Method and apparatus for reducing metal oxide surfaces to modified metal surfaces and cooling the metal surfaces are disclosed. By exposing a metal oxide surface to remote plasma, the metal oxide surface on a substrate can be reduced to pure metal. A remote plasma apparatus can treat the metal oxide surface as well as actively cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus can be configured to actively cool the substrate during and/or after reducing the metal oxide to pure metal using an active cooling system. The active cooling system can include one or more of an actively cooled pedestal, an actively cooled showerhead, and one or more cooling gas inlets for delivering cooling gas to cool the substrate.

Method and apparatus for reducing metal oxide surfaces to modified metal surfaces and cooling the metal surfaces are disclosed. By exposing a metal oxide surface to remote plasma, the metal oxide surface on a substrate can be reduced to pure metal. A remote plasma apparatus can treat the metal oxide surface as well as actively cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus can be configured to actively cool the substrate during and/or after reducing the metal oxide to pure metal using an active cooling system. The active cooling system can include one or more of an actively cooled pedestal, an actively cooled showerhead, and one or more cooling gas inlets for delivering cooling gas to cool the substrate.

An electroplating apparatus includes a container containing plural portions and an ionic liquid plating solution that is capable of flowing therebetween. The plural portions include at least a first portion containing a counter electrode that includes coating donor material and a second portion that includes a workpiece. A porous scrubber separating the first and second portions has a plurality of metallic outer surfaces in contact with the ionic liquid plating solution. Coating, repair, and regeneration methods using an ionic liquid plating solution are also described.

An electroplating apparatus includes a container containing plural portions and an ionic liquid plating solution that is capable of flowing therebetween. The plural portions include at least a first portion containing a counter electrode that includes coating donor material and a second portion that includes a workpiece. A porous scrubber separating the first and second portions has a plurality of metallic outer surfaces in contact with the ionic liquid plating solution. Coating, repair, and regeneration methods using an ionic liquid plating solution are also described.

An arrangement comprising a component (203) adjacent to a ceramic matrix composite in a gas turbine engine is shown. The component comprises a nickel-base superalloy substrate (301) and a cobalt-modified beta-nickel-aluminide coating (302) on the substrate to prevent interdiffusion between the substrate and the ceramic matrix composite. The substrate is coated by depositing a cobalt layer on the substrate, depositing an aluminium layer on the cobalt layer and then forming a cobalt-modified beta nickel aluminide coating.

An arrangement comprising a component (203) adjacent to a ceramic matrix composite in a gas turbine engine is shown. The component comprises a nickel-base superalloy substrate (301) and a cobalt-modified beta-nickel-aluminide coating (302) on the substrate to prevent interdiffusion between the substrate and the ceramic matrix composite. The substrate is coated by depositing a cobalt layer on the substrate, depositing an aluminium layer on the cobalt layer and then forming a cobalt-modified beta nickel aluminide coating.

The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps

i. providing a substrate having at least one metal or metal alloy surface; ii. depositing a first indium or indium alloy layer on at least one portion of said surface whereby a composed phase layer is formed of a part of the metal or metal alloy surface and a part of the first indium or indium alloy layer; iii. removing partially or wholly the part of the first indium or indium alloy layer which has not been formed into the composed phase layer; iv. depositing a second indium or indium alloy layer on the at least one portion of the surface obtained in step iii.
v.

The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps

i. providing a substrate having at least one metal or metal alloy surface; ii. depositing a first indium or indium alloy layer on at least one portion of said surface whereby a composed phase layer is formed of a part of the metal or metal alloy surface and a part of the first indium or indium alloy layer; iii. removing partially or wholly the part of the first indium or indium alloy layer which has not been formed into the composed phase layer; iv. depositing a second indium or indium alloy layer on the at least one portion of the surface obtained in step iii.
v.

A steel sheet for a container includes a steel sheet, a Sn coated layer which is provided as an upper layer of the steel sheet and contains Sn in an amount of 560 to 5600 mg/m.sup.2 in terms of Sn metal, and a chemical treatment layer which is provided as an upper layer of the Sn coated layer and contains a Zr compound in an amount of 3.0 to 30.0 mg/m.sup.2 in terms of Zr metal and a Mg compound in an amount of 0.50 to 5.00 mg/m.sup.2 in terms of Mg metal.

Systems and methods using engineered nanofiltration layers to facilitate acceleration of palladium nanowire hydrogen sensors. The sensors include a metal-organic framework (MOF) assembled on palladium (Pd) nanowires (NWs) for highly selective and ultra-fast H2 molecule detection.