A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K.sup.−1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K.sup.−1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K.sup.−1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.

Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.

Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I ##STR00001##
or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant,
wherein D.sup.6 is, for each repeating unit 1 to s independently, a divalent group selected from a saturated or unsaturated C.sub.1-C.sub.20 organic radical, D.sup.7 is, for each repeating unit 1 to s independently, a divalent group selected from straight chain or branched C.sub.2-C.sub.20 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, R.sup.1 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.2, may form a divalent group D.sup.8, and R.sup.2 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.1, may form a divalent group D.sup.8, and D.sup.8 is selected from straight chain or branched C.sub.1-C.sub.18 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, s is an integer from 1 to 250, R.sup.10 is selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I ##STR00001##
or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant,
wherein D.sup.6 is, for each repeating unit 1 to s independently, a divalent group selected from a saturated or unsaturated C.sub.1-C.sub.20 organic radical, D.sup.7 is, for each repeating unit 1 to s independently, a divalent group selected from straight chain or branched C.sub.2-C.sub.20 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, R.sup.1 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.2, may form a divalent group D.sup.8, and R.sup.2 is, for each repeating unit 1 to s independently, selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R.sup.1, may form a divalent group D.sup.8, and D.sup.8 is selected from straight chain or branched C.sub.1-C.sub.18 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR.sup.10, s is an integer from 1 to 250, R.sup.10 is selected from H, C.sub.1-C.sub.20 alkyl, and C.sub.1-C.sub.20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

The present disclosure provides a manufacturing method of indium tin oxide, including: providing a first electrolyte including choline chloride, urea, indium chloride, boric acid, and ascorbic acid; disposing a workpiece, wherein at least a part of the workpiece is in contact with the first electrolyte; heating the first electrolyte to 60° C.-95° C.; applying a first operating current to electroplate indium onto the workpiece; providing an second electrolyte including choline chloride, urea, tin chloride, boric acid, and ascorbic acid; disposing the indium-coated workpiece, wherein at least a part of the workpiece is in contact with the second electroplate; heating the second electroplate to 60° C.-95° C.; applying a second operating current to electroplate tin onto the workpiece; and annealing the indium and tin on the workpiece to form indium tin oxide in an oxygen environment.

The present disclosure provides a manufacturing method of indium tin oxide, including: providing a first electrolyte including choline chloride, urea, indium chloride, boric acid, and ascorbic acid; disposing a workpiece, wherein at least a part of the workpiece is in contact with the first electrolyte; heating the first electrolyte to 60° C.-95° C.; applying a first operating current to electroplate indium onto the workpiece; providing an second electrolyte including choline chloride, urea, tin chloride, boric acid, and ascorbic acid; disposing the indium-coated workpiece, wherein at least a part of the workpiece is in contact with the second electroplate; heating the second electroplate to 60° C.-95° C.; applying a second operating current to electroplate tin onto the workpiece; and annealing the indium and tin on the workpiece to form indium tin oxide in an oxygen environment.

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.