Systems and methods using engineered nanofiltration layers to facilitate acceleration of palladium nanowire hydrogen sensors. The sensors include a metal-organic framework (MOF) assembled on palladium (Pd) nanowires (NWs) for highly selective and ultra-fast H2 molecule detection.

Provided is a wire having a core wire and a coating layer positioned on the outer periphery of the core wire, wherein the core wire consists essentially of aluminum or an aluminum alloy; the coating layer consists essentially of nickel or a nickel alloy; on the core wire, an area ratio of portions not being coated with the coating layer is lower than 0.01%; the wire further has a first element; and the first element is at least one selected from the group consisting of iron, magnesium, silicon, copper, zinc, nickel, manganese, silver, chromium and zirconium.

A method for repairing a blade wherein the blade comprises a metallic substrate shaped to define an airfoil having a tip. A coating is on the tip. The method comprises: machining to at least partially remove the coating; plating a nickel-based base layer; and plating an abrasive layer comprising a nickel-based matrix and an abrasive.

A method for repairing a blade wherein the blade comprises a metallic substrate shaped to define an airfoil having a tip. A coating is on the tip. The method comprises: machining to at least partially remove the coating; plating a nickel-based base layer; and plating an abrasive layer comprising a nickel-based matrix and an abrasive.

A gold-plating etching process for 5G high-frequency signal boards is carried out according to the following steps: the outer dry film, the plug gold-plating, the film removing, and the alkaline etching The alkaline etching solution comprises 100 to 150 g/L. of cupric chloride, 90 to 120 g/L of ammonium chloride, and ammonia. The pH value is 9.6 to 9.8. The ratio of the ammonia and the alkaline etching solution is (550-800):1000. The present invention provides a gold-plating etching process of 5G high-frequency signal boards. The alkaline etching procedure is performed right after gold-plating, eliminating the outer etching process after gold-plating. Costs of the outer film pressing, the exposure, and the development can be saved. The flow rate is improved. Requirements of 5G communication circuit boards are satisfied. That is, the transmission speed of 5G communication high-frequency signal boards of the present invention is fast.

A roughened plated sheet including a roughened plated layer having a roughened nickel plated layer and a zinc plated layer formed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness RZ.sub.jis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 m or more, an adhesion amount of the roughened nickel plated layer is 0.4 to 14.0 g/m.sup.2, and an adhesion amount of the zinc plated layer is 3 g/m.sup.2 or more.

A steel sheet for a container includes: a steel sheet; a coated layer which contains Ni and is provided as an upper layer of the steel sheet; and a chemical treatment layer which is provided as an upper layer of the coated layer, and contains a Zr compound in an amount of 3.0 to 30.0 mg/m.sup.2 in terms of Zr metal, and a Mg compound in an amount of 0.50 to 5.00 mg/m.sup.2 in terms of Mg metal, in which the coated layer is one of the group consisting of a Ni coated layer which contains Ni in amount of 10 to 1000 mg/m.sup.2 in terms of Ni metal, and a composite coated layer which contains Ni in an amount of 5 to 150 mg/m.sup.2 in terms of Ni metal and Sn in an amount of 300 to 3000 mg/m.sup.2 in terms of Sn metal, and has an island-shaped Sn coated layer formed on an FeNiSn alloy layer.

A system, method, and apparatus for a co-bonded electroformed abrasion strip are disclosed. A disclosed method for making a unitary abrasion strip for a fluid dynamic surface includes manufacturing or identifying a first metallic section having an overlap region on a first end of the first metallic section. The method further includes manufacturing or identifying an overlap region disposed on the first end of the first metallic section by preparing the first end of the first metallic section. Also, the method includes creating a second metallic section onto the overlap region on the first end of the first metallic section by performing a first electro-deposition process on the first end of the first metallic section; where the first metallic section, the overlap region, and the second metallic section together form a unitary, inseparable abrasion strip for a fluid dynamic surface.

A system, method, and apparatus for a co-bonded electroformed abrasion strip are disclosed. A disclosed method for making a unitary abrasion strip for a fluid dynamic surface includes manufacturing or identifying a first metallic section having an overlap region on a first end of the first metallic section. The method further includes manufacturing or identifying an overlap region disposed on the first end of the first metallic section by preparing the first end of the first metallic section. Also, the method includes creating a second metallic section onto the overlap region on the first end of the first metallic section by performing a first electro-deposition process on the first end of the first metallic section; where the first metallic section, the overlap region, and the second metallic section together form a unitary, inseparable abrasion strip for a fluid dynamic surface.

Method and apparatus for reducing metal oxide surfaces to modified metal surfaces are disclosed. By exposing a metal oxide surface to a remote plasma, the metal oxide surface on a substrate can be reduced to pure metal and the metal reflowed. A remote plasma apparatus can treat the metal oxide surface as well as cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus includes a processing chamber and a controller configured to provide a substrate having a metal seed layer in a processing chamber, form a remote plasma of a reducing gas species where the remote plasma includes radicals, ions, and/or ultraviolet (UV) radiation from the reducing gas species, and expose a metal seed layer of the substrate to the remote plasma to reduce oxide of the metal seed layer to metal and to reflow the metal.