A heterogeneous composite consisting of near-nano ceramic clusters dispersed within a ductile matrix. The composite is formed through the high temperature compaction of a starting powder consisting of a core of ceramic nanoparticles held together with metallic binder. This core is clad with a ductile metal such that when the final powder is consolidated, the ductile metal forms a tough, near-zero contiguity matrix. The material is consolidated using any means that will maintain its heterogeneous structure.

Methods and apparatuses for in situ synthesis of SiC, CMCs, and MMCs are disclosed, comprising: providing an apparatus having: an electromagnetic energy source; an autofocusing scanner; a powder system for SiC and one or more powders; a powder delivery system; a shielding gas comprising argon and/or nitrogen; and a computer coupled to and configured to control the energy source, scanner, powder system, and powder delivery system to deposit layers of the sample; programming the computer with specifications of the sample; using the computer to control electromagnetic radiation, mixing ratio, and powder deposition parameters based on the specifications of the sample; and using the autofocusing scanner to focus and scan the electromagnetic radiation onto the sample while the powders are concurrently deposited by the powder delivery system onto the sample to create a melting pool to deposit one or more layers onto the sample. Other embodiments are described and claimed.

Methods and apparatuses for in situ synthesis of SiC, CMCs, and MMCs are disclosed, comprising: providing an apparatus having: an electromagnetic energy source; an autofocusing scanner; a powder system for SiC and one or more powders; a powder delivery system; a shielding gas comprising argon and/or nitrogen; and a computer coupled to and configured to control the energy source, scanner, powder system, and powder delivery system to deposit layers of the sample; programming the computer with specifications of the sample; using the computer to control electromagnetic radiation, mixing ratio, and powder deposition parameters based on the specifications of the sample; and using the autofocusing scanner to focus and scan the electromagnetic radiation onto the sample while the powders are concurrently deposited by the powder delivery system onto the sample to create a melting pool to deposit one or more layers onto the sample. Other embodiments are described and claimed.

The present disclosure relates to an electrostatic chuck and a method of manufacturing the same. A problem in that the yield of a wafer is reduced due to a partial destruction phenomenon attributable to thermal expansion of an electrostatic chuck is solved and the lifespan of a wafer is increased by making a coefficient of thermal expansion of a lower plate of an electrostatic chuck similar to a coefficient of thermal expansion of an upper plate of the electrostatic chuck.

The present disclosure provides a powder material that makes it possible to achieve higher flowability than before and to increase the crushing strength of particles. The powder material of the present disclosure has a dendritic structure 1. The dendritic structure 1 has a cemented carbide composition or a cermet composition.

A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.0, where a preferred thermal stress resistance could be designed for making highly hermetic sealed electronic package.

A three-dimensional shaped article production method according to the invention is a method for producing a three-dimensional shaped article by stacking layers formed in a predetermined pattern, wherein a series of steps including a composition supply step of supplying a composition containing a plurality of particles to a predetermined part, and a bonding step of bonding the particles by irradiation with a laser light is performed repeatedly, and the composition supply step includes a step of forming a first region using a first composition containing first particles as the composition, and a step of forming a second region using a second composition containing second particles which are different from the first particles as the composition, and the bonding of the particles in the first region and the bonding of the particles in the second region are performed by irradiation with laser lights with a different spectrum.

Provided is a method of producing a composite having high strength and high thermal conductivity. The method includes: an alloy preparation step including preparing an alloy which is a solid solution containing α-Fe as a solvent and at least one type of α-phase stabilizing element as a solute; a first mixing step including mixing at least one type of α-phase stabilizing element in powder form and SiC to prepare a first mixture; a second mixing step including mixing the alloy and the first mixture to prepare a second mixture; and a sintering step including sintering the second mixture.

A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 μm, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m.Math.K and a coefficient of linear expansion not greater than 10 ppm/K.

A computer-controlled method of component manufacture is disclosed, which includes winding a thread of material around a shaping element to form a first layer formed of adjacent turns of the thread. The winding is repeated to form a second layer of adjacent turns of the thread on top of the first layer. A laser beam is then applied between adjacent turns of each layer to attach them at predetermined points.