C25D3/32

Silver/Tin Electroplating Bath and Method of Using the Same

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths

Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.

Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths

Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.

METAL MATERIAL WITH THERMODYNAMIC ANISOTROPY AND A METHOD OF PREPARING THE SAME
20220127742 · 2022-04-28 ·

A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K.sup.−1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K.sup.−1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K.sup.−1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESSING AGENT

Described herein is an aqueous composition including tin ions and at least one compound of formula I

##STR00001## wherein X.sup.1 is selected from a linear or branched C.sub.1-C.sub.12 alkanediyl, which may optionally be interrupted by O or S or a C.sub.5 to C.sub.12 aromatic moiety, R.sup.11 is a copolymer of ethylene oxide and a further C.sub.3 to C.sub.6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight, R.sup.11 is selected from H, R.sup.11, R.sup.40, R.sup.13, R.sup.14 are (a) independently selected from H, R.sup.11, R.sup.40, or (b) may together form a divalent group X.sup.13; X.sup.13 is selected from a linear or branched C.sub.1-C.sub.12 alkanediyl, which may optionally be interrupted by O, S or NR.sup.43; R.sup.40 is H or a linear or branched C.sub.1-C.sub.20 alkyl, R.sup.43 is selected from H, R.sup.11 and a linear or branched C.sub.1-C.sub.20 alkyl.

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESSING AGENT

Described herein is an aqueous composition including tin ions and at least one compound of formula I

##STR00001## wherein X.sup.1 is selected from a linear or branched C.sub.1-C.sub.12 alkanediyl, which may optionally be interrupted by O or S or a C.sub.5 to C.sub.12 aromatic moiety, R.sup.11 is a copolymer of ethylene oxide and a further C.sub.3 to C.sub.6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight, R.sup.11 is selected from H, R.sup.11, R.sup.40, R.sup.13, R.sup.14 are (a) independently selected from H, R.sup.11, R.sup.40, or (b) may together form a divalent group X.sup.13; X.sup.13 is selected from a linear or branched C.sub.1-C.sub.12 alkanediyl, which may optionally be interrupted by O, S or NR.sup.43; R.sup.40 is H or a linear or branched C.sub.1-C.sub.20 alkyl, R.sup.43 is selected from H, R.sup.11 and a linear or branched C.sub.1-C.sub.20 alkyl.

Plating liquid

This plating liquid contains (A) a soluble salt that contains at least a stannous salt, (B) an acid selected from organic acids and inorganic acids or a salt thereof, and (C) two kinds of surfactants of an amine-based surfactant (C1) and a nonionic surfactant(s) (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant(s) (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropviene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1+n2) is 40-50. In formula (3), (m1+m2) is 15-30 and n is 40-50.

Plating liquid

This plating liquid contains (A) a soluble salt that contains at least a stannous salt, (B) an acid selected from organic acids and inorganic acids or a salt thereof, and (C) two kinds of surfactants of an amine-based surfactant (C1) and a nonionic surfactant(s) (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant(s) (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropviene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1+n2) is 40-50. In formula (3), (m1+m2) is 15-30 and n is 40-50.

Tin or tin alloy plating solution

A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent, ##STR00001##
here, in the Formula (1), X is C.sub.aH.sub.2a (a is 1 or 3) and m is 2 to 12.

Tin or tin alloy plating solution

A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent, ##STR00001##
here, in the Formula (1), X is C.sub.aH.sub.2a (a is 1 or 3) and m is 2 to 12.