C23C14/087

COATED ARTICLE FOR HOT HYDROCARBON FLUID AND METHOD OF PREVENTING FUEL THERMAL DEGRADATION DEPOSITS

A hydrocarbon fluid containment article having a wall with a surface that is wetted by hydrocarbon fluid. The surface includes an anti-coking coating. The anti-coking coating includes a copper salt, a silver salt, or a combination thereof. A gas turbine engine component including a wall having a first surface and an anti-coking coating on the first surface of the wall that is wetted by hydrocarbon fluid. The anti-coking coating including a copper salt, a silver salt, or a combination thereof that prevents the formation of gum or coke on a surface thereon. Methods for reducing the deposition of thermal decomposition products on a wall of an article are also provided.

ANTI-MICROBIAL COATING PHYSICAL VAPOR DEPOSITION SUCH AS CATHODIC ARC EVAPORATION
20210388484 · 2021-12-16 ·

A bioactive coated substrate includes a base substrate, an outermost bioactive layer disposed over the base substrate, and a topcoat layer disposed on the outermost bioactive layer. Characteristically, the topcoat layer defines a plurality of pinholes that expose the outermost bioactive layer. A method for forming the bioactive coated substrate is also provided.

TRANSPARENT FILM WITH ENHANCED DURABILITY

A transparent film with enhanced durability is disclosed. The present invention provides a transparent film with enhanced durability including: a base layer; a first inorganic material layer stacked on a first surface of the base layer; a metal layer stacked on a first surface of the first inorganic material layer; a second inorganic material layer stacked on a a first surface of the metal layer; and a passivation layer configured to include a plurality of organic material layers stacked on a first surface of the second inorganic material layer.

METAL OXIDE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR EVALUATING METAL OXIDE FILM

A metal oxide film with high electrical characteristics is provided. A metal oxide film with high reliability is provided. The metal oxide film contains indium, M (M is aluminum, gallium, yttrium, or tin), and zinc. In the metal oxide film, distribution of interplanar spacings d determined by electron diffraction by electron beam irradiation from a direction perpendicular to a film surface of the metal oxide film has a first peak and a second peak. The top of the first peak is positioned at greater than or equal to 0.25 nm and less than or equal to 0.30 nm, and the top of the second peak is positioned at greater than or equal to 0.15 nm and less than or equal to 0.20 nm. The distribution of the interplanar spacings d is obtained from a plurality of electron diffraction patterns of a plurality of regions of the metal oxide film. The electron diffraction is performed using an electron beam with a beam diameter of greater than or equal to 0.3 nm and less than or equal to 10 nm.

Copper foil with carrier

An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.

ANTIMICROBIAL CU-BASED TOPCOAT
20210352907 · 2021-11-18 ·

A coated substrate includes a base substrate and a base layer disposed over the substrate. Typically, the base layer is composed of a component selected from the group consisting of zirconium carbonitrides, zirconium oxycarbides, titanium carbonitrides, titanium oxycarbides, and combinations thereof. One or more copper-containing antimicrobial layers are disposed over the base layer such that each of the one or more copper-containing antimicrobial layers includes copper atoms in the +1 oxidation state and/or the +2 oxidation state.

Thin film deposited inorganic metal oxide as a selective substrate for mammalian cell culture and as an implant coating

Disclosed herein is a material that may be useful as a coating for optical slides and medical implants. The material may aid or restrict grown of cells on a coating of the composite material. As such, there is provided a composite material having a substrate on the surface of which a coating layer of an amorphous metal oxide is formed. The metal oxide may be one or more of Ag.sub.2O, ZnO, ZrO.sub.2, TiO.sub.2, CuO, and Y.sub.2O.sub.3 and the coating layer may be from 5 to 100 nm thick and have a root mean square roughness of the coating surface is from 0.1 to 0.7 nm.

Gas turbine engine component with copper oxide coating

A formation method is provided. During this formation method, a metallic substrate is provided. A coating is deposited onto the metallic substrate using a suspension plasma spray process. The coating is formed from or otherwise includes copper oxide.

Anti-microbial coating physical vapor deposition such as cathodic arc evaporation

A bioactive coated substrate includes a base substrate, an outermost bioactive layer disposed over the base substrate, and a topcoat layer disposed on the outermost bioactive layer. Characteristically, the topcoat layer defines a plurality of pinholes that expose the outermost bioactive layer. A method for forming the bioactive coated substrate is also provided.

Binary Ag—Cu amorphous thin-films for electronic applications

An interconnect and a method of making an interconnect between one or more features on a substrate comprises: sputtering a noble metal-copper eutectic thin film under controlled power on an oxide grown or deposited on a substrate; and forming an amorphous alloy structure from the noble metal-copper eutectic thin film in the shape of the interconnect and the interconnect comprising no grain or grain boundaries without temperature sensitive resistivity.