The disclosure relates to a cleaning composition that aids in the removal of post-etch residues and aluminum-containing material, e.g., aluminum oxide, in the production of semiconductors that utilize an aluminum-containing etch stop layer. The compositions have a high selectivity for post-etch residue and aluminum-containing materials relative to low-k dielectric materials, cobalt-containing materials and other metals on the microelectronic device.

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 5) at least one quaternary ammonium hydroxide; and 6) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

The present invention relates to a method for substantially nickel-free phosphating of a metallic surface, wherein a metallic surface is treated one after the other with the following compositions: i) with an alkaline, aqueous cleaner composition which comprises at least one water-soluble silicate, and ii) with an acidic, aqueous, substantially nickel-free phosphating composition which comprises zinc ions, manganese ions and phosphate ions.

The invention also relates to the above cleaner composition itself and also to a metallic surface phosphate-coated by the above method, and to the use of said surface.

The present invention relates to a method for substantially nickel-free phosphating of a metallic surface, wherein a metallic surface is treated one after the other with the following compositions: i) with an alkaline, aqueous cleaner composition which comprises at least one water-soluble silicate, and ii) with an acidic, aqueous, substantially nickel-free phosphating composition which comprises zinc ions, manganese ions and phosphate ions.

The invention also relates to the above cleaner composition itself and also to a metallic surface phosphate-coated by the above method, and to the use of said surface.

A composition for application to a metal substrate comprises an aqueous carrier, a hydroxide anion and/or a phosphate anion, and a corrosion inhibitor comprising an azole compound, a rare earth ion, an alkali earth metal ion, and/or a transition metal ion. A substrate or article includes the composition for application to a metal substrate and a coating on the composition. A method of fabricating a substrate comprises applying the composition to a substrate, allowing the composition to dry to form a dried composition, and applying a coating on the dried composition.

A composition for application to a metal substrate comprises an aqueous carrier, a hydroxide anion and/or a phosphate anion, and a corrosion inhibitor comprising an azole compound, a rare earth ion, an alkali earth metal ion, and/or a transition metal ion. A substrate or article includes the composition for application to a metal substrate and a coating on the composition. A method of fabricating a substrate comprises applying the composition to a substrate, allowing the composition to dry to form a dried composition, and applying a coating on the dried composition.

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 5) at least one quaternary ammonium hydroxide; and 6) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

This disclosure relates to a cleaning composition that contains 1) hydroxylamine in an amount of from about 0.5% to about 20% by weight of the composition; 2) a pH adjusting agent, the pH adjusting agent being a base free of a metal ion and in an amount of at most about 3% by weight of the composition; 3) an alkylene glycol; and 4) water; in which the pH of the composition is from about 7 to about 11. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

This disclosure relates to a cleaning composition that contains 1) hydroxylamine in an amount of from about 0.5% to about 20% by weight of the composition; 2) a pH adjusting agent, the pH adjusting agent being a base free of a metal ion and in an amount of at most about 3% by weight of the composition; 3) an alkylene glycol; and 4) water; in which the pH of the composition is from about 7 to about 11. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

The invention relates to a method for removing and/or decolourizing metal stains on a surface of a substrate composed of aluminium or aluminium alloy, the method comprising the consecutive steps of (a) providing the substrate comprising metal stains on the surface, said metal stains having a metal stain surface area; (b) providing an aqueous treatment liquid comprising one or more components selected from the group consisting of galactaric acid and galactarate salts; and (c) treating at least part of the surface of the substrate by contacting at least part of the metal stain surface area with the aqueous treatment liquid, wherein the aqueous treatment liquid is free of phosphorus- and/or acrylate-containing compounds and wherein the pH of the aqueous treatment liquid is between 6.5 and 10.9. The invention further concerns the resulting products and the use of the aqueous treatment liquid for removing and/or decolourizing metal stains on a surface of a substrate composed of aluminium or aluminium alloy.