A web transport system for transporting a web of media along a web transport path in an in-track direction, including a liquid application system for applying a liquid to at least one surface of the web of media. An air skive is positioned along the web transport path downstream of the liquid application system, wherein the air skive directs one or more streams of air onto the web of media thereby removing at least some of the liquid that is being carried along with the web of media. A vapor source adds a vapor into the one or more streams of air provided by the air skive before the one or more streams of air are directed onto the web of media.

A viscous liquid feed nozzle has a nozzle body having a thin and long hole with a front end serving as a feed port. The nozzle is used with a viscous liquid feed unit to feed a viscous liquid such as a viscous adhesive from the feed port. The nozzle has a lubricative plated layer at least on the inside and outside of the feed port. The lubricative plated layer is formed by electroless plating by immersing the nozzle in a plating tank containing a lubricative plating solution. A base end of the nozzle body may have a wide port. In this case, the lubricative plated layer is formed by immersing the nozzle body in the plating tank containing the lubricative plating solution so that the lubricative plating solution enters the wide port and by applying pressure or gravity to the lubricative plating solution in the wide port to pass the lubricative plating solution through the thin and long hole of the nozzle body and discharge the same from the feed port. The viscous liquid feed nozzle with the lubricative plated layer is capable of stably feeding a very small quantity of a viscous liquid.

A plating method can improve adhesivity with a substrate. The plating method of performing a plating process on the substrate includes forming a vacuum-deposited layer 2A on the substrate 2 by performing a vacuum deposition process on the substrate 2; forming an adhesion layer 21 and a catalyst adsorption layer 22 on the vacuum-deposited layer 2A of the substrate 2; and forming a plating layer stacked body 23 having a first plating layer 23a and a second plating layer 23b which function as a barrier film on the catalyst adsorption layer 22 of the substrate 2. By forming the vacuum-deposited layer 2A, a surface of the substrate 2 can be smoothened, so that the vacuum-deposited layer 2A serving as an underlying layer can improve the adhesivity.

Provided is a device and a method for forming a metal plating film having a thick film thickness by a solid substitution-type electroless plating method. The present disclosure relates to a film formation device for forming a film of a first metal on a plating film of a second metal by a solid substitution-type electroless plating method, comprising: a conductive mounting base; a third metal; an insulating material; a microporous membrane; a plating bath chamber; and a pressing unit, wherein the third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal, and wherein the insulating material is installed between a base material and the third metal so as to contact respective materials of the base material and the third metal when the base material having the plating film of the second metal is installed.

Method and apparatus for producing metal-coated optical fiber involves providing a length of optical fiber having a glass fiber with or without a carbon layer surrounded by a liquid-soluble polymeric coating. The optical fiber is passed through a series of solution baths such that the fiber will contact the solution in each bath for a predetermined dwell time, the series of solution baths effecting removal of the polymer coating and subsequent electroless plating of metal on the glass fiber. The optical fiber is collected after metal plating so that a selected quantity of the metal-coated optical fiber is gathered, Preferably, the glass fiber passes through the series of solution baths without contacting anything except for the respective solution in each.

An electroless semiconductor bonding structure, an electroless plating system and an electroless plating method of the same are provided. The electroless semiconductor bonding structure includes a first substrate and a second substrate. The first substrate includes a first metal bonding structure disposed adjacent to a first surface of the first substrate. The second substrate includes a second metal bonding structure disposed adjacent to a second surface of the second substrate. The first metal bonding structure connects to the second metal bonding structure at an interface by electroless bonding and the interface is substantially void free.

A copper-coated palladium-containing particle dispersion in which copper-coated palladium-containing particles, which are obtained by coating surfaces of palladium-containing particles with copper, are dispersed is prepared, a platinum ion-containing solution is prepared, and a shell is formed by mixing the copper-coated palladium-containing particle dispersion and the platinum ion-containing solution with each other in a microreactor to displace copper of the copper-coated palladium-containing particle surfaces with platinum. The microreactor includes at least a first supply flow path, a second supply flow path, a joint portion in which the first supply flow path and the second supply flow path are joined to each other, and a discharge flow path. An orifice portion is provided midway in the discharge flow path. A pressure applied to the orifice portion in the displacement step is 2 MPa or higher.

Systems and methods for nickel plating include providing a tank that retains a plating bath into which a substrate is submerged, and creating a horizontal flow of processing solution in the plating bath to assist in carrying contaminants out of the plating bath. A sparger box may be positioned in the tank to deliver the processing solution into the plating bath in a horizontal direction. The processing solution, which carries the contaminants, may exit the plating bath through a plate member that includes a plurality of orifices and is also positioned in the tank. The orifices may have a variable opening size to help control outflow of the processing solution.

A substrate entire region treatment process of discharging a processing fluid of a temperature different from a surface temperature of a substrate 3 from a first nozzle 24 toward the substrate is performed while moving the first nozzle toward an outer side from an entire region treatment start position P2 located at a central portion to an entire region treatment end position P5 located at a peripheral portion. Then, after moving the first nozzle toward an inner side to a peripheral region treatment start position P6 located at an outer position than the entire region treatment start position P2, a substrate peripheral region treatment process of discharging the processing fluid from the first nozzle toward the substrate is performed while moving the first nozzle toward the outer side from the peripheral region treatment start position P6 to a peripheral region treatment stop position P7 located at a peripheral portion.

A plating apparatus, a plating method and a recording medium can allow a temperature of a wafer to be uniform within a surface thereof. A plating apparatus 1 includes a substrate holding unit 52 configured to hold a substrate W; a plating liquid supply unit 53 configured to supply a plating liquid M1 to the substrate W; and a solvent supply unit 55a configured to supply a solvent N1 having a different temperature from a temperature of the plating liquid M1 to the substrate W. The solvent N1 is supplied to a preset position on the substrate W from the solvent supply unit 55a after the plating liquid M1 is supplied to the substrate W from the plating liquid supply unit 53.