A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains a lactam compound represented by formula (1) and a ring-structure-having ether compound including at least one species selected from among a cyclic ether compound, a cycloalkyl (chain alkyl) ether compound, a cycloalkyl (branched alkyl) ether compound, and a di(cycloalkyl) ether compound.

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(in formula (1), R.sup.101 represents a C1 to C6 alkyl group; and R.sup.102 represents a C1 to C6 alkylene group.)

A cleaning agent composition for use in removal of an adhesive residue, the composition containing a quaternary ammonium salt and a solvent, wherein the solvent consists of an organic solvent, and the organic solvent includes an N,N,N′,N′-tetra(hydrocarbyl)urea.

Provided therefore herein is a novel acidic fluoride activated cleaning chemistry. The present invention includes novel acidic fluoride activated, unique organic-solvent based microelectronic selective etchant/cleaner compositions with high metal nitride etch and broad excellent compatibility, including tungsten (W) and low-k. It does not use W-incompatible oxidizers, such as hydrogen peroxide or particle-generating corrosion inhibitors.

In a cleaning method for removing adhesive residues from surfaces, in particular after separating an adhesive connection between adhesively joined partners, liquid carbon dioxide from a reservoir enters a jet, apparatus and is guided there through a first dosing unit into an expansion chamber wherein a cold-resistant liquid is then supplied to a mixture created in the expansion chamber from gaseous carbon dioxide and carbon dioxide particles and wherein the mixture, to which the cold-resistant liquid has been added, exits the jet apparatus via an outlet opening thereof. Furthermore, a jet apparatus removes adhesive residues from surfaces.

Provided are a pressure-sensitive adhesive treatment liquid, which can easily remove various kinds of pressure-sensitive adhesives, and a pressure-sensitive adhesive treatment method by which the various kinds of pressure-sensitive adhesives are easily removed. For example, when a pressure-sensitive adhesive tape including a base material and a pressure-sensitive adhesive is used as a treatment object, there are provided a pressure-sensitive adhesive treatment liquid, which can easily separate the base material and various kinds of pressure-sensitive adhesives from each other, and a pressure-sensitive adhesive treatment method by which the base material and the various kinds of pressure-sensitive adhesives are easily separated from each other. A pressure-sensitive adhesive treatment liquid according to an embodiment of the present invention is a treatment liquid for a pressure-sensitive adhesive, and includes a liquid having a Hansen solubility parameter value of 31 or less, and an alkaline compound. The concentration of the alkaline compound is from 0.001 wt % to 20 wt %.

A method is provided for removing a residue from a surface. The method includes steps of applying a cleaning medium to the surface containing the residue. The cleaning medium comprises up to 100 wt. % of at least a solvent. Allowing the cleaning medium to be in contact with the residue for at least 5 seconds to swell/dissolve the residue for removing the residue from the surface. At least 50 wt. % of the residue and the cleaning medium are removed from the surface by wiping the surface with a shear force. The residue contains a sulfonated polymer having an ion exchange capacity (IEC) of greater than 0.5 meq/g. The sulfonated polymer can kill >90% of microbes coming in contact with the sulfonated polymer in less than 30 min.

The invention provides compositions useful in post-CMP cleaning operations, particularly those substrates which contain exposed copper surfaces. The compositions of the invention provide excellent cleaning of such substrates while showing fewer defects from silica and organic materials present at the surface of the substrate. Also provided is a method for cleaning a microelectronic device substrate using such compositions and a kit comprising, in two or more containers, the components of the compositions.

The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.

An alkoxyvinyl ether is disclosed having the chemical structure R.sub.fC(OR)═CHR.sub.f′, wherein R.sub.f is an at least partially fluorinated functional group having at least one carbon atom, R.sub.f′ is an at least partially fluorinated functional group having at least two carbon atoms, and R is a functional group. A method for preparing an alkoxyvinyl ether is disclosed, comprising R.sub.fCFHCFHR.sub.f′+KOH/ROH.fwdarw.R.sub.fC(OR)═CHR.sub.f′, wherein R.sub.f is a perfluoro functional group, R.sub.f′ is a perfluoro functional group, and R is an alkyl functional group. Another method for preparing an alkoxyvinyl ether is disclosed, comprising R.sub.fCF═CHR.sub.f′+KOH/ROH.fwdarw.R.sub.fC(OR)═CHR.sub.f′, wherein R.sub.f is a perfluoro functional group, R.sub.f′ is a perfluoro functional group, and R is an alkyl functional group.

Disclosed herein is a cleaning composition for facilitating cleaning surfaces of an object, in accordance with some embodiments. Accordingly, the cleaning composition may include carbanions and a diluting agent. Further, a carbanion of the carbanions may include a carbon atom. Further, the carbon atom may include a formal charge of −1. Further, the diluting agent may be capable of combining with the carbanions for forming at least one appliable form of the cleaning composition. Further, a ratio of the diluting agent to the carbanions by volume may be 64:1. Further, the combining facilitates applying of the at least one appliable form of the cleaning composition to at least one surface of the object. Further, the applying of the at least one appliable form of the cleaning composition cleans at least one contaminant present on the at least one surface of the object.