A composition and method are used to treat articles suspected of contamination with bacterial spores. The composition and method are effective against bacterial spores selected from C. diff., C. botulinum, C. sporogenes, B. cereus, and B. subtilis. The article can be a textile or a hard surface. The method includes preparing a first use solution by mixing ether amine in water and a second use solution by mixing percarboxylic acid in water; applying the first use solution to the article; and applying the second use solution to the article. An alternative method includes preparing a mixture of ether amine, percarboxylic acid, and water, and applying the mixture to the article.

Improved stripper solutions for removing photoresists from substrates are provided that exhibit improved compatibility with copper, leadfree solder, and epoxy-based molding compounds. The stripper solutions comprise a primary solvent, a secondary glycol ether solvent, potassium hydroxide, and an amine. The solutions also exhibit reduced potassium carbonate crystal formation compared to conventional formulations containing potassium hydroxide, and extended bath life compared to formulations containing tetramethylammonium hydroxide.

A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of alkali hydroxides, alkaline earth metal hydroxides, and tetramethylammonium hydroxide. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

System Solutions and methods for cleaning the air intake valve of a GDI engine during engine operation with a PEA-water solution injection.

Described herein is an etheramine mixture including at least 90% by weight, based on the total weight of the etheramine mixture, of an amine of Formula (I) and/or (II),

##STR00001##

wherein R.sub.1-R.sub.12 are independently selected from H, alkyl, cycloalkyl, aryl, alkylaryl, or arylalkyl, wherein at least one of R.sub.1-R.sub.6 and at least one of R.sub.7-R.sub.12 is different from H, wherein A.sub.1-A.sub.9 are independently selected from linear or branched alkanediyl groups having 2 to 18 carbon atoms,
wherein Z.sub.1-Z.sub.4 are independently selected from OH and linear OCH.sub.2CH.sub.2CH.sub.2NH.sub.2, wherein the degree of amination of each of the etheramines of Formula (I) and Formula (II) is at least 50%, and wherein the sum of x+y is in the range of from 2 to 200, wherein x1 and y1; and x.sub.1+y.sub.1 is in the range of from 2 to 200, wherein x.sub.11 and y.sub.11.

A composition and method are used to treat articles suspected of contamination with bacterial spores. The composition and method are effective against bacterial spores selected from C. diff., C. botulinum, C. sporogenes, B. cereus, and B. subtilis. The article can be a textile or a hard surface. The method includes preparing a first use solution by mixing ether amine in water and a second use solution by mixing percarboxylic acid in water; applying the first use solution to the article; and applying the second use solution to the article. An alternative method includes preparing a mixture of ether amine, percarboxylic acid, and water, and applying the mixture to the article.

A treatment liquid for a semiconductor device includes an alkanolamine; a hydroxylamine; an organic solvent; Ca; Fe; and Na, wherein the content of the alkanolamine in the treatment liquid is 0.1% to 5% by mass, the content of the hydroxylamine in the treatment liquid is 0.1% to 30% by mass, and each of the mass ratio of Ca, Fe, and Na with respect to the content of the alkanolamine and the hydroxylamine in the treatment liquid is 10.sup.?12 to 10.sup.?4.

A treatment liquid for a semiconductor device contains an organic alkali compound, a corrosion inhibitor, an organic solvent, Ca, Fe, and Na, in which each of the mass ratio of the Ca, the mass ratio of the Fe, and the mass ratio of the Na to the organic alkali compound in the treatment liquid is 10.sup.12 to 10.sup.?4. A method for washing a substrate and a method for removing a resist use the treatment liquid.

An etheramine mixture comprising of at least one amine selected from the group consisting of amine of Formula (I) and amine of Formula (II) wherein R.sub.1-R.sub.12 are independently selected from H, alkyl, cycloalkyi, aryl, alkylaryl, or arylalkyi, wherein at least one of R.sub.1-R.sub.6 and at least one of R.sub.7-R.sub.12 is different from H, and wherein Z.sub.1-Z.sub.3 are linear CH.sub.2CH.sub.2CH.sub.2NH.sub.2.

##STR00001##

A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions are substantially devoid of alkali hydroxides, alkaline earth metal hydroxides, and tetramethylammonium hydroxide. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.