C25D3/40

Reactor for electrochemical deposition

An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit configured to receive a signal containing anode address data and configured to output a signal causing an anode array pattern; and, a first controller being a current controller configured to control a flow of current to the anode array; a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit; and a third controller configured to clear bubbles which have formed on the anode after a length of time of steady state deposition by controlling the flow of the electrolyte solution across the anode array surface.

METAL SHEET FOR SEPARATORS OF POLYMER ELECTROLYTE FUEL CELLS, AND METAL SHEET FOR MANUFACTURING THE SAME

A metal sheet for separators of polymer electrolyte fuel cells comprises: a substrate made of metal; and a surface-coating layer with which a surface of the substrate is coated, with a strike layer in between, wherein a coating ratio of the strike layer on the substrate is 2% to 70%, the strike layer is distributed in a form of islands, and a maximum diameter of the islands of the strike layer as coating portions is 1.00 m or less and is not greater than a thickness of the surface-coating layer.

METAL DEPOSITION METHODS FOR FORMING BIMETALLIC STRUCTURES, BATTERIES INCORPORATING BIPOLAR CURRENT COLLECTORS MADE THEREFROM, AND APPLICATIONS THEREOF

In certain aspects, electrolytic deposition and electroless displacement deposition methods are provided to form bimetallic structures that may be used as a bipolar current collector in a battery or a substrate for forming graphene sheets. In other aspects, bipolar current collectors for lithium-ion based electrochemical cells are provided. The bimetallic current collector may have an aluminum-containing surface and a continuous copper coating. In other aspects, a flexible substrate may be coated with one or more conductive materials, like nickel, copper, graphene, aluminum, alloys, and combinations thereof. The flexible substrate is folded to form a bipolar current collector. New stack assemblies for lithium-ion based batteries incorporating such bipolar current collectors are also provided that can have cells with a tab-free and/or weld-free design.

PLATED MATERIAL AND CONNECTING TERMINAL USING SAME
20180112322 · 2018-04-26 ·

Provided are a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

PLATED MATERIAL AND CONNECTING TERMINAL USING SAME
20180112322 · 2018-04-26 ·

Provided are a plated material having excellent abrasion resistance, electrical conductivity, sliding performance, and low friction, in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The method includes a first step of at least partially removing a reflow tin plating layer from a metallic base material having the reflow layer on at least a part thereof and a reactive layer provided at the interface between the reflow layer and the base material; a second step of at least partially subjecting a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of at least partially subjecting the nickel plating layer to a silver strike plating treatment; and a fourth step of at least partially subjecting a region of the silver strike plating to a silver plating treatment.

Magnet electroplating

Coatings for magnetic materials, such as rare earth magnets, are described. The coatings are designed to reduce or prevent the release of one or both of nickel and cobalt from the coatings or from the underlying magnetic material. The coatings are designed to resist corrosion and release of nickel and cobalt when exposed to moist conditions. The coatings are also designed to be robust enough to withstand damage due to scratch forces. In some embodiments, the coatings include multiple layers of one or of metal and non-metal materials. The coated magnets are well suited for use in the manufacture of wearable consumer products.

Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition

An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.

Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition

An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.

Electrochemical Layer Deposition by Anode Array Using Measurement Information

An apparatus and method for electrochemically depositing a layer using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, at least one sensor and a microcontroller programmed with instructions that when executed by the microcontroller cause the microcontroller to (i) control the current or voltage applied to one anode of the plurality of anodes; (ii) measure the current or the voltage of one anode of the plurality of anodes using the at least one sensor to create a measurement information; (iii) interpret the measurement information causing the microcontroller to send signals to one or more anodes in the anode array to modify their voltage and/or current to cause a localized deposition of the unitary layer structure or the series of unitary layer structures.

Electrochemical Layer Deposition by Anode Array Using Measurement Information

An apparatus and method for electrochemically depositing a layer using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, at least one sensor and a microcontroller programmed with instructions that when executed by the microcontroller cause the microcontroller to (i) control the current or voltage applied to one anode of the plurality of anodes; (ii) measure the current or the voltage of one anode of the plurality of anodes using the at least one sensor to create a measurement information; (iii) interpret the measurement information causing the microcontroller to send signals to one or more anodes in the anode array to modify their voltage and/or current to cause a localized deposition of the unitary layer structure or the series of unitary layer structures.