Articles including a multi-layer electrical contact and methods for applying the contact to a substrate are described herein. The article may include a substrate on which the multi-layer electrical contact is formed. In some embodiments, the electrical contact includes multiple metallic layers.

An electrical circuit, for example a printed circuit, for producing a module for integration into a card such as a chip card. This module includes electrical contact or connector which includes lands for the connection and communication of the chip with a read/write system. To give them a white color, or a color close to white, these electrical contact lands are at least partially covered with a layer of a rhodium alloy. The invention also relates to a method for manufacturing such an electrical circuit.

A filtration filter according to the present invention includes a surface layer composed mainly of Pd, a base material inside the surface layer and composed mainly of a PdNi alloy, and an intermediate layer between the surface layer and the base material, wherein the intermediate layer is composed mainly of a PdNi alloy in which a Pd:Ni ratio changes from a surface layer side toward a base material side.

Systems, methods, and devices related to hollow metallic objects are disclosed. A solid sacrificial material is formed in a desired three-dimensional shape, and a precursor is deposited about an exterior surface of the solid sacrificial material. The precursor is used to deposit a first conductor about the exterior surface of the solid sacrificial material, and the solid sacrificial material is then removed. The first conductor assumes the three-dimensional shape, and is substantially hollow after removing the solid sacrificial material. Contemplated hollow metallic objects include waveguides, heat pipes, and vapor chambers.

A photo-resist (21) is applied in a pattern or vertical columns having the dimensions of holes or pores of the aperture plate to be produced. This mask pattern provides the apertures which define the aerosol particle size, having up to 2500 holes per square mm. There is electro-deposition of metal (22) into the spaces around the columns (21). There is further application of a second photo-resist mask (25) of much larger (wider and taller) columns, encompassing the area of a number of first columns (21). The hole diameter in the second plating layer is chosen according to a desired flow rate.

A physiological characteristic sensor, a method for forming a physiological characteristic sensor, and a method for forming a platinum deposit having a rough surface are presented here. The method for forming a physiological characteristic sensor includes immersing a sensor electrode in a platinum electrolytic bath. Further, the method includes performing an electrodeposition process by sequentially applying a pulsed signal to the sensor electrode, wherein the pulsed signal includes a repeated cycle of a first current and a second current different from the first current, and applying a non-pulsed continuous signal to the sensor electrode, wherein the non-pulsed continuous signal includes a non-repeated application of a third current, to form a platinum deposit on the sensor electrode.

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

The present application relates to systems and methods for forming catalysts for use in fuel cells, other energy storage/generation devices, and other applications where catalysts may be used. In embodiments, a catalyst comprising one or more metallic glass structures may be formed by disposing a porous mold in a plating bath comprising one or more dissolved metal salts. An electrodeposition process may be initiated by applying current to the plating bath, where the electrodeposition process forms the one or more metallic glass structures within pores of the porous mold. One or more sensors may be used to monitor one or more properties of the electrodeposition process during the application of the current to the plating bath, and the one or more properties of the electrode-position process may be controlled, based on the monitoring of the one or more parameters, to adjust one or more characteristics of the metallic glass structures.

An electrical circuit, for example a printed circuit, for producing a module for integration into a card such as a chip card. This module includes electrical contact or connector which includes lands for the connection and communication of the chip with a read/write system. To give them a white color, or a color close to white, these electrical contact lands are at least partially covered with a layer of a rhodium alloy. The invention also relates to a method for manufacturing such an electrical circuit.

A method of regenerating a platinum bath by flow reaction, the method comprising the successive steps of: drawing off fluid from the platinum bath by means of a draw-off flow; complexing platinum by mixing together the draw-off flow and a regeneration solution flow containing platinum, mixing taking place in an intensified reactor; and feeding the platinum bath with the mixture resulting from the platinum complexing step, by means of a regenerated bath flow; all of these steps being performed as a continuous flow.