A combined oil control ring comprising a pair of annular side rails each having a gap, and an axially corrugated spacer expander arranged between the side rails; the corrugated spacer expander having on the inside seating tabs for pushing inner peripheral surfaces of the side rails; the side-rail-pushing surface of each seating tab being provided with a nitrided layer; an entire surface of each spacer expander except for those provided with the nitrided layer being coated with a plating film; and the plating film having Vickers hardness HV0.01 of 300 or less.

A lithium ion secondary battery is provided. The lithium ion secondary battery includes an electrolytic tank having an accommodating space, a positive electrode disposed in the accommodating space, a negative electrode disposed in the accommodating space and spaced apart from the positive electrode, and an isolation film disposed between the positive electrode and the negative electrode. In the X-ray diffraction spectrum of a first surface of the electrolytic copper foil, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the first surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the first surface is between 0.5 and 2.0. A ratio of the diffraction peak intensity I(200) of the (200) crystal face of a second surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the second surface is between 0.5 and 2.0.

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.

The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm.sup.2 of Ni and said Cr layer containing 10-100 μg/dm.sup.2 of Cr is provided.

The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm.sup.2 of Ni and said Cr layer containing 10-100 μg/dm.sup.2 of Cr is provided.

The present invention relates to a galvanic process additivated with nanotechnology, wherein silver nanoparticles are added to the composition of a galvanic bath (10b), capable of forming a nickel layer (101), onto which a chrome layer (102) is deposited to form a material with antibacterial properties, which may be applied in manufacturing the most varied devices or materials.

The present invention relates to a galvanic process additivated with nanotechnology, wherein silver nanoparticles are added to the composition of a galvanic bath (10b), capable of forming a nickel layer (101), onto which a chrome layer (102) is deposited to form a material with antibacterial properties, which may be applied in manufacturing the most varied devices or materials.

A partially plated plastic product includes a first base member and a second base member that are made of different plastic materials. The first base member includes a first corner portion having a curved wall surface. The second base member includes a second corner portion. The first and second corner portions are located on a front side of the product. The first and second base members are adjacent to each other at least at the first corner portion and the second corner portion. Only one of the first and second base members includes a metal coating film formed on a region of an outer surface of the base member with which the other base member is not in contact. The second corner portion includes a groove forming portion. The groove forming portion forms a groove between itself and at least the curved wall surface of the first corner portion.

A partially plated plastic product includes a first base member and a second base member that are made of different plastic materials. The first base member includes a first corner portion having a curved wall surface. The second base member includes a second corner portion. The first and second corner portions are located on a front side of the product. The first and second base members are adjacent to each other at least at the first corner portion and the second corner portion. Only one of the first and second base members includes a metal coating film formed on a region of an outer surface of the base member with which the other base member is not in contact. The second corner portion includes a groove forming portion. The groove forming portion forms a groove between itself and at least the curved wall surface of the first corner portion.

Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings.