Patent classifications
C23C14/3464
DEVICE, METHOD AND USE FOR THE COATING OF LENSES
A device and a method for the coating of lenses. The lenses which are to be coated are arranged in pairs over parallel tubular targets such that they each overlap both a homogeneous and an inhomogeneous removal region of the target and the lenses rotated so that an especially uniform coating can be achieved.
Textured processing chamber components and methods of manufacturing same
Processing chamber components and methods of manufacture of same are provided herein. In some embodiments, a component part body includes a component part body having a base plane and at least one textured surface region, wherein the at least one textured surface region comprises a plurality of independent surface features having a first side having at least a 45 degree angle with respect to the base plane. In at least some embodiments, the textured surface includes a plurality of independent surface features which are pore free.
METHOD FOR PRODUCING PHOTOCATALYST ELECTRODE FOR WATER DECOMPOSITION
Provided is a method for producing a photocatalyst electrode for water decomposition that exhibits excellent detachability between the substrate and the photocatalyst layer and exhibits high photocurrent density. The method for producing a photocatalyst electrode for water decomposition of the invention includes: a metal layer forming step of forming a metal layer on one surface of a first substrate by a vapor phase film-forming method or a liquid phase film-forming method; a photocatalyst layer forming step of forming a photocatalyst layer by subjecting the metal layer to at least one treatment selected from an oxidation treatment, a nitriding treatment, a sulfurization treatment, or a selenization treatment; a current collecting layer forming step of forming a current collecting layer on a surface of the photocatalyst layer, the surface being on the opposite side of the first substrate; and a detachment step of detaching the first substrate from the photocatalyst layer.
SPUTTERING APPARATUS AND METHOD FOR FORMING SEMICONDUCTOR FILM USING SPUTTERING APPARATUS
A novel sputtering apparatus capable of separating functions can be provided. A sputtering apparatus is capable of forming a semiconductor film and includes a first target, a first power source connected to the first target, a first shutter facing the first target, a first driver portion connected to the first shutter, a second target, a second power source connected to the second target, a second shutter facing the second target, and a second driver portion connected to the second shutter. The first driver portion and the second driver portion operate in conjunction with each other.
FLUORINATED COUPLING AGENTS AND FLUORINATED (CO)POLYMER LAYERS MADE USING THE SAME
Fluorinated coupling agents and polymerizable compositions including such fluorinated coupling agents and at least one free-radically polymerizable monomer, oligomer, or mixture thereof. Multilayer films including a substrate and at least a first layer overlaying a surface of the substrate also are described, in which the at least first layer includes a (co)polymer obtained by polymerizing the foregoing polymerizable compositions. Processes for making a multilayer film using the polymerizable composition also are taught. Articles including the multilayer film also are disclosed, in which the article preferably is selected from a photovoltaic device, a display device, a solid-state lighting device, a sensor, a medical or biological diagnostic device, an electrochromic device, light control device, or a combination thereof.
METHOD FOR DEPOSITING A COATING ON A SUBSTRATE
A method for depositing a coating on a substrate (100), including a step of depositing a thin intermetallic layer (110) on the substrate (100), so as to obtain, at the end of this step, an external part (10) having a predetermined final colour.
METHOD FOR DEPOSITING A COATING ON A SUBSTRATE
A method for depositing a coating on a substrate (100), including successively depositing a thin intermetallic layer (110) on the substrate (100), so as to obtain an external part (10), and annealing the external part (10) in a dedicated enclosure.
Method and Apparatus for Deposition of Multilayer Device with Superconductive Film
A physical vapor deposition system includes a chamber, three target supports to targets, a movable shield positioned having an opening therethrough, a workpiece support to hold a workpiece in the chamber, a gas supply to deliver nitrogen gas and an inert gas to the chamber, a power source, and a controller. The controller is configured to move the shield to position the opening adjacent each target in turn, and at each target cause the power source to apply power sufficient to ignite a plasma in the chamber to cause deposition of a buffer layer, a device layer of a first material that is a metal nitride suitable for use as a superconductor at temperatures above 8° K on the buffer layer, and a capping layer, respectively.
PROTECTED ITEM INCLUDING A PROTECTIVE COATING
There is disclosed a protected item including an item that needs protection and a protective coating having a hardness of at least about 8 on the Mohs scale. The protected item includes a light transmission in part or all of the visible wavelength of at least about 60% and a light reflection in the visible wavelength of about 4% or less.
MULTISURFACE SIMULTANEOUS SPUTTERING AND SHUTTERING
A deposition system comprises a vacuum chamber having a cylindrical inner wall, a cylindrical parts carousel disposed concentrically inside the cylindrical inner wall of the vacuum chamber, and one or more deposition sources arranged to flow deposition material onto the cylindrical parts carousel. A cylindrical shutter assembly is disposed concentrically inside the cylindrical inner wall of the vacuum chamber, and has (1) a shuttered position in which the cylindrical shutter assembly blocks the one or more deposition sources from depositing onto the parts carousel and (2) an unshuttered position in which the cylindrical shutter assembly does not block the one or more deposition sources from depositing onto the parts carousel. A drive train rotates the cylindrical shutter assembly between the shuttered and unshuttered positions. The drive train not operatively connected to rotate the cylindrical parts carousel. The deposition sources may include inner and outer sputter sources.