The present application relates to the technical field of electroplating, and particularly to a bonding copper wire plated with palladium and gold and an electroplating process thereof. The electroplating process includes: electroplating a first palladium layer on a surface of a copper wire with a first palladium plating solution, electroplating a second gold layer with a first gold plating solution to obtain a semi-finished product, electroplating a third palladium layer onto the semi-finished product with a second palladium plating solution, and electroplating a fourth gold layer with a second gold plating solution to obtain a finished product; and the first palladium plating solution comprises tetraamminepalladium acetate, 4-sulfamoylbenzoic acid and 6-azauracil.

An aqueous electrolyte for the deposition of a metal layer on a substrate surface as well as a method for the deposition of a metal layer on a substrate surface by which electrolyte and in which method the formation of airborne emissions above the surface of the electrolyte in a plating tank is significantly reduced or more preferably omitted. The aqueous electrolyte composition according to the invention comprises at least one surfactant in a concentration affecting a dynamic surface tension of the composition of 35 mN/m.

The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, comprising: a) providing a first system having ligands and amine functional groups, the first system being constituted by an aqueous solution of an amino ligand comprising at least one compound X(NH.sub.2).sub.n, where X belongs to the group constituted by (CH.sub.3, CH.sub.3CH.sub.2, CH.sub.3(CH.sub.2).sub.m), or NH.sub.3 or an xP.sup.(NH.sub.4).sup.+.sub.p salt where x is an acid radical belonging to the group constituted by (PO.sub.4.sup.3, HPO.sub.4.sup.2, H.sub.2PO.sub.4.sup., HPO.sub.4.sup.2and H.sub.2PO.sub.4.sup., SO.sub.4.sup.2, HSO.sub.4.sup., H.sub.2SO.sub.4, HSO.sub.4.sup., and H.sub.2SO.sub.4, CH.sub.3COO.sup., CH.sub.3COOH, and CH.sub.3COO.sup.), or H.sub.2SO.sub.4, or CH.sub.3COOH, and where n, m, and p are non-zero integers; b) providing a second system forming a buffer system; c) providing a third system providing a metallic salt, and constituted by an aqueous solution of platinum; d) providing a fourth system suitable for imparting the conduction property to the medium; and e) mixing together the four systems so as to obtain the electrolyte bath.

The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, comprising: a) providing a first system having ligands and amine functional groups, the first system being constituted by an aqueous solution of an amino ligand comprising at least one compound X(NH.sub.2).sub.n, where X belongs to the group constituted by (CH.sub.3, CH.sub.3CH.sub.2, CH.sub.3(CH.sub.2).sub.m), or NH.sub.3 or an xP.sup.(NH.sub.4).sup.+.sub.p salt where x is an acid radical belonging to the group constituted by (PO.sub.4.sup.3, HPO.sub.4.sup.2, H.sub.2PO.sub.4.sup., HPO.sub.4.sup.2and H.sub.2PO.sub.4.sup., SO.sub.4.sup.2, HSO.sub.4.sup., H.sub.2SO.sub.4, HSO.sub.4.sup., and H.sub.2SO.sub.4, CH.sub.3COO.sup., CH.sub.3COOH, and CH.sub.3COO.sup.), or H.sub.2SO.sub.4, or CH.sub.3COOH, and where n, m, and p are non-zero integers; b) providing a second system forming a buffer system; c) providing a third system providing a metallic salt, and constituted by an aqueous solution of platinum; d) providing a fourth system suitable for imparting the conduction property to the medium; and e) mixing together the four systems so as to obtain the electrolyte bath.

A physiological characteristic sensor, a method for forming a physiological characteristic sensor, and a method for forming a platinum deposit having a rough surface are presented here. The method for forming a physiological characteristic sensor includes immersing a sensor electrode in a platinum electrolytic bath. Further, the method includes performing an electrodeposition process by sequentially applying a pulsed signal to the sensor electrode, wherein the pulsed signal includes a repeated cycle of a first current and a second current different from the first current, and applying a non-pulsed continuous signal to the sensor electrode, wherein the non-pulsed continuous signal includes a non-repeated application of a third current, to form a platinum deposit on the sensor electrode.

A physiological characteristic sensor, a method for forming a physiological characteristic sensor, and a method for forming a platinum deposit having a rough surface are presented here. The method for forming a physiological characteristic sensor includes immersing a sensor electrode in a platinum electrolytic bath. Further, the method includes performing an electrodeposition process by sequentially applying a pulsed signal to the sensor electrode and applying a non-pulsed continuous signal to the sensor electrode to form a platinum deposit on the sensor electrode.

A physiological characteristic sensor, a method for forming a physiological characteristic sensor, and a method for forming a platinum deposit having a rough surface are presented here. The method for forming a physiological characteristic sensor includes immersing a sensor electrode in a platinum electrolytic bath. Further, the method includes performing an electrodeposition process by sequentially applying a pulsed signal to the sensor electrode and applying a non-pulsed continuous signal to the sensor electrode to form a platinum deposit on the sensor electrode.

At least one substrate part for is provided for coating. A first deposition is provided on the at least one support part as microstructuring of at least one first substance selected from the group consisting of rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold, tin, zinc, copper, cobalt, lead, nickel and alloys comprising these, from at least one first compound which provides the at least one first substance. A second deposition is provided on the at least one support part as a nano-structuring of at least one second substance chosen from a group comprising rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold and/or alloys thereof, of at least one second compound which provides the at least one second substance, in a solution.

At least one substrate part for is provided for coating. A first deposition is provided on the at least one support part as microstructuring of at least one first substance selected from the group consisting of rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold, tin, zinc, copper, cobalt, lead, nickel and alloys comprising these, from at least one first compound which provides the at least one first substance. A second deposition is provided on the at least one support part as a nano-structuring of at least one second substance chosen from a group comprising rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold and/or alloys thereof, of at least one second compound which provides the at least one second substance, in a solution.

Aqueous electroplating solution for alkaline electroplating, comprising: [M(NH.sub.3).sub.4].sup.2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. The invention also relates to an electroplating bath comprising the electroplating solution, and a method of forming a metal layer on a substrate by electroplating using the electroplating solution.