C25D5/44

SACRIFICIAL COATING AND PROCEDURE FOR ELECTROPLATING ALUMINUM ON ALUMINUM ALLOYS
20180327923 · 2018-11-15 ·

A method of applying a protective coating with improved adhesion on an aluminum alloy component includes first pretreating the surface of a component by depositing a sacrificial protective immersion layer using a zincating or similar process. Portions of the protective immersion layer as well as portions of the underlying aluminum alloy substrate are then electrolytically etched off in an ionic liquid. A protective aluminum coating is then electrodeposited on the component in an ionic liquid.

Method of manufacturing an electrode for an energy storage device

An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.

Method of manufacturing an electrode for an energy storage device

An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.

Heat dissipation substrate and method for producing heat dissipation substrate
10115655 · 2018-10-30 · ·

A heat dissipation substrate having a metallic layer with few defects on its surface is obtained by a process including the steps of: forming a metallic layer by plating on the surface of an alloy composite mainly composed of a powder of a principal metal, additional metal and diamond; and heating and pressurizing alloy composite coated with metallic layer, at a temperature equal to or lower than melting points of the metallic layer and the alloy composite. Consequently a heat dissipation substrate is obtained which has a coefficient of linear expansion of 6.5 ppm/K or higher and 15 ppm/K or lower as well as a degree of thermal conductivity of 420 W/m.Math.K or higher, the substrate having a metallic layer with few defects in its surface layer and thereby allowing for a Ni-based plating on which the void percentage in the solder joint will be 5% or lower.

Heat dissipation substrate and method for producing heat dissipation substrate
10115655 · 2018-10-30 · ·

A heat dissipation substrate having a metallic layer with few defects on its surface is obtained by a process including the steps of: forming a metallic layer by plating on the surface of an alloy composite mainly composed of a powder of a principal metal, additional metal and diamond; and heating and pressurizing alloy composite coated with metallic layer, at a temperature equal to or lower than melting points of the metallic layer and the alloy composite. Consequently a heat dissipation substrate is obtained which has a coefficient of linear expansion of 6.5 ppm/K or higher and 15 ppm/K or lower as well as a degree of thermal conductivity of 420 W/m.Math.K or higher, the substrate having a metallic layer with few defects in its surface layer and thereby allowing for a Ni-based plating on which the void percentage in the solder joint will be 5% or lower.

Coated stainless steel member

The present invention provides a method for producing a coated stainless steel member, comprising: performing Wood's strike nickel plating on a stainless steel substrate, and then performing cationic electrodeposition on a formed Wood's strike nickel plating layer.

Method for the electroplating of TiAl alloys
10081877 · 2018-09-25 · ·

The present invention relates to a method for the coating of a surface of a TiAl alloy, in which at least one layer is electroplated on the surface of the TiAl alloy, wherein the surface of the TiAl alloy is subjected to an at least two-step surface treatment for the formation of a roughened surface, this treatment comprising at least one electrochemical processing and at least one electroless chemical processing.

Method for the electroplating of TiAl alloys
10081877 · 2018-09-25 · ·

The present invention relates to a method for the coating of a surface of a TiAl alloy, in which at least one layer is electroplated on the surface of the TiAl alloy, wherein the surface of the TiAl alloy is subjected to an at least two-step surface treatment for the formation of a roughened surface, this treatment comprising at least one electrochemical processing and at least one electroless chemical processing.

Electrochemical Devices with Current Collector Having an Increased Resistance to Corrosion
20180266003 · 2018-09-20 ·

Electrochemical device or photo-electrochemical device comprising an electrolyte containing a bistriflimide anion, hereafter named as TFSI, at least two electrodes, each of these electrodes being in contact with a current collector comprising a metal support characterized in that at least one electrode has a current collector the metal support of which comprises an electro-active surface which is functionalized with linear or branched fluorinated carbon chains, such as perfluoroalkyl chains, in the form of a molecular layer which improves the corrosion resistance of said functionalized surface compared to a non-functionalized surface, wherein not impairing the passage of electrons between said electrode and its current collector, the functionalized surface being at the interface between said electrode and its current collector.

Electrochemical Devices with Current Collector Having an Increased Resistance to Corrosion
20180266003 · 2018-09-20 ·

Electrochemical device or photo-electrochemical device comprising an electrolyte containing a bistriflimide anion, hereafter named as TFSI, at least two electrodes, each of these electrodes being in contact with a current collector comprising a metal support characterized in that at least one electrode has a current collector the metal support of which comprises an electro-active surface which is functionalized with linear or branched fluorinated carbon chains, such as perfluoroalkyl chains, in the form of a molecular layer which improves the corrosion resistance of said functionalized surface compared to a non-functionalized surface, wherein not impairing the passage of electrons between said electrode and its current collector, the functionalized surface being at the interface between said electrode and its current collector.