An electrolyte may be provided. The electrolyte may include at least one additive configured to decompose or evaporate at a temperature above approximately 100 C., and a water soluble metal salt, and the electrolyte may be free from carbon nanotubes. In various embodiments, a method of forming a metal layer may be provided: The method may include depositing a metal layer on a carrier using an electrolyte, wherein the electrolyte may include at least one additive configured to decompose or evaporate at a temperature above approximately 100 C. and a water soluble metal salt, wherein the electrolyte is free from carbon nanotubes; and annealing the metal layer to form a metal layer comprising a plurality of pores. In various embodiments, a semiconductor device may be provided. The semiconductor device may include a metal layer including a plurality of pores, wherein the plurality of pores may be formed in the metal layer as remnants of an additive having resided in the plurality of pores and having at least partially decomposed or evaporated. To keep a high elasticity over a wide temperature range (up to 450 C.), an adhesion layer may stabilize the metal grain boundaries and may fix dislocation gliding inside metal grains. In various embodiments, a metal layer is provided. The metal layer may include a plurality of pores having ellipsoidal or spheroidal shape.

This invention relates to a platinum electrodeposition bath which is capable of forming platinum deposits having an attractive shiny granular surface like a velvet, which is particularly useful in jewelry manufacturing. The velvet effect can be illustrated by comparing the surface roughness with a bright smooth platinum deposit.

This invention relates to a platinum electrodeposition bath which is capable of forming platinum deposits having an attractive shiny granular surface like a velvet, which is particularly useful in jewelry manufacturing. The velvet effect can be illustrated by comparing the surface roughness with a bright smooth platinum deposit.

The present invention relates to a method for production of a noble metal salt preparation, the noble metal salt preparation comprising at least one noble metal sulfonate and thiourea and the use for surface coating by electroplating or electroless plating of a noble metal or metal alloy.

The present invention relates to a method for production of a noble metal salt preparation, the noble metal salt preparation comprising at least one noble metal sulfonate and thiourea and the use for surface coating by electroplating or electroless plating of a noble metal or metal alloy.

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

A thermal barrier-coated Ni alloy component includes: a substrate made of a Ni alloy containing Al; an intermediate layer formed on a surface of the substrate; and a thermal barrier layer made of a ceramic and formed on a surface of the intermediate layer. The intermediate layer includes a layer, which is formed from a -Ni.sub.3Al phase on the surface on the thermal barrier layer side, and contains Pt.

A thermal barrier-coated Ni alloy component includes: a substrate made of a Ni alloy containing Al; an intermediate layer formed on a surface of the substrate; and a thermal barrier layer made of a ceramic and formed on a surface of the intermediate layer. The intermediate layer includes a layer, which is formed from a -Ni.sub.3Al phase on the surface on the thermal barrier layer side, and contains Pt.

The present application relates to the technical field of electroplating, and particularly to a bonding copper wire plated with palladium and gold and an electroplating process thereof. The electroplating process includes: electroplating a first palladium layer on a surface of a copper wire with a first palladium plating solution, electroplating a second gold layer with a first gold plating solution to obtain a semi-finished product, electroplating a third palladium layer onto the semi-finished product with a second palladium plating solution, and electroplating a fourth gold layer with a second gold plating solution to obtain a finished product; and the first palladium plating solution comprises tetraamminepalladium acetate, 4-sulfamoylbenzoic acid and 6-azauracil.