C23C22/24

Nanocrystalline material based on stainless steel surface, and preparation method therefor

A nanocrystalline material based on a stainless steel surface. In percentage by weight, the nanocrystalline material comprises: 0 to 3% of carbon, 20% to 35% of oxygen, 40% to 53% of chromium, 10% to 35% of ferrum, 0 to 4% of molybdenum, 1% to 4% of nickel, 0 to 2.5% of silicon, 0 to 2% of calcium, and the balance of impurity elements. Also disclosed is a preparation method for the nanocrystalline material, and the nanocrystalline material that is based on a stainless steel surface and that is prepared by using the preparation method.

Nanocrystalline material based on stainless steel surface, and preparation method therefor

A nanocrystalline material based on a stainless steel surface. In percentage by weight, the nanocrystalline material comprises: 0 to 3% of carbon, 20% to 35% of oxygen, 40% to 53% of chromium, 10% to 35% of ferrum, 0 to 4% of molybdenum, 1% to 4% of nickel, 0 to 2.5% of silicon, 0 to 2% of calcium, and the balance of impurity elements. Also disclosed is a preparation method for the nanocrystalline material, and the nanocrystalline material that is based on a stainless steel surface and that is prepared by using the preparation method.

Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus

To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

ELECTRONIC DEVICE HOUSING, MANUFACTURING METHOD OF SAME, AND METAL-RESIN COMPOSITE

Provided is an electronic device housing including a metal member and a plastic antenna cover that are joined and integrated by insert molding. In this electronic device housing, the plastic antenna cover is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250° C.

STAINLESS STEEL STRUCTURE EXCELLENT IN HYDROGEN EMBRITTLEMENT RESISTANCE AND CORROSION RESISTANCE AND METHOD FOR MANUFACTURING THE SAME

[Problem] To propose a stainless steel structure excellent in hydrogen embrittlement resistance and corrosion resistance, being high in mass productivity, simple in device structure, low in equipment cost, and having a high cost advantage, and a method for manufacturing the same.

[Solving means] It is stainless steel having hydrogen embrittlement resistance and corrosion resistance, a surface of electrolytically polished stainless steel being coated with a film obtained by passivating a metal oxide formed by a wet process, wherein the film thickness of the film obtained by passivating the metal oxide formed by a wet process is greater than 100 nm. A hydrogen permeability ratio (film-formed product/film-unformed product) is equal to or less than 2.0×10.sup.−2, and a relative reduction of area (under a hydrogen atmosphere of 110 MPa/under a nitrogen atmosphere of 10 MPa) in an SSRT test is equal to or greater than 0.8. It includes a polishing treatment step, a film-forming step, a curing treatment step, and a passivation treatment step, and the passivation treatment step consists of at least two or more independent passivation treatment steps.

METHOD FOR PROCESSING A RAW WORKPIECE INTO A FINAL WORKPIECE

A method for processing a raw workpiece into a final workpiece is described, wherein the raw workpiece includes a metallic structure including silicon particles dispersed therein. The raw workpiece is fabricated employing an additive manufacturing process, in one embodiment. The method includes heat-treating the raw workpiece to produce an intermediate workpiece, wherein the heat-treating includes subjecting the raw workpiece to a first temperature environment for a time period to produce an intermediate workpiece to form agglomerated silicon particles, wherein the agglomerated silicon particles are disposed on a surface of the raw workpiece. The method further includes removing the agglomerated silicon particles that are disposed on the surface of the intermediate workpiece.

LAMINATE
20210197516 · 2021-07-01 · ·

An object of the present invention is to provide a laminate having high scratch resistance, weather fastness and solvent resistance, and capable of achieving both light-transmitting properties and metallic luster. The laminate includes a metal foil having a plurality of through-holes that pass through in a thickness direction; and a protective layer provided on at least one surface of the metal foil, in which the protective layer contains a metal oxide, the metal foil has an average opening diameter of the through-holes of 0.1 μm to 100 μm and an average opening ratio, which is determined by the through-holes, of 0.1% to 90%, and the protective layer has a light transmittance of 10% or more.

HIGH-DESIGN SLIDING MEMBER

A sliding member includes, on a surface of a metal substrate, a surface-treated layer including a zinc-electroplated layer, a chemical conversion-treated layer, and a topcoat layer sequentially stacked on the metal substrate. The chemical conversion-treated layer includes chromium and oxygen. The topcoat layer includes at least one material selected from the group consisting of a silica compound, acrylic resin, polyurethane resin, epoxy resin, phenol resin, and melamine resin. A method of manufacturing the sliding member includes a step of forming, on a surface of the chemical conversion-treated layer, the topcoat layer including at least one material selected from the group consisting of a silica compound, acrylic resin, polyurethane resin, epoxy resin, phenol resin, and melamine resin.

LOW TEMPERATURE ATOMIC LAYER DEPOSITED TOPCOATS FOR PRETREATED ALUMINUM
20210115568 · 2021-04-22 ·

A method for coating a substrate includes forming a conversion coat layer, depositing a protective coat onto the protective coat onto the conversion coat, and depositing a corrosion resistant top coat onto the protective coat. The conversion coat layer is formed by applying a conversion coat onto the substrate. The protective coat is deposited using a first atomic layer deposition. The corrosion resistant top coat is deposited using a second atomic layer deposition. The conversion coat layer has a volatizing temperature, and the first atomic layer deposition is performed at a deposition temperature that is no greater than 1.3 times the volatizing temperature of the conversation coat layer, calculated in Kelvin.

ELECTROLYTIC COPPER FOIL, ELECTRODE COMPRISING THE SAME, SECONDARY BATTERY COMPRISING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
20210050598 · 2021-02-18 ·

Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with such electrolytic copper foil so that high productivity can be guaranteed. An electrolytic copper foil of the disclosure has a longitudinal rising of 30 mm or less and a transverse rising of 25 mm or less, and the transverse rising is 8.5 times the longitudinal rising or less.