Patent classifications
C
CHEMISTRY; METALLURGY
Load children
C23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
Load children
C23C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
Load children
22/00
Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
Load children Filter patents View analytics View as hierarchy Open in page
C23C22/06
using aqueous acidic solutions with pH less than 6
Load children Filter patents View analytics View as hierarchy Open in page
C23C22/24
containing hexavalent chromium compounds
Load children Filter patents View analytics View as hierarchy Open in page

C23C22/24

Metal Material and Use Thereof in Preparing Metal Model
20250269565 · 2025-08-28 · ·

The present invention provides a metal material and use thereof in preparing a metal model. The metal material comprises the following ingredients in percentage by weight: C0.06%, Si1.00%, 1.00%Mn4.00%, P0.045%, S0.005%, 20.00%Cr22.00%, 8.50%Ni10.50%, 1.00%Mos2.50%, 1.00%Cu3.50%, 0.20%N0.30%, with the balance being Fe; the pitting resistance equivalent number (PREN) of the metal material is calculated according to the formula: PREN=Cr %+3.3M0%+16N %, and the result is PREN30.0%

SURFACE-TREATED COPPER FOIL WITH HEAT RESISTANCE, AND COPPER CLAD LAMINATE AND PRINTED WIRING BOARD INCLUDING THE SAME
20250365863 · 2025-11-27 · ·

Disclosed is a surface-treated copper foil having long-term high-temperature reliability and being suitable for use in high-frequency circuits due to a low transmission loss, wherein the surface-treated copper foil has a surface treatment layer, the surface treatment layer including: a primary particle layer containing Cu or Cu alloy particles formed on at least one surface of an original copper foil; and a secondary particle layer containing Zn particles formed on the primary particle layer, the secondary particle layer being composed of particle clusters formed by clustering of a plurality of Zn particles.