C25D5/14

Fabrication method for a multi-layer substrate

A method for fabricating a substrate provided with a plurality of layers, includes: providing a steel substrate with an oxide layer including metal oxides on the steel substrate; providing a metal coating layer directly on the oxide layer, the metal coating layer including: at least 8% by weight nickel; at least 10% by weight chromium; and a remainder being iron and impurities from a fabrication process; and providing an anti-corrosion coating layer directly on the metal coating layer.

ROUGHENED NICKEL-PLATED MATERIAL AND METHOD FOR MANUFACTURING SAME

[Object]

To provide a roughened nickel-plated material in which the formation unevenness such as generation of the unevenness or grooves in a roughened nickel plated layer is restrained.

[Solving Means]

A roughened nickel-plated material including a base material that is a rolled material, and a roughened nickel plated layer formed on at least one surface of the base material, in which SRzjis of the surface of the roughened nickel plated layer is equal to or more than 2 μm, and, letting a maximum height of the roughened nickel plated layer be SRz, a valley region B in a given virtual planer region A as observed at a height position of SRz×0.25 satisfies the following (i). (i) The length of the valley region B in the rolling direction RD of the base material is less than 40 μm in a direct distance.

Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus

To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus

To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

MICROPOROUS PLATING SOLUTION AND METHOD OF USING THIS PLATING SOLUTION TO PERFORM MICROPOROUS PLATING ON OBJECT TO BE PLATED
20220213606 · 2022-07-07 · ·

A microporous plating solution characterized by containing nonconductive particles and polyaluminum chloride allows for easy preparation of positively charged nonconductive particles and is highly stable. Then, a method for performing microporous plating on an object to be plated, characterized by plating the object to be plated in the microporous plating solution results in a favorable number of micropores in the plating.

Surface treated copper foil, copper clad laminate, and printed circuit board

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni concentration of 0.1 to 15.0 atm % based on the total amount of elements of C, N, O, Zn, Cr, Ni, Co, Si, and Cu, in an XPS depth profile obtained by performing sputtering at a sputtering rate of 2.5 nm/min (in terms of SiO.sub.2) for 1 minute. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

Surface treated copper foil, copper clad laminate, and printed circuit board

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a Ni deposited amount of 20 to 200 μg/dm.sup.2 and a Zn deposited amount of 20 to 1,000 μg/dm.sup.2. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

HOT STAMPED BODY

The present invention relates to a hot stamped body comprising a steel sheet and a plating layer formed on at least one surface of the steel sheet, wherein the plating layer is comprised of a. ZnO region present on a surface side of the plating layer and having an oxygen concentration of 10 mass % or more and an Ni—Fe—Zn alloy region present on a steel sheet side of the plating layer and having an oxygen concentration of less than 10 mass %, and an average concentration of a total of Fe, Mn and Si in the ZnO region is more than 0 mass % and less than 5 mass %.

Object comprising a chromium-based coating on a substrate
11408088 · 2022-08-09 · ·

An object including a chromium-based coating on a substrate and a method for its production are disclosed. The chromium-based coating having a first layer on the substrate, wherein the first layer has a top surface on the opposite side to the substrate and includes fissures within the first layer, and wherein the material of the first layer is predominantly formed of chromium and chromium carbide; the chromium-based coating further having a second layer on the first layer, the second layer at least partially filling the fissures in the first layer and at least partially covers the top surface of the first layer, wherein the material of the second layer is selected from a group consisting of: chromium oxide, carbon, and a combination of chromium oxide and carbon.

Object comprising a chromium-based coating on a substrate
11408088 · 2022-08-09 · ·

An object including a chromium-based coating on a substrate and a method for its production are disclosed. The chromium-based coating having a first layer on the substrate, wherein the first layer has a top surface on the opposite side to the substrate and includes fissures within the first layer, and wherein the material of the first layer is predominantly formed of chromium and chromium carbide; the chromium-based coating further having a second layer on the first layer, the second layer at least partially filling the fissures in the first layer and at least partially covers the top surface of the first layer, wherein the material of the second layer is selected from a group consisting of: chromium oxide, carbon, and a combination of chromium oxide and carbon.