C23C16/34

FILM FORMING METHOD, FILM FORMING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
20230037960 · 2023-02-09 ·

A film forming method includes: providing the substrate into the processing container; forming a metal-based film on the substrate within the processing container; and subsequently, supplying a Si-containing gas into the processing container in a state in which the substrate is provided within the processing container.

UV CURE FOR LOCAL STRESS MODULATION

Localized stresses can be modulated in a film deposited on a bowed semiconductor substrate by selectively and locally curing the film by ultraviolet (UV) radiation. A bowed semiconductor substrate can be asymmetrically bowed. A UV-curable film is deposited on the front side or the backside of the bowed semiconductor substrate. A mask is provided between the UV-curable film and a UV source, where openings in the mask are patterned to selectively define exposed regions and non-exposed regions of the UV-curable film. Exposed regions of the UV-curable film modulate localized stresses to mitigate bowing in the bowed semiconductor substrate.

Film forming method and film forming apparatus

There is provided a film forming method including: adsorbing fluorine onto a substrate on which a region in which a nitride film is exposed and a region in which an oxide film is exposed are provided adjacent to each other by supplying a fluorine-containing gas to the substrate, and forming a stepped surface on a side surface of the oxide film by selectively etching the nitride film, among the nitride film and the oxide film, so as to cause a surface of the nitride film to be more deeply recessed than a surface of the oxide film; and after the adsorbing the fluorine onto the substrate and forming the stepped surface, selectively forming a semiconductor film on the nitride film, among the nitride film and the oxide film, by supplying a raw material gas including a semiconductor material to the substrate.

Coating system having synthetic oxide layers

A coating system for a turbine engine component is disclosed. The coating system includes a substrate, an optional bond coat, a synthetic oxide layer and a top coat. The synthetic oxide layer is formed by atomic layer deposition and includes two or more oxides.

Coating system having synthetic oxide layers

A coating system for a turbine engine component is disclosed. The coating system includes a substrate, an optional bond coat, a synthetic oxide layer and a top coat. The synthetic oxide layer is formed by atomic layer deposition and includes two or more oxides.

STRUCTURE AND MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE FILTER WITH BACK ELECTRODE OF PIEZOELECTRIC LAYER
20230008048 · 2023-01-12 ·

A fabrication method of a surface acoustic wave (SAW) filter includes obtaining a piezoelectric substrate, forming a back electrode on a first portion of the piezoelectric substrate, forming a first dielectric layer on the first portion of the piezoelectric substrate, forming a trench in the first dielectric layer, forming a second dielectric layer on the first dielectric layer formed with the trench, forming a third dielectric layer on the second dielectric layer, removing a second portion of the piezoelectric substrate to obtain a piezoelectric layer, forming an interdigital transducer (IDT) on the piezoelectric layer, and etching and releasing a portion of the first dielectric layer surrounded by the trench to form a cavity below the back electrode.

STRUCTURE AND MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE FILTER WITH BACK ELECTRODE OF PIEZOELECTRIC LAYER
20230008048 · 2023-01-12 ·

A fabrication method of a surface acoustic wave (SAW) filter includes obtaining a piezoelectric substrate, forming a back electrode on a first portion of the piezoelectric substrate, forming a first dielectric layer on the first portion of the piezoelectric substrate, forming a trench in the first dielectric layer, forming a second dielectric layer on the first dielectric layer formed with the trench, forming a third dielectric layer on the second dielectric layer, removing a second portion of the piezoelectric substrate to obtain a piezoelectric layer, forming an interdigital transducer (IDT) on the piezoelectric layer, and etching and releasing a portion of the first dielectric layer surrounded by the trench to form a cavity below the back electrode.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, RECORDING MEDIUM, AND METHOD OF PROCESSING SUBSTRATE
20230037898 · 2023-02-09 · ·

There is provided a technique that includes (a) supplying a first-element-containing gas to the substrate; (b) supplying a first reducing gas to the substrate; (c) supplying a second reducing gas, which is different from the first reducing gas, to the substrate; (d) supplying a third reducing gas, which is different from both the first reducing gas and the second reducing gas, to the substrate; (e) after a start of (a), performing (b) in parallel with (a); (f) in (e), performing (d) in parallel with (b); and (g) forming a first-element-containing film on the substrate by alternately performing (e) and (c) a predetermined number of times.

WEAR RESISTANT COATINGS FOR TOOL DIES
20180001511 · 2018-01-04 ·

A tool die for forming a green ceramic body. The tool die has a wear resistant coating that is deposited on a substrate and has an outer or free surface having a morphology that provides a mean roughness in a range from about 0.03 μm up to about 0.8 μm Rq. In one embodiment, the wear resistant coating has multiple alternating layers of fine grained and coarse grained materials. Methods of making the tool die and wear resistant coating are also provided.

WEAR RESISTANT COATINGS FOR TOOL DIES
20180001511 · 2018-01-04 ·

A tool die for forming a green ceramic body. The tool die has a wear resistant coating that is deposited on a substrate and has an outer or free surface having a morphology that provides a mean roughness in a range from about 0.03 μm up to about 0.8 μm Rq. In one embodiment, the wear resistant coating has multiple alternating layers of fine grained and coarse grained materials. Methods of making the tool die and wear resistant coating are also provided.