Patent classifications
C23C16/545
GAS BARRIER FILM, OPTICAL FILM, AND FLEXIBLE DISPLAY
This invention provides a gas barrier film, which can suppress blocking and winding deviation, and an optical film using the gas barrier film.
The gas barrier film includes a flexible substrate and an inorganic thin film layer formed on at least one surface of the flexible substrate. A static friction coefficient between one surface of the gas barrier film and the other surface is not less than 0.85 and not more than 2.0, and when a 50 mm-square portion cut from the gas barrier film is placed on a horizontal surface such that a central portion of the 50 mm-square portion is in contact with the horizontal surface, an average value of distances from the horizontal surface to four corners of the 50 mm-square portion is not more than 2 mm.
NOZZLE EXIT CONTOURS FOR PATTERN COMPOSITION
A deposition nozzle is provided that includes offset deposition apertures disposed between exhaust apertures on either side of the deposition apertures. The provided nozzle arrangements allow for deposition of material with a deposition profile suitable for use in devices such as OLEDs.
METHOD FOR FORMING SEALING FILM, AND SEALING FILM
A method for forming a sealing film, in which a buffer layer and a barrier layer whose density is higher than that of the buffer layer are alternately formed on a substrate, includes forming a first buffer layer on a surface of the substrate, forming a first barrier layer on a surface of the first buffer layer, and forming a second buffer layer on a surface of the first barrier layer. A ratio of a thickness of a portion of the first buffer layer in a thickness direction of the substrate relative to a thickness of a portion of the first buffer layer in an inclined direction that is inclined with respect to the thickness direction is closer to 1 than a ratio of a thickness of a portion of the second buffer layer in the thickness direction relative to a thickness of a portion of the second buffer layer in the inclined direction.
LAMINATED FILM AND PROCESS FOR MANUFACTURING THE SAME
An object of the present invention is to provide a laminated film which can prevent transmission of the water vapor at the high level, and can suppress prevention of dark spots over a long period of time when used as a supporting substrate of an electronic device such as an organic EL element, and the present invention provides a laminated film comprising at least a gas barrier layer and an inorganic polymer layer being laminated on a resin substrate, wherein the arithmetic average height (Sa) of a surface of the inorganic polymer layer is 20 nm or less, and the NH.sub.3 gas generation amount per unit mass of the inorganic polymer layer when the laminated film comprising the inorganic polymer layer is accommodated in a sample chamber, and the interior of the sample chamber is heated at 85° C. for 1 hour while the humidified air at 25° C. and 85% RH is flown through the sample chamber is 5000 mass ppm or less.
LAMINATED FILM AND PROCESS FOR MANUFACTURING THE SAME
An object of the present invention is to provide a laminated film which can prevent transmission of the water vapor at the high level, and has good flex resistance, and the present invention provides a laminated film comprising at least a gas barrier layer and an inorganic polymer layer being laminated on a resin substrate, wherein concerning a distance from a surface of the inorganic polymer layer in a film thickness direction of the layer and the ratio of an oxygen atom to a total amount of a silicon atom, an oxygen atom, a carbon atom and a nitrogen atom (oxygen atomic ratio), the ratio of a value of the oxygen atomic ratio O/(total amount of Si, O, C and N) in a region from a surface on a side opposite to the gas barrier layer up to 30% of a film thickness of the inorganic polymer in a depth direction to a value of the oxygen atomic ratio O/(total amount of Si, O, C and N) in a region from 30% of a film thickness of the inorganic polymer layer in a depth direction up to a surface on a side of the gas barrier layer is 1.05 or more.
Chemical vapor deposition process for depositing zinc oxide coatings, method for forming a conductive glass article and the coated glass articles produced thereby
A CVD process for depositing a zinc oxide coating is provided. The CVD process includes providing a moving glass substrate. The CVD process also includes forming a gaseous mixture of an alkyl zinc compound and an inert gas as a first stream, providing a first gaseous inorganic oxygen-containing compound in a second stream and providing a second gaseous inorganic oxygen-containing compound in the second stream, a third stream or in both the second and third streams. Additionally, the CVD process includes mixing the streams at or near a surface of the moving glass substrate and a zinc oxide coating is formed thereon. A method for forming a coated glass article is also provided. Additionally, a coated glass article is provided.
LAMINATED FILM AND FLEXIBLE ELECTRONIC DEVICE
The invention provides a gas barrier laminated film having high impact resistance when a heterolayer is formed on a thin film layer. The laminated film includes a flexible substrate and a thin film layer formed on at least one surface of the substrate, wherein the thin film layer contains Si, O, and C, and the ratio of the number of carbon atoms to the number of silicon atoms which is calculated using peaks each corresponding to each binding energy of 2p of Si, 1s of O, 1s of N, and 1s of C obtained from wide scan spectrums is in the range defined by the following formula (1) when the surface of the thin film layer is subjected to X-ray photoelectron spectrometry, and a intensity ratio of a peak intensity (I.sub.2) at 1240 to 1290 cm.sup.−1 to a peak intensity (Ii) at 950 to 1050 cm.sup.−1 is in the range defined by the following formula (2) when the surface of the thin film layer is measured by an ATR method in infrared spectrometry:
0.01<C/Si≦0.02 (1)
0.01≦I.sub.2/I.sub.1<0.05 (2)
METHOD OF COATING A FLEXIBLE SUBSTRATE IN A R2R DEPOSITION SYSTEM, AND VAPOR DEPOSITION SYSTEM
A method of coating a flexible substrate in a roll-to-roll deposition system is described. The method includes unwinding the flexible substrate from an unwinding roll, the flexible substrate having a first coating on a first main side thereof; measuring a lateral positioning of the first coating while guiding the flexible substrate to a coating drum; adjusting a lateral position of the flexible substrate on the coating drum depending on the measured lateral positioning of the first coating; and depositing a second coating on the flexible substrate, particularly on a second main side of the flexible substrate opposite the first main side. Further described is a vacuum deposition apparatus for conducting the methods described herein.
Method and apparatus for forming a substrate web track in an atomic layer deposition reactor
An apparatus and method for forming a substrate web track with a repeating pattern into a reaction space of a deposition reactor by moving a first set of support rolls in relation to a second set of support rolls.
A PROCESS FOR PREPARATION OF A COMPOSITE LAYER OR A LAMINATE, AND PRODUCT OBTAINED THEREWITH
The invention relates to a process for preparing a composite layer, by applying an oligomeric organic compound layer on a substrate with a metal or metal oxide layer by vapour deposition, comprising the steps of (a) providing a substrate layer, (b) applying a metal or metal oxide layer under reduced pressure on said substrate, and (c) vapour depositing the oligomeric organic compound on the metal or metal oxide layer while the film remains at reduced pressure, wherein the oligomeric compound is evaporated from an oligomeric or polymeric compound comprising a stabiliser, or wherein the oligomeric compound is amorphous, or has a high solubility in certain solvents.