A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.

An electrolyte solution for iron-tungsten plating is prepared by dissolving in an aqueous medium a divalent iron salt (e.g., iron (II) sulfate) and an alkali metal citrate (e.g., sodium citrate, potassium citrate, or other alkali metal citrate) to form a first solution, dissolving in the first solution a tungstate salt (e.g., sodium tungstate, potassium tungstate, or other potassium tungstate) to form a second solution, and dissolving in the second solution a citric acid to form the electrolyte solution. An iron-tungsten coating is formed on a substrate using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit iron and tungsten on the substrate.

A metal plate includes a surface including a longitudinal direction of the metal plate and a width direction orthogonal to the longitudinal direction. A surface reflectance by regular reflection of a light is 8% or more and 25% or less. The surface reflectance is measured when the light is incident on the surface at an angle of 45°±0.2°. The light is in at least one plane orthogonal to the surface.

A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.

The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.

It is an object of the present invention to provide an electrolytic iron foil and a battery current collector in which the risk of breakage or tearing during manufacture caused by reduction in film thickness can be suppressed and which have thinness as well as strength and elongation sufficient for withstanding repeated charging and discharging in a secondary battery.

An electrolytic iron foil in which, in at least either one surface, a crystallite diameter on (110) plane of iron is equal to or more than 45 nm and the electrolytic iron foil is less than 20 μm in thickness.

The invention provides a process for preparing an electrode, comprising: electrodeposition of metallic ruthenium/ruthenium oxide (Ru.sup.(0)/RuO.sub.2) coating onto a progressively etched nickel surface; and partial electrochemical oxidation of said metallic ruthenium to ruthenium oxide. The electrode produced and a pseudo-capacitor based on the electrode are also disclosed.

An electroplating method for enhancing the performance of rolled-up passive components comprises providing an array of rolled-up passive components on a substrate, where each rolled-up passive component comprises a multilayer strip in a rolled configuration including multiple turns spaced apart by gaps. The multilayer strip comprises a conductive pattern layer on a strain-relieved layer, and a core of each rolled-up passive component is defined by a first of the multiple turns. A layer comprising a functional material is electroplated onto the conductive pattern layer of each rolled-up passive component, thereby at least partly filling the gaps and/or the core with the functional material.

Electrolyte solutions for electrodeposition of zinc alloys and methods of electrodepositing zinc-iron alloys. An electrolyte solution for electroplating can include an alkali metal hydroxide, a zinc salt, a condensation polymer of epichlorohydrin, a quaternary amine, an aliphatic amine, a polyhydroxy alcohol, an aromatic organic acid and/or salts thereof, an amino alcohol, a bisphosphonic acid and/or salts thereof, an iron salt, an alkali metal gluconate, and an amine-based chelating agent. Electrodepositing zinc alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising an alkali metal hydroxide, a zinc salt, a condensation polymer of epichlorohydrin, a quaternary amine, an aliphatic amine, a polyhydroxy alcohol, an aromatic organic acid and/or salts thereof, an amino alcohol, a bisphosphonic acid and/or salts thereof, an iron salt, an alkali metal gluconate, and an amine-based chelating agent.

A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.