An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of SnAg alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

A corrosion-resistant terminal material has a substrate made of copper or a copper alloy and a film layered on the substrate. The film has a planned core wire contact part with which a core wire of an electric wire is in contact when the material is formed to a terminal and a planned contact part. The film formed in the planned core wire contact part has a tin layer made of tin or tin alloy and a metallic zinc layer formed on the tin layer; the film formed in the planned contact part has a tin layer made of tin or tin alloy but does not have a metallic zinc layer. A corrosion-resistant terminal uses the corrosion-resistant terminal material described herein.

A tin alloy plating solution includes a soluble tin salt, a soluble salt of a metal more noble than tin, and a sulfide compound represented by General Formula (1). In the General Formula (1), (A) is a hydrocarbon group including no oxygen atom and having 1 to 2 carbon atoms, or (A) is a hydrocarbon group including one or more oxygen atoms and having 2 to 6 carbon atoms. The metal which is more noble than tin is preferably silver, copper, gold or bismuth.

A tin alloy plating solution includes a soluble tin salt, a soluble salt of a metal more noble than tin, and a sulfide compound represented by General Formula (1). In the General Formula (1), (A) is a hydrocarbon group including no oxygen atom and having 1 to 2 carbon atoms, or (A) is a hydrocarbon group including one or more oxygen atoms and having 2 to 6 carbon atoms. The metal which is more noble than tin is preferably silver, copper, gold or bismuth.

This tin or tin alloy plating solution includes a soluble salt including at least a stannous salt (A), an acid selected from an organic acid and an inorganic acid or a salt thereof (B), a surfactant (C), benzalacetone (D), and a solvent (E), wherein the plating solution is used to form a pattern in which bump diameters are different from each other on a base material, an amount of the benzalacetone (D) is 0.05 g/L to 0.2 g/L, a mass ratio (C/D) of the surfactant (C) to the benzalacetone (D) is 10 to 200, and a mass ratio (E/D) of the solvent (E) to the benzalacetone (D) is 10 or more.

This tin or tin alloy plating solution includes a soluble salt including at least a stannous salt (A), an acid selected from an organic acid and an inorganic acid or a salt thereof (B), a surfactant (C), benzalacetone (D), and a solvent (E), wherein the plating solution is used to form a pattern in which bump diameters are different from each other on a base material, an amount of the benzalacetone (D) is 0.05 g/L to 0.2 g/L, a mass ratio (C/D) of the surfactant (C) to the benzalacetone (D) is 10 to 200, and a mass ratio (E/D) of the solvent (E) to the benzalacetone (D) is 10 or more.

This tin or tin alloy plating solution includes a soluble salt including at least a stannous salt (A), an acid selected from an organic acid and an inorganic acid or a salt thereof (B), a surfactant (C), benzalacetone (D), and a solvent (E), wherein the plating solution is used to form a pattern in which bump diameters are different from each other on a base material, an amount of the benzalacetone (D) is 0.05 g/L to 0.2 g/L, a mass ratio (C/D) of the surfactant (C) to the benzalacetone (D) is 10 to 200, and a mass ratio (E/D) of the solvent (E) to the benzalacetone (D) is 10 or more.

This tin or tin alloy plating solution includes a soluble salt including at least a stannous salt (A), an acid selected from an organic acid and an inorganic acid or a salt thereof (B), a surfactant (C), benzalacetone (D), and a solvent (E), wherein the plating solution is used to form a pattern in which bump diameters are different from each other on a base material, an amount of the benzalacetone (D) is 0.05 g/L to 0.2 g/L, a mass ratio (C/D) of the surfactant (C) to the benzalacetone (D) is 10 to 200, and a mass ratio (E/D) of the solvent (E) to the benzalacetone (D) is 10 or more.

An aqueous composition comprising (a) metal ions comprising tin ions and silver ions and (b) at least one complexing agent of formula (C1) R.sup.1X.sup.1SX.sup.21[D.sup.1-X.sup.22].sub.nSX.sup.3R.sup.2, (C2) R.sup.1X.sup.1SX.sup.31-D.sup.2-[X.sup.32S].sub.nX.sup.3R.sup.2, (C3) R.sup.3X.sup.1SX.sup.41-[D.sup.3X.sup.42].sub.nSX.sup.3R.sup.4 wherein X.sup.1, X.sup.3 are independently selected from a linear or branched C.sub.1-C.sub.12 alkanediyl, which may be unsubstituted or substituted by OH; X.sup.21, X.sup.22 are independently selected from X.sup.1, which may be further substituted by X.sup.5COOR.sup.12, X.sup.5SO.sub.2OR.sup.12, a C.sub.2 to C.sub.6 polyoxyalkylene group of formula (OCH.sub.2CHR.sup.11).sub.zOH, or a combination thereof, and X.sup.1NHCOX.sup.6CONHX.sup.1; X.sup.31, X.sup.32 are independently selected from a chemical bond and X.sup.1; X.sup.41, X.sup.42 are independently selected from X.sup.1; X.sup.5 is a linear or branched Ci to C10 alkyl; X.sup.6 is selected from X.sup.1 and a divalent 5 or 6 membered aromatic group; R.sup.1, R.sup.2 are independently selected from a monovalent 5 or 6 membered aromatic N-heterocyclic group comprising one N atom or two N atoms which are separated by at least one C atom, and its derivatives received by N-alkylation with a C.sub.1-C.sub.6-alkyl group, which may be substituted by COOR.sup.12 or SO.sub.2OR.sup.12, and which aromatic N-heterocyclic group may optionally further comprise, under the proviso that X21 is substituted by at least one OH, one S atom; R.sup.3, R.sup.4 are independently selected from a monovalent 5 or 6 membered aliphatic N-heterocyclic group comprising one N atom and one O atom; D.sup.1 is independently selected from S, O and NR.sup.10; D.sup.2 is (a) a divalent 5 or 6 membered aliphatic heterocyclic ring system comprising 1 or 2 S atoms, or (b) a 5 or 6 membered aromatic heterocyclic ring system comprising at least two N atoms and optionally one or two S atoms; D.sup.3 is independently selected from S and NR.sup.10; n is an integer of from 0 to 5; z is an integer from 1 to 50; R.sup.10 is selected from H and a linear or branched C.sub.1-C.sub.12 alkyl; R.sup.11 is selected from H and a linear or branched C.sub.1 to C.sub.6 alkyl; and R.sup.12 is selected from R10 and a cation.

A method of providing spatial diversity for critical data delivery in a beamformed mmWave small cell is proposed. The proposed spatial diversity scheme offers duplicate or incremental data/signal transmission and reception by using multiple different beams for the same source and destination. The proposed spatial diversity scheme can be combined with other diversity schemes in time, frequency, and code, etc. for the same purpose. In addition, the proposed spatial diversity scheme combines the physical-layer resources associated with the beams with other resources of the same or different protocol layers. By spatial signaling repetition to avoid Radio Link Failure (RLF) and Handover Failure (HOF), mobility robustness can be enhanced. Mission-critical and/or time-critical data delivery can also be achieved without relying on retransmission.