C11D7/3218

Compositions and methods for post-CMP cleaning of cobalt substrates

A cleaning composition is disclosed for cleaning residue and/or contaminants from microelectronic devices having same thereon. The composition comprises at least one complexing agent, at least one cleaning additive, at least one pH adjusting agent, water, and at least one oxylamine compound. Advantageously, the compositions show effective cleaning of cobalt-containing substrates and improved cobalt compatibility.

Liquid product for stainless-steel corrosion remediation

A concentrate aqueous composition for removing Type I and Type III rouge from various stainless-steel items. The liquid composition comprises oxalic acid, a phosphonic acid, and various amines. The use of an amine has been found to provide synergistic results in removal of the noted types of corrosion from various stainless-steel items that include medical instruments, machines, equipment, pipes, tools, mixing and storage vessels, and the like.

Cleaning formulation for removing residues on surfaces

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one second chelating agent different from the first chelating agent, the second chelating agent containing at least two nitrogen-containing groups; 4) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 5) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 6) water; and 7) optionally, at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

CLEANING SOLUTION FOR REMOVING DRY ETCHING RESIDUE AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE USING SAME

The present invention can provide a cleaning solution containing 0.2-20 mass % of an amine compound (A), 40-70 mass % of a water-soluble organic solvent (B), and water, wherein the amine compound (A) contains at least one selected from the group consisting of n-butylamine, hexylamine, octylamine, 1,4-butanediamine, dibutylamine, 3-amino-1-propanol, N,N-diethyl-1,3-diaminopropane, and bis(hexamethylene)triamine, and the water-soluble organic solvent (B) has a viscosity of 10 mPa.Math.s or less at 20 C. and a pH of 9.0-14.

Photoresist stripper

Improved stripper solutions for removing photoresists from substrates are provided that typically have flash points above about 95 C. and high loading capacities. The stripper solutions comprise diethylene glycol butyl ether, quaternary ammonium hydroxide, and an alkanolamine having at least two carbon atoms, at least one amino substituent and at least one hydroxyl substituent, the amino and hydroxyl substituents attached to two different carbon atoms. Some formulations can additionally contain a secondary solvent. The formulations do not contain DMSO. Methods for use of the stripping solutions are additionally provided.

Moisturizing composition of a contact lens

A moisturizing composition of a contact lens is disclosed in the present invention. A rinse agent (ex. TEOA) is applied for bonding a moisturizing stabilizer (ex. HPMC) and a compound of a hydrophilic cosolvent (ex. PEG) and a moisturizing additive (ex. HA). Hence, the solubility of the moisturizing additive and the aqueous solution can be improved via applying the hydrophilic cosolvent; the stability of the combination of the moisturizing stabilizer and the moisturizing additive can be improved via the structural and the chemical stabilities of the moisturizing stabilizer itself. Meanwhile, the moisturizing composition disclosed can be directly applied to the raw material of the conventional contact lens during manufacturing the high-moisturizing contact lenses.

Novel Modified Acid Compositions as Alternatives to Conventional Acids in the Oil and Gas Industry
20210207017 · 2021-07-08 ·

An aqueous modified acid composition for industrial activities, said composition comprising: an alkanolamine and strong acid in a molar ratio of not less than 1:15, preferably not less than 1:10; it can also further comprise a metal iodide or iodate. Said composition demonstrates advantages over known conventional acids and modified acids.

Chemical compositions and method for degassing of processing equipment
10882081 · 2021-01-05 · ·

A chemical composition for use in degassing of vessels is taught, said chemical composition including 1-10% by weight of an oxyalkylated dodecyl thiol; and 1-20% by weight of an alkyl di-substituted 9-decenamide. A method is further provided for degassing a vessel. The method includes charging said vessel with chemical composition and a carrier medium, wherein said chemical composition comprises 1-10% by weight of an oxyalkylated dodecyl thiol and 1-20% by weight of an alkyl di-substituted 9-decenamide.

NON-AQUEOUS TUNGSTEN COMPATIBLE METAL NITRIDE SELECTIVE ETCHANTS AND CLEANERS

Provided therefore herein is a novel acidic fluoride activated cleaning chemistry. The present invention includes novel acidic fluoride activated, unique organic-solvent based microelectronic selective etchant/cleaner compositions with high metal nitride etch and broad excellent compatibility, including tungsten (W) and low-k. It does not use W-incompatible oxidizers, such as hydrogen peroxide or particle-generating corrosion inhibitors.

Leuco colorants as bluing agents in laundry care compositions

A laundry care composition including at least one laundry care ingredient, a leuco composition, from 0.05 wt % to 15 wt % of a primary amine compound and from 0.005 wt % to 5 wt % of an antioxidant.