The present invention is a self-assembled monolayer removing liquid for selectively removing a self-assembled monolayer provided on a surface of a substrate, the removing liquid having a Hansen solubility parameter positioned in a first Hansen sphere of a material for forming the self-assembled monolayer and in a second Hansen sphere of the self-assembled monolayer, the first Hansen sphere being defined by a center value (d.sub.1, p.sub.1, h.sub.1) [MPa.sup.1/2] and a sphere radius R.sub.1 [MPa.sup.1/2] in a Hansen solubility parameter space, the second Hansen sphere being defined by a center value (d.sub.2, p.sub.2, h.sub.2) [MPa.sup.1/2] and a sphere radius R.sub.2 [MPa.sup.1/2] in the Hansen solubility parameter space.

The present invention relates to the use of substituted bis-4H-pyranonyl compounds in which the 4H-pyranonyl units are combined with heteroalkyl groups, in detergents and cleaning agents, for improving detergent or cleaning performance with respect to bleachable stains.

A solution including an organic solvent (S), and an antioxidant (A), in which an antioxidant (A) includes a tocopherol compound (A1).

A composition suitable for cleaning hard surfaces comprising a natural oil solvent and a natural oil thickener is provided.

The invention relates to compositions for removing nail polish comprising a solvent and a high load of colorant, preferably between 0.5 wt % and 5.0 wt %. Preferably, the composition has an absorption peak in a range between 460 nm and 600 nm, and a normalized extinction of at least 0.5 for at least one wavelength in the range when measured in an optically transparent solvent via spectrophotometer and across 1 cm path length in a ratio of 1:8 composition to optically transparent solvent. Methods of removing nail polish are also provided.

The present invention relates to solvent compositions and processes for inhibiting the generation of peroxide in glycol ether solvents. In one aspect, a solvent composition comprises at least one glycol ether, at least one antioxidant, wherein the at least one antioxidant is selected from the group consisting of L-ascorbic acid-6-hexadecanoate, pentaerythritol tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate), and mixtures thereof, wherein the amount of the antioxidant in the solvent composition is less than or equal to 1,000 ppm by weight based on the total weight of the solvent composition and a peroxide, wherein the amount of the peroxide in the solvent composition is less than 20 ppm, based on the total weight of the solvent composition.

Composition, method and system for TiN hard mask removal from electronic circuitry devices, such as advanced pattern wafers have been disclosed. The cleaning compositions preferably comprise an etchant agent (also referred to as a base), an oxidizing agent, an oxidizing stabilizer (also referred to as a chelating agent), an ammonium salt, a corrosion inhibitor, and a solvent. Other optional additives could be provided. It is preferable that the pH of the cleaning composition be greater than 5.5. The cleaning composition is preferably free from dimethyl sulfoxide and tetramethylammonium hydroxide.

An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present. The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.

In general, the invention provides high pH cleaning compositions for dielectric surfaces such as PETEOS, SiO.sub.2, thermal oxide, silicon nitride, silicon, etc. The compositions of the invention afford superior surface wetting, dispersion of particles and organic residues, and prevents redeposition and re-agglomeration of the dispersed residue during cleaning to afford superior cleaning and low defectivity.

A wiping composition and a wiping product containing the composition are disclosed. The wiping composition contains a combination of an antimicrobial agent with a preservative enhancing agent that not only provides antiseptic properties when applied to an adjacent surface, but also is well suited to preserving the substrate that is used to apply the composition. In particular, the composition has been unexpectedly found to inhibit or destroy bacteria, particularly Burkholderia cepacia, even when the active ingredients are used at extremely low levels.