C23C14/26

Powder for film formation and material for film formation

The present invention relates a coating powder comprising a rare earth oxyfluoride (Ln-O—F) and having: an average particle size (D.sub.50) of 0.1 to 10 μm, a pore volume of pores having a diameter of 10 μm or smaller of 0.1 to 0.5 cm.sup.3/g as measured by mercury intrusion porosimetry, and a ratio of the maximum peak intensity (S0) assigned to a rare earth oxide (Ln.sub.xO.sub.y) in the 2θ angle range of from 20° to 40° to the maximum peak intensity (S1) assigned to the rare earth oxyfluoride (Ln-O—F) in the same range, S0/S1, of 1.0 or smaller in powder X-ray diffractometry using Cu-Kα rays or Cu-Kα.sub.1 rays.

Powder for film formation and material for film formation

The present invention relates a coating powder comprising a rare earth oxyfluoride (Ln-O—F) and having: an average particle size (D.sub.50) of 0.1 to 10 μm, a pore volume of pores having a diameter of 10 μm or smaller of 0.1 to 0.5 cm.sup.3/g as measured by mercury intrusion porosimetry, and a ratio of the maximum peak intensity (S0) assigned to a rare earth oxide (Ln.sub.xO.sub.y) in the 2θ angle range of from 20° to 40° to the maximum peak intensity (S1) assigned to the rare earth oxyfluoride (Ln-O—F) in the same range, S0/S1, of 1.0 or smaller in powder X-ray diffractometry using Cu-Kα rays or Cu-Kα.sub.1 rays.

METHOD AND APPARATUS FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE FOR LIGHTING
20220199961 · 2022-06-23 ·

An apparatus and method for manufacturing an organic light emitting diode (OLED) for lighting are disclosed. The manufacturing apparatus includes a plurality of rolling members configured to move, in a transverse direction, a band-shaped base having holes formed at predetermined intervals at both width-direction ends thereof, and arranged at predetermined intervals along a movement direction of the base, and a deposition unit configured to discharge a vaporization material from a deposition source and sequentially depositing the discharged vaporization material on one surface of the base, along with the movement of the base. A plurality of protrusion members are formed on one surface of each of the rolling members, to move the base by being inserted in and released from the holes at both ends of the base along with rotation of the tolling members.

EVAPORATION SYSTEM AND EVAPORATION METHOD

An evaporation system and an evaporation method are provided. The present disclosure can accelerate production cycle, reduce production cost, and improve product quality by disposing an evaporation source vertically in a vacuum chamber and arranging a plurality of substrates on both sides of the evaporation source to perform evaporation on the substrates on the both sides.

METHOD OF MANUFACTURING AN ANODE STRUCTURE, VACUUM DEPOSITION SYSTEM, ANODE STRUCTURE, AND LITHIUM BATTERY LAYER STACK
20220190308 · 2022-06-16 ·

A method of manufacturing an anode structure (10) for a lithium battery is described. The method includes a first deposition of lithium on a first flexible support (21) to provide a lithium anode-first sublayer (12-1) with a first lithium surface (31); a second deposition of lithium on a second flexible support (22) to provide a lithium anode-second sublayer (12-2) with a second lithium surface (32); and combining the lithium anode-first sublayer (12-1) and the lithium anode-second sublayer (12-2) by pressing the first lithium surface and the second lithium surface together to form a lithium metal anode layer (12). Further described are a lithium battery layer stack with an anode structure manufactured according to the described method, and a vacuum deposition system for manufacturing an anode structure as described herein.

Deposition mask and production method of deposition mask

A wall surface of an opening of a deposition mask includes a first wall surface that extends from a first end toward a second surface, a second wall surface that extends from a second end toward a first surface, and a connection at which the first wall surface is connected to the second wall surface. When the opening is viewed from the first surface side along a normal direction of the first surface, the first end of the opening includes a first portion that extends in a first direction and has a first dimension and a second portion that extends in a second direction intersecting the first direction and a second dimension shorter than the first dimension. The first wall surface includes a first wall surface section that extends from the first portion toward the connection and a second wall surface section that extends from the second portion toward the connection. A height of the first wall surface section is lower than a height of the second wall surface section.

Lateral-type vacuum deposition apparatus, and source block and source assembly for the same

The present disclosure relates to a lateral-type vacuum deposition apparatus, and a source block and a source assembly for the same. Disclosed are a source block that may simplify a lateral-type vacuum deposition apparatus and a lateral-type vacuum deposition apparatus using the same. The source block has a predetermined shape. In the lateral-type vacuum deposition apparatus, the substrate and the source block may face away each other. Accordingly, the lateral-type vacuum deposition apparatus including the source block is free of a conduit for transferring a vaporized source to a nozzle, thereby simplifying a structure of the apparatus. In particular, the source block may have a visible light transmittance of at least about 10% and may exhibit excellent shape maintenance ability during a lateral-type vacuum deposition process.

VAPOR DEPOSITION UNIT AND VACUUM VAPOR DEPOSITION APPARATUS PROVIDED WITH VAPOR DEPOSITION UNIT
20220145443 · 2022-05-12 · ·

A vapor deposition unit of this invention is provided with: a container box for containing therein a vapor deposition material; and a heating means for heating the vapor deposition material inside the container box, and which has formed in one plane of the container box a discharge opening for discharging a sublimated or evaporated vapor deposition material as a result of heating. The vapor deposition unit is further provided, inside a storing chamber, with a moving means for moving the vapor deposition unit. Provided that a direction looking toward the opening in the storing chamber is defined as an upper side, the moving means moves the vapor deposition unit disposed in the storing chamber in an up-and-down direction in a posture coinciding with a phase of the discharge opening.

VAPOR DEPOSITION UNIT AND VACUUM VAPOR DEPOSITION APPARATUS PROVIDED WITH VAPOR DEPOSITION UNIT
20220145443 · 2022-05-12 · ·

A vapor deposition unit of this invention is provided with: a container box for containing therein a vapor deposition material; and a heating means for heating the vapor deposition material inside the container box, and which has formed in one plane of the container box a discharge opening for discharging a sublimated or evaporated vapor deposition material as a result of heating. The vapor deposition unit is further provided, inside a storing chamber, with a moving means for moving the vapor deposition unit. Provided that a direction looking toward the opening in the storing chamber is defined as an upper side, the moving means moves the vapor deposition unit disposed in the storing chamber in an up-and-down direction in a posture coinciding with a phase of the discharge opening.

Coating, method for coating, and coated cutting tool
11731202 · 2023-08-22 · ·

A coating includes a first base layer including a nitride of at least Al and Cr, a second base layer including a nitride of at least Al and Cr overlying the first base layer, and an outermost indicator layer overlying the second base layer. The first base layer has a positive residual compressive stress gradient. The second base layer has substantially constant residual compressive stresses. The outermost indicator layer includes a nitride of Si and Me, wherein Me is at least one of Ti, Zr, Hf, and Cr. The outermost indicator layer has residual compressive stresses that are less than the residual compressive stresses of the second base layer.