A method for manufacturing a liquid ejection head including a substrate having a terminal for electrical connection to an external device, an inorganic material layer on the substrate, and a flow path member disposed on the inorganic material layer and containing an organic material, and the manufacturing method includes a cleaning step of removing a silane coupling agent attached to the terminal by using a solution containing hydrogen fluoride, ammonium fluoride, and a water-soluble organic solvent.

The disclosed and claimed compositions relate to stripper solutions for the removal of photoresists and etch residue that include a triazine (e.g., benzoguanamine) corrosion inhibitor.

A cleaning solution for temporary adhesive for substrates contains: tetrabutylammonium fluoride; dimethyl sulfoxide; and a liquid compound having a solubility parameter of 8.0 or more and 10.0 or less and having a heteroatom. The tetrabutylammonium fluoride is preferably contained at a content of 1 mass % or more and 15 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound. The dimethyl sulfoxide is preferably contained at a content of 5 mass % or more and 30 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound.

A fuser fluid composition is disclosed, including a non-fluorinated functional silicone fluid, and a non-fluorinated non-functional silicone fluid, where the non-fluorinated functional silicone fluid is present in the fuser fluid composition in an amount of from about 1 wt % to about 30 wt % based on a total weight of the fuser fluid composition, and the non-fluorinated non-functional silicone fluid is present in the fuser fluid composition in an amount of from about 50 wt % to about 99 wt % based on a total weight of the fuser fluid composition. The non-fluorinated functional silicone fluid may include an amine-functional group. A cleaning web and a fusing subsystem for a printing system may include a material impregnated with the fuser fluid composition.

A stripper composition and a method for stripping a photoresist are provided. The stripper composition includes an ether-alcohol-based organic solvent (A), another organic solvent (B), an alkaline substance (C), a substrate corrosion inhibitor (D), and water (E). The another organic solvent (B) does not include the ether-alcohol-based organic solvent. The alkaline substance (C) includes an organic base (C1), an inorganic base (C2), or a combination thereof. Based on a total usage amount of 100 parts by weight of the stripper composition, a usage amount of the ether-alcohol-based organic solvent (A) is 7 parts by weight to 70 parts by weight, and a usage amount of the substrate corrosion inhibitor (D) is greater than 0 part by weight and less than 18 parts by weight.

Cleaning fluids include at least two fluid components. The first fluid component is a hydrofluorothioether or a chlorinated hydrofluoroolefin, or at least one of the isomers of a hydrochlorofluoroolefin, and the second fluid component is an alcohol with 1-5 carbon atoms. The cleaning fluid provides enhanced removal of particulate contamination, improved reduction of particle reattachment, or a combination thereof when compared to a cleaning fluid comprising a fluorinated fluid.

Provided is a decomposing/cleaning composition for an adhesive polymer having a high etching rate and suppressed infiltration into a contact interface between a substrate such as a device wafer and an adhesive layer such as a fixing tape. The decomposing/cleaning composition of one embodiment is a decomposing/cleaning composition for an adhesive polymer containing a quaternary alkylammonium fluoride or a quaternary alkylammonium fluoride hydrate and an aprotic solvent, wherein the aprotic solvent contains (A) an N-substituted amide compound having no active hydrogens on the nitrogen atoms and (B) at least one organic sulfur oxide selected from the group consisting of sulfoxide compounds and sulfone compounds.

The present invention relates to a novel composition that may be used to control the etching rate of TIN with respect to W, and remove any residues from the surface, e.g. organic or inorganic residues that could contain fluorine (F), which composition comprises a) an aliphatic or aromatic sulfonic acid; b) one or more inhibitor(s); c) an aprotic solvent; d) a glycol ether; and e) water. The present invention also relates to a kit comprising said composition in combination with an oxidant and optionally a stabilizer of the oxidant, and the use thereof.

A fuser fluid composition is disclosed, including a non-fluorinated functional silicone fluid, and a non-fluorinated non-functional silicone fluid, where the non-fluorinated functional silicone fluid is present in the fuser fluid composition in an amount of from about 1 wt % to about 30 wt % based on a total weight of the fuser fluid composition, and the non-fluorinated non-functional silicone fluid is present in the fuser fluid composition in an amount of from about 50 wt % to about 99 wt % based on a total weight of the fuser fluid composition. The non-fluorinated functional silicone fluid may include an amine-functional group. A cleaning web and a fusing subsystem for a printing system may include a material impregnated with the fuser fluid composition.

It is disclosed a photoresist cleaning composition for stripping a photoresist pattern having a film thickness of 3-150 m, which contains (a) quaternary ammonium hydroxide (b) a mixture of water-soluble organic solvents (c) at least one corrosion inhibitor and (d) water, and a method for treating a substrate therewith.