This disclosure relates to etching compositions containing 1) at least one oxidizing agent; 2) at least one chelating agent; 3) at least one metal corrosion inhibitor; 4) at least one organic solvent; 5) at least one amidine base; and 6) water.

This disclosure relates to etching compositions containing 1) at least one oxidizing agent; 2) at least one chelating agent; 3) at least one metal corrosion inhibitor; 4) at least one organic solvent; 5) at least one amidine base; and 6) water.

Compositions and methods for etching a nanoscale geometry on a metal or metal alloy surface are disclosed. Such surfaces, when included on an implantable medical device, enhance healing after surgery. When included on a bone contacting medical implant, the nanoscale geometry may enhance osseointegration. When included on a tissue contacting device, the nanoscale geometry may enhance endothelial cell attachment, proliferation, and restoration of a healthy endothelial surface.

Disclosed are a composite material, a shell for a mobile device, their manufacturing methods, and a mobile device. The composite material includes: a first metal substrate (100); a first resin fiber plate (200) disposed on an upper surface of the first metal substrate; an antenna layer (300) disposed on an upper surface of the first resin fiber plate; a second resin fiber plate (400) disposed on an upper surface of the antenna layer; and a second metal substrate (500) disposed on an upper surface of the second resin fiber plate.

Disclosed are a composite material, a shell for a mobile device, their manufacturing methods, and a mobile device. The composite material includes: a first metal substrate (100); a first resin fiber plate (200) disposed on an upper surface of the first metal substrate; an antenna layer (300) disposed on an upper surface of the first resin fiber plate; a second resin fiber plate (400) disposed on an upper surface of the antenna layer; and a second metal substrate (500) disposed on an upper surface of the second resin fiber plate.

A method according for the manufacturing of a component in which walls surround a cavity and the cavity is accessible through at least one aperture formed in one of the walls, according to the following steps: manufacturing of the component by an additive method, in which metallic powder particles are applied to a support layer by layer in a process chamber, and the walls are each manufactured after the application of a layer of the metallic powder particles by melting by means of an energy beam along a predetermined path, connection of the aperture to a flushing device, supply of a liquid etchant into the cavity by means of the flushing device, selective dissolution by the etchant of power particles connected to each other only via sinter necks and/or fusible links and flushing of the etchant and the dissolved powder particles out of the cavity.

A substrate processing method includes preparing a substrate, removing at least a part of a first metal layer, and precipitating a second metal layer. In the preparing of the substrate, the substrate having the first metal layer formed on a front surface thereof is prepared. In the removing of at least the part of the first metal layer, at least the part of the first metal layer formed on a peripheral portion of the substrate is removed. In the precipitating of the second metal layer, the second metal layer is precipitated on the front surface of the substrate by using the first metal layer as a catalyst after the removing of at least the part of the first metal layer.

Atomic layer etching (ALE) processes are disclosed. In some embodiments, the methods comprise at least one etch cycle in which a substrate comprising a metal, metal oxide, metal nitride or metal oxynitride layer is contacted with an etch reactant comprising an vapor-phase N-substituted derivative of amine compound. In some embodiments the etch reactant reacts with the substrate surface to form volatile species including metal atoms from the substrate surface. In some embodiments a metal or metal nitride surface is oxidized as part of the ALE cycle. In some embodiments a substrate surface is contacted with a halide as part of the ALE cycle. In some embodiments a substrate surface is contacted with a plasma reactant as part of the ALE cycle.

Atomic layer etching (ALE) processes are disclosed. In some embodiments, the methods comprise at least one etch cycle in which a substrate comprising a metal, metal oxide, metal nitride or metal oxynitride layer is contacted with an etch reactant comprising an vapor-phase N-substituted derivative of amine compound. In some embodiments the etch reactant reacts with the substrate surface to form volatile species including metal atoms from the substrate surface. In some embodiments a metal or metal nitride surface is oxidized as part of the ALE cycle. In some embodiments a substrate surface is contacted with a halide as part of the ALE cycle. In some embodiments a substrate surface is contacted with a plasma reactant as part of the ALE cycle.

One exemplary embodiment of this disclosure relates to a method of forming an engine component. The method includes forming an engine component having an internal passageway, the internal passageway formed with an initial dimension. The method further includes establishing a flow of machining fluid within the internal passageway, the machining fluid changing the initial dimension.