D printed matter, which is to be manufactured, is also effectively safeguarded against quality degradation that is caused by contamination through the surface thereof and subsequent discoloration.

CLEANING COMPOSITION AND ASSOCIATED SPRAY AND METHOD
20260049263 · 2026-02-19 ·

A cleaning composition may include about 20 wt % to about 90 wt % dimethyl carbonate; 0 wt % to about 40 wt % methyl acetate and/or t-butyl acetate; and 0 wt % to about 10 wt % of one or more hydrocarbons of general formula (I): C.sub.nH.sub.2n+x (I); wherein n is in a range of 5 to 8; and wherein x is 0 or 2. The cleaning composition may be a low VOC content brake cleaning composition useful for removing oil and particulate contamination from braking system components of vehicles such as automobiles.

RESIN COMPOSITION FOR CLEANING MOLDING MACHINES
20260035558 · 2026-02-05 · ·

A resin composition for cleaning molding machines that achieves both high cleaning power for the material mold-processed before cleaning and easy replacement to the material to be mold-processed after cleaning, improves stable raw material feedability, has metered purging suitability, and has improved workability by suppressing spurt and emission of fume from a molding machine during the cleaning process is provided. To achieve the object, the present disclosure is a resin composition for cleaning molding machines including a thermoplastic resin (A), a synthetic wax (B), and a polyolefin-based resin (C), wherein an absolute value of a difference between solubility parameters of (A) and (B) is 2.0 (cal/cm.sup.3).sup.1/2 or more and 7.0 (cal/cm.sup.3).sup.1/2 or less, a compounding amount of (C) is more than 0.1 mass % and less than 10 mass %, and a glass transition temperature of (C) is higher than 150 C. and lower than 40 C.

Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling

The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (in the formula, each of L.sup.1 and L.sup.2 represents a C1 to C6 alkyl group, and the sum of the number of carbon atoms of the alkyl group L.sup.1 and that of the alkyl group L.sup.2 is 6 or less) in an amount of 80 mass % or more. ##STR00001##