A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

A system and method for producing a rigid, heat-resistant part, such as a superalloy, via electrodeposition. The method can include the steps of coating a secondary alloy particulate with a superior alloy, forming a pre-coated particulate, dispensing a quantity of the pre-coated particulate into a container of an electrolytic solution, and applying a charge to the electrolytic solution such that the pre-coated particulate is electrodeposited onto a cathode or an external casing of the cathode. The pre-coated particulate can include particulate of non-uniform size and/or shape. The secondary alloy particulate is protected in the catalytic solution by the superior alloy coated thereon, such as nickel, iron, cobalt, and/or copper. The method also includes a step of vibrating or agitating the electrolytic solution before and/or during applying the charge to the electrolytic solution for even distribution of the pre-coated particulate onto the cathode or an external casing thereof.

A composite layer of carbon nanotubes and metal such as copper is formed by electrodeposition. The layer has a thickness of at least 10 ?m. The carbon nanotubes are distributed through the layer and are present in the layer at a volume fraction of at least 0.001 vol % and at most 65 vol %. The volume fraction is based on the total volume of the metal and carbon nanotubes and not including any pore volume. The carbon nanotubes are substantially uniformly plated with the metal. The composite layer has a density ratio satisfying Player Pmetal ?0.35 where player is the bulk density of the composite layer of thickness of at least 10 ?m, including any voids that are present in the composite layer and pmetal is the volumetric mass density material property of the metal. The composite layer is of use in evaporation-condensation apparatus, as an active material layer in an electrochemical device or in an electroforming process.

A composite layer of carbon nanotubes and metal such as copper is formed by electrodeposition. The layer has a thickness of at least 10 ?m. The carbon nanotubes are distributed through the layer and are present in the layer at a volume fraction of at least 0.001 vol % and at most 65 vol %. The volume fraction is based on the total volume of the metal and carbon nanotubes and not including any pore volume. The carbon nanotubes are substantially uniformly plated with the metal. The composite layer has a density ratio satisfying Player Pmetal ?0.35 where player is the bulk density of the composite layer of thickness of at least 10 ?m, including any voids that are present in the composite layer and pmetal is the volumetric mass density material property of the metal. The composite layer is of use in evaporation-condensation apparatus, as an active material layer in an electrochemical device or in an electroforming process.

A component can be formed having an integral monolithic body. The integral monolithic body can be formed utilizing electroforming processes such as electrodeposition of metal alloys. The electroformed monolithic body can be formed utilizing multiple anodes powered by multiple power sources. The monolithic body can have differing local material properties determined during formation of the component.

A component can be formed having an integral monolithic body. The integral monolithic body can be formed utilizing electroforming processes such as electrodeposition of metal alloys. The electroformed monolithic body can be formed utilizing multiple anodes powered by multiple power sources. The monolithic body can have differing local material properties determined during formation of the component.

A method of manufacturing an identifiable element, includes: providing or receiving a display layer, which includes an bistable layer, an electrode layer, an conductive transparent layer, and a light-trigger electric change layer, in which the electrode layer and the conductive transparent layer are disposed at opposite sides of the electrophoretic layer, and the light-trigger electric change layer is disposed between the electrophoretic layer and the conductive transparent layer; applying a voltage bias across the electrode layer and the conductive transparent layer; and providing a light illuminating a portion of the light-trigger electric change layer through the conductive transparent layer to change a display status of a region of the bistable layer corresponding to the illuminated portion, whereby forming a display pattern in the display layer. An identifiable element is provided herein as well.

A method of manufacturing an identifiable element, includes: providing or receiving a display layer, which includes an bistable layer, an electrode layer, an conductive transparent layer, and a light-trigger electric change layer, in which the electrode layer and the conductive transparent layer are disposed at opposite sides of the electrophoretic layer, and the light-trigger electric change layer is disposed between the electrophoretic layer and the conductive transparent layer; applying a voltage bias across the electrode layer and the conductive transparent layer; and providing a light illuminating a portion of the light-trigger electric change layer through the conductive transparent layer to change a display status of a region of the bistable layer corresponding to the illuminated portion, whereby forming a display pattern in the display layer. An identifiable element is provided herein as well.

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.