A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns; a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.

A vacuum deposition facility is provided for continuously depositing on a running substrate coatings formed from metal alloys including a main element and at least one additional element. The facility includes a vacuum deposition chamber and a substrate running through the chamber. The facility also includes a vapor jet coater, an evaporation crucible for feeding the vapor jet coater with a vapor having the main element and the at least one additional element, a recharging furnace for feeding the evaporation crucible with the main element in molten state and maintaining a constant level of liquid in the evaporation crucible, and a feeding unit being fed with the at least one additional element in solid state for feeding the evaporation crucible with the at least one additional element either in molten state, in solid state or partially in solid state. A process is also provided.

A depositing arrangement for evaporation of a material is disclosed herein. The depositing arrangement has an alkali metal or alkaline earth metal for deposition of the material on a substrate. The deposition arrangement has a first chamber configured for liquefying the material; a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve. The deposition arrangement has an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material; a heating unit to heat the material to higher temperatures before providing the liquid material in the evaporation zone; and one or more outlets for directing the vaporized material towards the substrate.

Printing apparatus includes a donor supply assembly, which positions a transparent donor substrate having opposing first and second surfaces and a donor film formed on the second surface so that the donor film is in proximity to a target area on an acceptor substrate. An optical assembly directs one or more beams of laser radiation to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection of material from the donor film onto the acceptor substrate. Means are provided to mitigate or compensate for the variation in reflection of the laser radiation across an area of the donor substrate, so as to equalize a flux of the laser radiation that is absorbed in the donor film across the area of the donor substrate.

The present disclosure provides generally for deposition of a material onto a substrate. More specifically, the present disclosure relates to systems and methods for continuous deposition of coating onto a substrate with an actively replenished replenishing material source. In some aspects, the deposition process may occur in a vacuum environment. In some embodiments, the deposition process may occur on site, such as during installation or manufacturing. In some implementations, the deposition process may occur in micro or zero gravity, and the installation or manufacturing may occur in space.

An apparatus for feeding liquid metal to an evaporator device in a vacuum chamber, wherein the apparatus includes a container adapted to contain a liquid metal, a feed tube from the closed container to the evaporator device and an electromagnetic pump provided in the feed tube, and wherein the electromagnetic pump is placed in a vacuum enclosure.

A device for vapor depositing metal is disclosed. The device includes a vapor-deposition chamber and a storage chamber. The storage chamber can be connected to the vapor-deposition chamber by an openable and closable isolating door. At least one storage unit configured to store at least one metal evaporation material is disposed in the storage chamber. At least one feeding unit in one-to-one correspondence with the at least one storage unit is disposed in the vapor-deposition chamber.

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to reusing, or recycling, unused donor material by recoating target substrates with donor material after a writing process is performed with the target substrate. Further, the technology relates to target substrates including a pattern of discrete separated dots to be individually ejected from the target substrate using LIFT.

A vacuum deposition facility is provided for continuously depositing on a running substrate coatings formed from metal alloys including a main element and at least one additional element. The facility includes a vacuum deposition chamber and a substrate running through the chamber. The facility also includes a vapor jet coater, an evaporation crucible for feeding the vapor jet coater with a vapor having the main element and the at least one additional element, a recharging furnace for feeding the evaporation crucible with the main element in molten state and maintaining a constant level of liquid in the evaporation crucible, and a feeding unit being fed with the at least one additional element in solid state for feeding the evaporation crucible with the at least one additional element either in molten state, in solid state or partially in solid state. A process is also provided.

Provided is a deposition apparatus for an organic light emitting diode, in which maint operations with deposition material are carried out independently by including an auxiliary chamber, thereby shortening the evaluation time of a deposition material.