A functional water producing apparatus in an embodiment includes: a water pressure regulator configured to regulate the water pressure of the ultrapure water, the water pressure regulator having a pressure regulating valve configured to regulate a water pressure of the ultrapure water to an almost constant pressure and a feed water pump configured to pressurize the ultrapure water; a dissolving device configured to dissolve functional gas imparting a specific function in the ultrapure water regulated the water pressure by the water pressure regulator; and a control device configured to control the feed water pump to regulate the water pressure of the functional water to a predetermined constant pressure based on a water pressure or a flow rate of the functional water flowing out of the dissolving device.

Aspects of the present disclosure include methods, apparatuses, and computer readable media for transporting, via an automated crane, a component toward a first station within a cleaning system, placing, via the automated crane, the component into a first tank at the first station, wherein the first tank contains a solution that cleans the component by removing at least a portion of residual materials on the component, transporting, via the automated crane, the component toward a second station within a cleaning system, placing, via the automated crane, the component into a second tank at the second station, wherein the second tank contains a fluid that rinses the at least a portion of the residual materials removed by the solution, transporting, via the automated crane, the component toward a third station within a cleaning system, and placing, via the automated crane, the component into a chamber at the third station, wherein the chamber provides a gas or air that dries the fluid on the component.

Systems and methods for cleaning a substrate include a combined treatment of hydrogen peroxide and ultraviolet (UV) irradiation. Specific embodiments include the direct irradiation with 185/254 nm UV of a spinning substrate immersed under a liquid film of dilute hydrogen peroxide solution. Such a cleaning treatment can result in about a 100% improvement of TiN strip rate compared to processing with the same hydrogen peroxide solution without UV exposure. Such method can also be executed at room temperature and still provide improved cleaning efficiency.

A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate, the composition containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains an alkylene glycol dialkyl ether and a lactam compound represented by formula (1). ##STR00001##
(in formula (1), R.sup.101 represents a C1 to C6 alkyl group, and R.sup.102 represents a C1 to C6 alkylene group.)

A method for effectively removing minute impurities of 1 m or less in size that are present on a surface of an aluminum nitride single-crystal substrate without etching the surface includes scrubbing a surface of an aluminum nitride single-crystal substrate using a polymer compound material having lower hardness than an aluminum nitride single crystal, and an alkali aqueous solution having 0.01-1 mass % concentration of potassium hydroxide or sodium hydroxide, the alkali aqueous solution being absorbed in the polymer compound material.

A tile system for covering a surface. The tile system comprises a first tile assembly connected to a second tile assembly by a connector. Each tile assembly comprises a first tile stacked on a second tile, the first tile and the second tile joined to a reinforcing material disposed therebetween. The connector comprises a first component and a second component that is complementary to the first component. The first component is mounted to the first tile assembly, and the second component is mounted to the second tile assembly.

This disclosure relates to compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one quaternary ammonium hydroxide; 3) at least one carboxylic acid; 4) at least one Group II metal cation; 5) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines; and 6) water, in which the composition is free of a compound comprising at least three hydroxyl groups. The compositions can effectively strip positive or negative-tone resists or resist residues, and be non-corrosive to bumps and underlying metallization materials (such as SnAg, CuNiSn, CuCoCu, CoSn, Ni, Cu, Al, W, Sn, Co, and the like) on a semiconductor substrate.

A cleaning chemical composition suitable for removing, from a substrate, a passivation layer comprising etching residues resulting from etching of said substrate, includes a weak acid comprising acetic acid, the weak acid content being between 20% by weight and 95% by weight, preferably between 50% by weight and 80% by weight, relative to the weight of the chemical composition, a non-oxidising strong acid comprising methanesulphonic acid, the non-oxidising strong acid content being between 5% by weight and 50% by weight, preferably between 15% by weight and 50%, relative to the weight of the chemical composition, hydrofluoric acid, whose content is between 0.2% by weight and 2% by weight relative to the weight of the chemical composition, water whose content is between 2% by weight and 20% by weight relative to the weight of the chemical composition. A cleaning method for removing, from a substrate, a passivation layer comprising etching residues resulting from etching of the substrate, includes contacting the cleaning chemical composition with the passivation layer for a time that is sufficient to remove said passivation layer from the substrate.

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid containing an alkyl group substituted by OH or NH.sub.2; and 3) at least one aminoalcohol.