C23C18/1225

PHOTOCATALYTIC COATING AND METHOD OF MAKING SAME
20170291169 · 2017-10-12 · ·

Described herein are methods for coating a substrate with a photocatalytic compound, and photocatalytic elements prepared by these methods.

METHOD OF FORMING A THERMAL BARRIER COATING
20170279024 · 2017-09-28 ·

A method of forming a thermal barrier coating is disclosed. The method may include providing a solution containing strontium and niobium and applying the solution to a substrate via a chemical solution deposition process to form a first film layer on the substrate. The method may further include pyrolyzing the first film layer and annealing the first film in an air atmosphere to form a strontium niobate coating.

INORGANIC POLYSILAZANE RESIN

An inorganic polysilazane resin of the present invention has a Si/N ratio (i.e. a ratio of contained silicon atoms to contained nitrogen atoms) of 1.30 or more. The inorganic polysilazane resin having such a high Si content can be produced by, for example, a method in which an inorganic polysilazane compound containing both Si—NH and Si—Cl is heated to react NH with Cl, a method in which a silazane oligomer (polymer) that leaves no Si—Cl bond is synthesized and a dihalosilane is added to the synthesized silazane oligomer (polymer) to perform a thermal reaction, and the like. A siliceous film can be formed by, for example, applying a coating composition containing the inorganic polysilazane resin onto a base plate and then dried and the dried product is then oxidized by bringing the dried product into contact with water vapor or hydrogen peroxide vapor and water vapor under heated conditions.

Formation of corrosion-resistant coating
09739169 · 2017-08-22 · ·

A coating process comprising applying to a surface a coating composition consisting essentially of an alkali metal silicate and an aqueous liquid phase having dispersed therein solid aluminum particles to form on the surface a wet coating; and drying said wet coating: under conditions which convert said wet coating to an electrically conductive, corrosion-resistant, solid coating; or under conditions which form a solid coating which is not electrically conductive (non-conductive) and thereafter treating said non-conductive coating under conditions which convert said non-conductive coating to an electrically conductive, corrosion-resistant coating.

METHOD FOR PRODUCING A COATING LAYER COATED ONTO THE INNER SURFACE OF A CONTAINER AND A CONTAINER OBTAINED WITH SUCH A METHOD
20170327414 · 2017-11-16 · ·

A method for producing a layer for coating the inner surface of a container and a glass or plastic container obtained by said method, wherein said container is suitable for containing products biocompatible with humans and/or animals. The method includes: forming a solution containing a solvent, water, a molecular precursor comprising alkoxy groups and an acid as a catalyst, mixing said solution to initiate hydrolysis and condensation, applying the resulting solution onto at least one portion of the inner surface of the container, while the solution is in the process of gelling, the resulting applied solution is then dried at a temperature for a predetermined time, before curing. The acid is citric acid, wherein said citric acid is at a concentration of less than 6 mol/l, and in that the solution comprises less than 1.5 units of precursor for each volume unit of acid.

Additive Manufacturing of Polymer Derived Ceramics
20170233300 · 2017-08-17 · ·

A layer by layer additive manufacturing system from liquid polymers for producing dense and defect free polymer-derived ceramic bodies of a three dimensional architecture.

Multilayer structure offering improved impermeability to gases

A multilayer structure including a substrate and a first stack of a layer of SiO.sub.2 and a layer of material of the SiO.sub.xN.sub.yH.sub.z type positioned between the substrate and the layer of SiO.sub.2, in which the layer of SiO.sub.2 and the layer of material of the SiO.sub.xN.sub.yH.sub.z type have thicknesses (e.sub.B, e.sub.A) such that the thickness of the layer of SiO.sub.2 is less than or equal to 60 nm, the thickness of the layer of material of the SiO.sub.xN.sub.yH.sub.z type (e.sub.B) is more than twice the thickness (e.sub.A) of the layer of SiO.sub.2, and the sum of the thicknesses of the layer of SiO.sub.2 and of the layer of material of the SiO.sub.xN.sub.yH.sub.z type is between 100 nm and 500 nm, and in which z is strictly less than the ratio (x+y)/5, and advantageously z is strictly less than the ratio (x+y)/10.

Electrode for Electrolysis
20220235477 · 2022-07-28 · ·

The present disclosure relates to an electrode for electrolysis which includes a metal base layer, and a coating layer containing a ruthenium oxide, a cerium oxide, and a nickel oxide, wherein the coating layer is formed on at least one surface of the base layer. The electrode for electrolysis of the present disclosure is characterized by exhibiting excellent durability and improved overvoltage.

BARRIER FILM

Provided is a barrier film, comprising: a base layer; and an inorganic layer including Si, N, and O, wherein the inorganic layer has a thickness of 600 nm or less, and the film has a water vapor transmission rate of 0.5×10.sup.−3 g/m.sup.2.Math.day as measured under conditions of a temperature of 38° C. and 100% relative humidity. The barrier film has excellent barrier properties and optical properties and can be used for electronic products sensitive to moisture.

BARRIER FILM

Provided is a barrier film comprising a base layer, and an inorganic layer including Si, N, and O, and including a first region and a second region, which have different elemental contents (atomic %) of Si, N, and O from each other as measured by XPS, wherein the film has a water vapor transmission rate of 5.0×10.sup.−4 g/m.sup.2.Math.day or less as measured under conditions of a temperature of 38° C. and 100% relative humidity after being stored at 85° C. and 85% relative humidity conditions for 250 hours, or wherein the inorganic layer has a compactness expressed through an etching rate of 0.17 nm/s in the thickness direction for an Ar ion etching condition to etch Ta.sub.2O.sub.5 at a rate of 0.09 nm/s. The barrier film has excellent barrier properties and optical properties and can be used for electronic products that are sensitive to moisture and the like.