The present invention provides a cyanide-based silver alloy electroplating solution characterized by containing 10 to 100 g/L of silver cyanide complex in terms of silver, 5 to 300 g/L of electroconductive salt, 0.1 to 10 g/L of germanium compound in terms of germanium, and 1 to 100 g/L of a coordinating polymer additive.

The present invention provides a cyanide-based silver alloy electroplating solution characterized by containing 10 to 100 g/L of silver cyanide complex in terms of silver, 5 to 300 g/L of electroconductive salt, 0.1 to 10 g/L of germanium compound in terms of germanium, and 1 to 100 g/L of a coordinating polymer additive.

Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 μm to 20 μm inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.

Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.

Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.

The present invention provides electrodes comprising a core substrate, and internal layer coating, and an external layer coating and processes to prepare such electrodes.

Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

The present invention relates to a method for CO.sub.2 electroreduction to syngas, a mixture of carbon monoxide (CO) and hydrogen (H.sub.2), using a cathode comprising an electrically conductive support of which at least a part of the surface is covered by a metal deposit of zinc and of a second metal selected from copper, gold and mixtures thereof, and being preferably copper, said metal deposit comprising at least 1 wt % of one or several phases of an alloy of zinc and of the second metal.

The present invention relates also to an electrode useful for performing this method, a process for preparing such an electrode and an electrolysis device comprising such an electrode.

To provide a method of manufacturing a connector terminal material and a terminal for a connector to improve wear resistance and heat resistance. A connector terminal material of the present invention is provided with a base material in which at least a surface layer is made of copper or copper alloy and a silver-nickel alloy layer covering at least a part of a surface of the base material and having a film thickness of 0.5 μm or more and 50 μm or less; and nickel content of the silver-nickel alloy layer is 0.05 at % or more and 2.0 at % or less. Between the base material and the silver-nickel alloy layer, a nickel layer made of nickel or nickel alloy is provided; and a film thickness of the nickel layer is preferably 0.5 μm or more and 5 μm or less.