The present invention provides a heating device for evaporation of an OLED material, which includes a crucible (1) for receiving and containing therein an OLED material (10), a lower heating coil (2) surrounding outside an outer circumference of the body section (11) of the crucible (1), an upper heating coil (3) surrounding outside an outer circumference of the top cover section (13) of the crucible (1), a lower thermally conductive temperature homogenizing sleeve (4) arranged between the body section (11) and the lower heating coil (2), an upper thermally conductive temperature homogenizing sleeve (5) arranged between the top cover section (13) and the upper heating coil (3), and a thermal insulation ring (6) arranged between the upper and lower thermally conductive temperature homogenizing sleeves (5, 4). The upper and lower heating coils (3, 2) are each connected to a power supply for individually controlling a heating temperature of each of the top cover section (13) and the body section (11). The heating device prevents gaseous molecules of the OLED material (10) from getting condensed and solidified at a gas release hole (131) of the crucible (1) so as to prevent jamming and blocking of the gas release hole (131).

A linear evaporation apparatus includes a thermal insulation chamber, and crucibles, evaporation material heaters and a mixing chamber installed in the thermal insulation chamber. The mixing chamber includes a flow limiting and adjusting layer, a flow channel adjusting member, a mixed layer and a linear evaporation layer. The flow limiting and adjusting layer is a rectangular sheet with flow limit holes corresponsive to the crucibles respectively; the flow channel adjusting member is an interconnected structure having at least one flow inlet corresponsive to some of the flow limit holes and at least one flow outlet, and the mixed layer is a substantially I-shaped sheet structure, and the linear evaporation layer is a rectangular sheet having a linear source evaporation opening tapered from both ends to the middle, so as to improve the uniformity of the thin film and the utilization of the evaporation materials.

The present disclosure relates to the field of display technology, particularly to a vacuum deposition apparatus and a vapor deposition method. The vacuum deposition apparatus includes a vacuum chamber and a rotary base, an evaporation source, and a plurality of vapor deposition zones arranged in series from bottom to top in the vacuum chamber, wherein the shape of the rotary base is a Reuleaux triangle, and the trajectories of movement of its vertices in the horizontal plane is a rounded square, the vapor deposition zones are arranged at intervals along the trajectories of movement of the vertices of the rotary base, the evaporation source is driven by the rotary base to pass below the vapor deposition zones sequentially, so that the evaporation source can be used to perform the vapor deposition operation in multiple directions simultaneously, thus improving the uniformity of film formation and utilization of the evaporation material.

The invention relates to a device for forming coatings on surfaces of a component, band-shaped material, or tool, in which at least one wire-shaped or band-shaped material (2.1 and/or 2.2) is used for forming the coating and that is/are connected to a direct electrical current source, wherein an electric arc is formed between wire-shaped materials (2.1 and 2.2) or between one wire-shaped or band-shaped material and one anode or cathode, wherein wire-shaped or band-shaped material (2.1 and/or 2.2) may be fed by means of a feed device; and melted and/or evaporated material of the wire-shaped or band-shaped material (2.1 and/or 2.2) flows, by means of a gas jet (3) of a gas or gas mixture, through an inlet into the interior of a chamber (4) that can be heated to a temperature that is at least equal to the evaporation temperature of the at least one material used for the coating or of the material with the highest evaporation temperature, and the material(s) completely evaporates and exits through at least one opening (5) present on the chamber (4) and impinges on the surface to be coated of the component or tool (6) for forming the coating.

A deposition source assembly for evaporating source material an apparatus including a deposition source assembly and a method of evaporating source materials with a deposition source assembly are described. The deposition source assembly includes a body including a source material reservoir and a distribution pipe assembly for guiding gaseous source material in a first direction and a second direction opposite to the first direction.

A deposition source and an organic layer deposition apparatus that may be simply applied to the manufacture of large-sized display apparatuses on a mass scale and may prevent or substantially prevent deposition source nozzles from being blocked during deposition of a deposition material, thereby improving manufacturing yield and deposition efficiency. A deposition source includes a first deposition source including a plurality of first deposition source nozzles, and a second deposition source including a plurality of second deposition source nozzles wherein the plurality of first deposition source nozzles and the plurality of second deposition source nozzles are tilted toward each other.

A vapor deposition device (1) performs a vapor deposition treatment to form a luminescent layer (47) having a predetermined pattern on a film formation substrate (40). The vapor deposition device includes: a nozzle (13) having a plurality of injection holes (16) from which vapor deposition particles (17), which constitute the luminescent layer, are injected toward the film formation substrate when the vapor deposition treatment is carried out; and a plurality of control plates (20) provided between the nozzle and the film formation substrate and restricting an incident angle, with respect to the film formation substrate, of the vapor deposition particles injected from the plurality of injection holes. The nozzle includes: a nozzle main body (14b) in a container shape having an opening (14c) on a surface thereof on a film formation substrate side and (ii) a plurality of blocks (15) covering the opening and separated from each other, each of the plurality of blocks having the plurality of injection holes. The above arrangement allows a vapor-deposited film pattern to be formed with high definition.

A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.

A method of forming metal nanostructures is a low temperature closed space vacuum deposition method. The method includes disposing a source material in an enclosed space at low evaporation temperatures to controllably form nanostructures of different dimensionalities on a substrate. The nanostructures have dimensionalities determined by a chosen evaporation temperature. An apparatus is also provided for performing the method.

A metal deposition source assembly includes a housing, a crucible disposed inside the housing, a heater disposed between the housing and the crucible, a nozzle disposed at an upper portion of the housing, and a bead layer disposed inside the crucible, the bead layer including a plurality of beads.